Abstract: A substrate layered structure including a first circuit board; a second circuit board overlapping the first circuit board; and interposer blocks interposed between the first circuit board and the second circuit board and spaced apart from each other. Further, each corresponding interposer block includes a dielectric block body; a plurality of signal via holes passing through the dielectric block body and transferring signals between the first circuit board and the second circuit board; and a plurality of signal pads arranged at first ends of the signal via holes and connected to the first circuit board and arranged at second ends of the signal via holes and connected to the second circuit board.

Abstract: A substrate layered structure including a first circuit board; a second circuit board overlapping the first circuit board; and interposer blocks interposed between the first circuit board and the second circuit board and spaced apart from each other. Further, each corresponding interposer block includes a dielectric block body; a plurality of signal via holes passing through the dielectric block body and transferring signals between the first circuit board and the second circuit board; and a plurality of signal pads arranged at first ends of the signal via holes and connected to the first circuit board and arranged at second ends of the signal via holes and connected to the second circuit board.

Abstract: There is disclosed a mobile terminal comprising a printed circuit board, a chipset comprising a die and connected to the printed circuit board through BGA (Ball Grid Array), and a solder pad array provided in a predetermine region of the printed circuit board, corresponding to the BGA, wherein the solder pad array comprises a NSMD array region provided in a region corresponding to the die and having NSMD pads and a SMD array region provided in an outer region of the NSMD array region and having SMD pads, to solve the disadvantages in impact resistance or heat resistance which might be generated in the chipset mounted printed circuit board structure.