Patents by Inventor Kirit R. Shah

Kirit R. Shah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Selective thermal conditioning components on a PCB
    Patent number: 8299393
    Abstract: An embodiment of the invention comprises a method associated with a PCB having a first component, and a second component, that has substantially less thermal mass than the first component. During an initial time period, the PCB and its components are placed at an initial position proximate to a first heat source, which is operable to provide heat energy in accordance with a thermal profile comprising successive phases. After the initial time period, the first heat source is operated during each of the phases in accordance with the thermal profile to selectively apply heat to the PCB and to the plurality of components thereon. During the initial time period or a specified one of the phases, selectively, heat energy from a focused heat source is directed only to the first component, and not to other components.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: October 30, 2012
    Assignee: International Business Machines Corporation
    Inventors: Matthew S. Kelly, Kirit R. Shah, Thomas S. Truman
  • SELECTIVE THERMAL CONDITIONING COMPONENTS ON A PCB
    Publication number: 20120043305
    Abstract: An embodiment of the invention comprises a method associated with a PCB having a first component, and a second component, that has substantially less thermal mass than the first component. During an initial time period, the PCB and its components are placed at an initial position proximate to a first heat source, which is operable to provide heat energy in accordance with a thermal profile comprising successive phases. After the initial time period, the first heat source is operated during each of the phases in accordance with the thermal profile to selectively apply heat to the PCB and to the plurality of components thereon. During the initial time period or a specified one of the phases, selectively, heat energy from a focused heat source is directed only to the first component, and not to other components.
    Type: Application
    Filed: August 17, 2010
    Publication date: February 23, 2012
    Applicant: International Business Machines Corporation
    Inventors: Matthew S. Kelly, Kirit R. Shah, Thomas S. Truman