Abstract: A system and method for measuring process parameters in a process machine is described. The system is synchronized to the operation of the process machine so that spurious process parameters events are filtered out.

Abstract: The present invention is directed to a multiport metering pump that can completely deliver a very small volume of liquid. The multiport metering pump includes a number of ports (or valve units), each of which can be used as either an outlet valve or an inlet valve. The multiport metering pump includes: a central gallery; a displacement unit; multiple valve units; and multiple conduits that respectively connect the displacement unit and the valve units to the central gallery. The displacement unit and the valve units communicate with the central gallery, and any of the valve units can be used as an inlet valve or outlet valve for the liquid delivery.

Abstract: An apparatus and method for selectively etching an encapsulant forming a package of resinous material around an electronic device includes a source of etchant solution and an etching assembly including an etch plate and a movable cover, the etch plate and cover forming an etching chamber. An etch head is supported by the etch plate and the electronic device package is mountable in the chamber on the etch head. In a first mode of operation a displacement pump pumps a first quantity of etchant solution into the etch head and in a second mode of operation the displacement pump agitates at least part of the first quantity of etchant solution repeatedly into and out of an etched cavity formed on an exterior surface of the electronic device package by reaction of the etchant solution with the resinous material. A waste reservoir and a waste outlet extending from the etch head to the reservoir is also provided. The etch head is easily removable from the etch plate by removal of an etch head retainer.

Abstract: An apparatus and method for selectively etching an encapsulant forming a package of resinous material around an electronic device includes a etchant solution source and an etching assembly including an etch plate and a movable cover forming an etching chamber. An etch head is supported by the plate and the device package is mountable in the chamber on the etch head. A first syringe pump pumps a first quantity of etchant into the etch head and a second syringe pump agitates or oscillates at least part of the first quantity of etchant repeatedly into and out of an etched cavity formed on the package exterior surface by reaction of the etchant solution with the resinous material. A waste outlet and reservoir extends from the etch head. The etch head is attached to an alumina ceramic heat exchanger including a spirally grooved passageway formed by an inserted core to heat a small volume of etchant immediately prior to introduction of the etchant against the package and subsequent oscillation.