Abstract: Embodiments relate to saving data upon loss of power. An aspect includes sizing a write cache buffer based on parameters related to carrying out this emergency data save procedure. A computer program product for allocating a write cache on a storage controller includes retrieving, at run-time by a processor, one or more operating parameters of a transfer logic used in a power-loss save of the write cache. The one or more operating parameters include an instance-specific process speed of the transfer logic which is retrieved as bin data. A size for the write cache on the storage controller is determined, based on the one or more operating parameters. A write cache, of the determined size, is allocated from a volatile memory coupled to the storage controller.

Abstract: Embodiments relate to saving data upon loss of power. An aspect includes sizing a write cache buffer based on parameters related to carrying out this emergency data save procedure. A computer program product for allocating a write cache on a storage controller includes retrieving, at run-time by a processor, one or more operating parameters of a transfer logic used in a power-loss save of the write cache. The one or more operating parameters include an instance-specific process speed of the transfer logic which is retrieved as bin data. A size for the write cache on the storage controller is determined, based on the one or more operating parameters. A write cache, of the determined size, is allocated from a volatile memory coupled to the storage controller.

Abstract: Embodiments relate to saving data upon loss of power. An aspect includes sizing a write cache buffer based on parameters related to carrying out this emergency data save procedure. A computer implemented method for allocating a write cache on a storage controller includes retrieving, at run-time by a processor, one or more operating parameters of a component used in a power-loss save of the write cache. The component is selected from the group consisting of an energy storage element, a non-volatile memory, and a transfer logic. A size for the write cache on the storage controller is determined, based on the one or more operating parameters. A write cache, of the determined size, is allocated from a volatile memory coupled to the storage controller.

Abstract: Embodiments relate to saving data upon loss of power. An aspect includes sizing a write cache buffer based on parameters related to carrying out this emergency data save procedure. A computer implemented method for allocating a write cache on a storage controller includes retrieving, at run-time by a processor, one or more operating parameters of a component used in a power-loss save of the write cache. The component is selected from the group consisting of an energy storage element, a non-volatile memory, and a transfer logic. A size for the write cache on the storage controller is determined, based on the one or more operating parameters. A write cache, of the determined size, is allocated from a volatile memory coupled to the storage controller.

Abstract: Embodiments relate to saving data upon loss of power. An aspect includes sizing a write cache buffer based on parameters related to carrying out this emergency data save procedure. A computer implemented method for allocating a write cache on a storage controller includes retrieving, at run-time by a processor, one or more operating parameters of a component used in a power-loss save of the write cache. The component is selected from the group consisting of an energy storage element, a non-volatile memory, and a transfer logic. A size for the write cache on the storage controller is determined, based on the one or more operating parameters. A write cache, of the determined size, is allocated from a volatile memory coupled to the storage controller.

Abstract: Embodiments relate to saving data upon loss of power. An aspect includes sizing a write cache buffer based on parameters related to carrying out this emergency data save procedure. A computer implemented method for allocating a write cache on a storage controller includes retrieving, at run-time by a processor, one or more operating parameters of a component used in a power-loss save of the write cache. The component is selected from the group consisting of an energy storage element, a non-volatile memory, and a transfer logic. A size for the write cache on the storage controller is determined, based on the one or more operating parameters. A write cache, of the determined size, is allocated from a volatile memory coupled to the storage controller.

Abstract: Embodiments relate to saving data upon loss of power. An aspect includes sizing a write cache buffer based on parameters related to carrying out this emergency data save procedure. A computer implemented method for allocating a write cache on a storage controller includes retrieving, at run-time by a processor, one or more operating parameters of a component used in a power-loss save of the write cache. The component is selected from the group consisting of an energy storage element, a non-volatile memory, and a transfer logic. A size for the write cache on the storage controller is determined, based on the one or more operating parameters. A write cache, of the determined size, is allocated from a volatile memory coupled to the storage controller.

Abstract: A system and method for providing SDRAM mode register shadowing in a memory system. A system includes a memory interface device adapted for use in a memory system. The memory interface device includes an interface to one or more ranks of memory devices, and each memory device includes one or more types of mode registers. The memory interface device also includes an interface to a memory bus for receiving commands from a memory controller. The commands include a mode register set command specifying a new mode register setting for one or more ranks of memory devices and a mode register type. The memory interface device further includes a mode register shadow module to capture settings applied to the mode registers. The module includes a shadow register for each type of mode register and a shadow log for each type of mode register.

Abstract: A logical design including multiple logical blocks is mapped onto an integrated circuit chip. A chip level floor plan is created on the chip, including temporary areas on the chip set aside for accommodating logical blocks having logical content including timing requirements based on the logical design. The temporary areas are translated into physical cells on the chip with pins assigned for inputs and outputs for the logical blocks. The logical blocks are mapped to the physical cells on the chip in a time sensitive manner using timing assertions to form temporary logical partitions. Blocks on the chip, including the temporary logical partitions, are connected based on the timing assertions. A timing analysis is performed on the chip to determine timing slack associated with each temporary logical partition. A determination is made whether the timing slack is acceptable.

Abstract: A system and method for providing SDRAM mode register shadowing in a memory system. A system includes a memory interface device adapted for use in a memory system. The memory interface device includes an interface to one or more ranks of memory devices, and each memory device includes one or more types of mode registers. The memory interface device also includes an interface to a memory bus for receiving commands from a memory controller. The commands include a mode register set command specifying a new mode register setting for one or more ranks of memory devices and a mode register type. The memory interface device further includes a mode register shadow module to capture settings applied to the mode registers. The module includes a shadow register for each type of mode register and a shadow log for each type of mode register.

Abstract: A synchronous input to output protocol translator supporting multiple reference oscillator frequencies and fixed latency data computation and chip crossing circuits enables implementation of a method for delaying osc2 relative to osc1 in a configurable way to provide a constant, minimal Tptcc over a range of refosc frequencies between circuits for data transferred. It requires that the data transferred from a register R1 be sent over multiple wires via configurable delay circuitry for osc2, capture circuitry at the input to R2, and a circuit to transfer a synchronizing signal from a non-delayed clock domain to a delayed clock domain. Relative to osc1, osc2 is a delayed, synchronous clock.

Abstract: A memory interface device uses a driver impedance adjustment engine with state machine for off chip driver (OCD) calibration which is used to set the driver voltage levels of the DRAM memory module or DIMM of the JEDEC DDR-II standard type. By adjusting the pull-up drive strength and pull-down drive strength, the output voltage levels and the rise times can be optimized to find the minimal signal swing that is still immune to noise, while not degrading the data eye significantly. The state machine finds the optimal setting for the DRAM Driver Impedance, using both DC and AC methods adjusting the value of the driver impedance through a master ASIC, and then sampling the known value sent back from the DRAM. The state machine will stop when the optimal value of the driver impedance is found and automates the process of detecting the optimal driver impedance and configuring the DRAM module or DIMM accordingly.

Abstract: A memory subsystem package has a memory controller interface ASIC (application specific integrated circuit) and a plurality of memory modules. The ASIC has a bi-directional serial protocol i2C communication bus to off chip drivers for monitoring temperature and for adjusting the environment surrounding the package by controlling fans using fan switches and variable voltage controls. In addition there is provided an Alternating Current Built in Self Test (AC BIST) with variable data receiver voltage reference for performing high-speed AC memory subsystem self-test for that ASIC enabling writing of pseudo-random patterns to memory, reading them back and comparing the expected results at hardware speeds. Vref can be made to vary across its allowable range during AC self test to provide improved coverage. The system monitors vddq during normal system operation using an ADC. The system varies Vref as a function of Vddq, using a combination of a DAC and ADC.

Abstract: A memory subsystem package has a memory controller interface ASIC (application specific integrated circuit) and a plurality of memory modules. The ASIC has a bi-directional serial protocol i2C communication bus to off chip drivers for monitoring temperature and for adjusting the environment surrounding the package by controlling fans using fan switches and variable voltage controls. In addition there is provided an Alternating Current Built in Self Test (AC BIST) with variable data receiver voltage reference for performing high-speed AC memory subsystem self-test for that ASIC enabling writing of pseudo-random patterns to memory, reading them back and comparing the expected results at hardware speeds. Vref can be made to vary across its allowable range during AC self test to provide improved coverage. The system monitors Vddq during normal system operation using an ADC. The system varies Vref as a function of Vddq, using a combination of a DAC and ADC.

Abstract: A memory interface device uses a driver impedance adjustment engine with state machine for off chip driver (OCD) calibration which is used to set the driver voltage levels of the DRAM memory module or DIMM of the JEDEC DDR-II standard type. By adjusting the pull-up drive strength and pull-down drive strength, the output voltage levels and the rise times can be optimized to find the minimal signal swing that is still immune to noise, while not degrading the data eye significantly. The state machine finds the optimal setting for the DRAM Driver Impedance, using both DC and AC methods adjusting the value of the driver impedance through a master ASIC, and then sampling the known value sent back from the DRAM. The state machine will stop when the optimal value of the driver impedance is found and automates the process of detecting the optimal driver impedance and configuring the DRAM module or DIMM accordingly.

Abstract: A memory subsystem package has a memory controller interface ASIC (application specific integrated circuit) and a plurality of Memory modules. The ASIC has a bi-directional serial protocol i2C communication bus to off chip drivers for monitoring temperature and for adjusting the environment surrounding the package by controlling fans using fan switches and variable voltage controls. In addition there is provided an Alternating Current Built in Self Test (AC BIST) with variable data receiver voltage reference for performing high-speed AC memory subsystem self-test for that ASIC enabling writing of pseudo-random patterns to memory, reading them back and comparing the expected results at hardware speeds. Vref can be made to vary across its allowable range during AC self test to provide improved coverage. The system monitors Vddq during normal system operation using an ADC. The system varies Vref as a function of Vddq, using a combination of a DAC and ADC.

Abstract: A memory subsystem package has a memory controller interface ASIC (application specific integrated circuit) and a plurality of memory modules. The ASIC has a bi-directional serial protocol i2C communication bus to off chip drivers for monitoring temperature and for adjusting the environment surrounding the package by controlling fans using fan switches and variable voltage controls. In addition there is provided an Alternating Current Built in Self Test (AC. BIST) with variable data receiver voltage reference for performing high-speed AC memory subsystem self-test for that ASIC enabling writing of pseudo-random patterns to memory, reading them back and comparing the expected results at hardware speeds. Vref can be made to vary across its allowable range during AC self test to provide improved coverage. The system monitors Vddq during normal system operation using an ADC. The system varies Vref as a function of Vddq, using a combination of a DAC and ADC.

Abstract: A memory subsystem package has a memory controller interface ASIC (application specific integrated circuit) and a plurality of memory modules. The ASIC has a bi-directional serial protocol i2C communication bus to off chip drivers for monitoring temperature and for adjusting the environment surrounding the package by controlling fans using fan switches and variable voltage controls. In addition there is provided an Alternating Current Built in Self Test (AC BIST) with variable data receiver voltage reference for performing high-speed AC memory subsystem self-test for that ASIC enabling writing of pseudo-random patterns to memory, reading them back and comparing the expected results at hardware speeds. Vref can be made to vary across its allowable range during AC self test to provide improved coverage. The system monitors Vddq during normal system operation using an ADC. The system varies Vref as a function of Vddq, using a combination of a DAC and ADC.

Abstract: A memory subsystem package has a memory controller interface ASIC (application specific integrated circuit) and a plurality of Memory modules. The ASIC has a bi-directional serial protocol i2C communication bus to off chip drivers for monitoring temperature and for adjusting the environment surrounding the package by controlling fans using fan switches and variable voltage controls. In addition there is provided an Alternating Current Built in Self Test (AC BIST) with variable data receiver voltage reference for performing high-speed AC memory subsystem self-test for that ASIC enabling writing of pseudo-random patterns to memory, reading them back and comparing the expected results at hardware speeds. Vref can be made to vary across its allowable range during AC self test to provide improved coverage. The system monitors Vddq during normal system operation using an ADC. The system varies Vref as a function of vddq, using a combination of a DAC and ADC.

Abstract: A memory subsystem package has a memory controller interface ASIC (application specific integrated circuit) and a plurality of memory modules. The ASIC has a bi-directional serial protocol i2C communication bus to off chip drivers for monitoring temperature and for adjusting the environment surrounding the package by controlling fans using fan switches and variable voltage controls. In addition there is provided an Alternating Current Built in Self Test (AC BIST) with variable data receiver voltage reference for performing high-speed AC memory subsystem self-test for that ASIC enabling writing of pseudo-random patterns to memory, reading them back and comparing the expected results at hardware speeds. Vref can be made to vary across its allowable range during AC self test to provide improved coverage. The system monitors vddq during normal system operation using an ADC. The system varies Vref as a function of Vddq, using a combination of a DAC and ADC.