Abstract: The present invention relates to a coating composition which contains a one- or two-component binder and, in addition, an adhesion promoter which is based on a chemically modified, amorphous polyolefin having an average molecular weight M.sub.w (weight average) in the range from 10,000 to 100,000 g/mol, a non-uniformity U.sub.n of 1.0 to 6.5, a chlorine content of about 2.5 to 50% by weight and a total content of nitrogen, oxygen, sulfur and silicon, in the form of chemically incorporated functional groups, of about 2.5 to 15.0% by weight.The present invention also relates to a process for coating plastic substrates with this coating composition and to the coated plastic substrates obtained in accordance with this process.

Abstract: An improved process for depositing strongly adhering metallic coatings on substrate surfaces by wet chemical methods by treating the surfaces with a primer before activation.The materials produced by the process are eminently suitable for the shielding of electromagnetic waves.

Abstract: Circuit boards having excellent electrical and mechanical properties are obtained when special mixtures of polyarylene sulfides and polycarbonates, polyaryl ethers, polyamides, polyesters or rubber elastomers are used as base plates for the wet-chemical deposition of the circuits and the boards are treated with an oxidizing agent before activation.

Abstract: The present invention relates to a coating composition which contains a one- or two-component binder and, in addition,a) 0.1 to 15.0% by weight, based on the weight of the binder, of at least one coupling agent based on a chemically modified, amorphous polyolefin having an average molecular weight of 10,000 to 100,000, a non-uniformity of 1.0 to 6.5, a chlorine content of 2.5 to 50% by weight and a total content of nitrogen, oxygen, sulfur and silicon, in the form of chemically incorporated functional groups, of about 2.5 to 15% by weight, andb) 2.5 to 50% by weight, based on the weight of the amorphous polyolefin, of a bisphenol derivative corresponding to the formula ##STR1## The present invention also relates to a process for coating plastic substrates with this coating composition and to the coated plastics obtained therefrom.

Abstract: Conductor boards with well adhering conductor tracks are obtained if the substrates, which are clad on both sides with copper foils, have said cladding removed chemically or mechanically, are activated, if necessary sensitized, and are provided with a 0.05-2.0 .mu.m thick layer of nickel, cobalt, manganese, a nickel/iron or nickel/cobalt mixture in an electroless metallizing bath, a 0.5-5.0 .mu.m thick copper layer is applied in a subsequent copper bath and the conductor pattern is then built up by the standard semi-additive methods.

Abstract: The invention relates to a process for antistatic treatment or pretreatment for subsequent surface-coating of materials based on polyamides, polyimides or polyamideimides, where the molded articles of the material are treated with a solution of salt mixtures comprising(a) halides of elements of main groups 1 and/or 2 of the periodic system, in particular CaCl.sub.2, MgCl.sub.2, LiCl, NaCl and/or KCl and(b)(1) salts of weak inorganic bases with strong inorganic acids, in particular AlCl.sub.3, FeCl.sub.3, TiCl.sub.4, SbCl.sub.5, CaCl.sub.2, FeCl.sub.2, CuCl.sub.2, ZnCl.sub.2 and/or MoCl.sub.5(2) and/or the chelate complexes of (b1) with Schiff bases, amines, carboxylic acids, diketones, .alpha.,.beta.-unsaturated ketones and phosphines,(c) in a non-corrosive, organic swelling agent or solvent for the materials mentioned, where appropriate with the addition of water, preferably in an alcohol, at temperatures up to the boiling point of the solvents, preferably at temperatures of from -15.degree. C. to +60.

Abstract: Flexible circuits are obtained in an elegant manner, without the customary etching methods, wet-chemically in accordance with the principles of semiadditive or fully additive technology by using for the activation noble metal activators and, as base material, films or flexible boards whose surface has (a) a specific total pore volume per unit area of 0.015-0.045 dm.sup.3/ m.sup.2, (b) an average pore diameter of 0.05-5.0 .mu.m and (c) an average pore depth of 0.05-4.0 .mu.m.

Abstract: An elegant method for the production of printed circuit boards possessing good electrical and mechanical properties comprises activating baseplates with a solution of complex compounds of elements of sub-group I or VIII of the periodic table, then applying a resist layer, exposing this partially according to a resist pattern, dissolving away the covered parts of the resist layer with a solvent, and metallizing the bared parts in a wet-chemical metallization bath in the absence of a current.

Abstract: Composite materials are formed by subjecting a highly elastic material to a plasma treatment and then allowing a polyurethane foam forming mixture to foam on the plasma treated surface. These composites are particularly useful as shoe soles and as insulating materials.

Abstract: Polymer membranes metallized by wet chemistry are highly suitable, for example, for the separation of inert, reactive and fermentation gases.The metallization is carried out after activation with noble-metal complex compounds which have at least two functional groups.Preferred metal coatings are those of Cu, Co and Ni.

Abstract: A mild and simple process of activating substrate surfaces for the purpose of currentless metallization comprises using organometallic compounds of elements of the groups 1B and 8 of the Periodic System of Elements whose organic moiety has at least one functional group over and above the groups required for binding the metal are used for activation.

Abstract: Electrical printed circuit boards are obtained in an elegant manner without the usual etching methods and without using bonding agent layers in a wet chemical manner on the basis of the principles of the semi or fully additive technique by using precious metal compounds for activation and base material of a type which has (a) a specific total pore volume per unit area of 0.015-0.045 dm.sup.3 /m.sup.2, (b) a mean pore diameter of 0.05-5.0 .mu.m and (c) a mean pore depth of 0.05-4.0 .mu.m.

Abstract: Activation baths containing an organometallic compound based on elements of sub-group 1 or 8 of the periodic table with a "guest/host" interrelationship are outstandingly suitable for electroless metallization of preferably non-metallic substrates. Activators of palladium compounds and cyclic crown ethers are particularly suitable.

Abstract: Metallized laminated materials are obtained by coating a solder-resistant core material with a non-conductive polymer film, and subsequent activation and wet-chemical metallization of the polymer film, the activation being carried out, without oxidative pretreatment, on the polymer film before it has hardened completely, and the final hardening only being effected after the metallization. The materials thus metallized are suitable for the production of printed circuits.

Abstract: Black-metallized substrate surfaces which are characterized by the fact that they reflect at most 20% of electromagnetic radiation within the wavelength range from 200 to 5,000 nm and at least 50% within the wavelength range from 7,000 to 24,000 nm, the percentages being relative to the mean value over the entire wavelength range in each case, and which can be used as sunlight collectors are obtained by metallizing activated substrate surfaces without current in metallizing baths which contain a polymeric surface-active compound.

Abstract: For the electroless metallization of base carriers for the manufacture of printed circuit boards, those carrier materials are outstandingly suitable on which complex compounds are built up in which the ligands and the ions to be complexed have entered a "host-guest interrelationship". Examples of such activator compounds are complexes of crown ethers, cryptands and the like. The resulting printed circuit boards are distinguished by the high adhesive strengths of the metals deposited on them.

Abstract: A simple and mild method of activating substrate surfaces for currentless metallization involves activating by means of organometallic compounds of elements of the 1st and 8th sub-Groups of the Periodic Table of Elements in which the organic moiety consists of oligomeric, prepolymeric or polymeric compounds containing double bonds.

Abstract: Complex compounds of elements of sub-groups 1 and 8 of the periodic table in oxidation stages 1-4 with unsaturated ketones of the formula ##STR1## wherein R.sub.1 and R.sub.4 denote alkyl, cycloalkyl or aryl andR.sub.2 and R.sub.3 denote hydrogen or alkyl, are outstandingly suitable for activating substrate surfaces for electroless metallization since these complexes are distinguished by a high storage stability. The palladium complexes of but-3-en-2-one and hept-3-en-2-one are preferred.

Abstract: A mild activation process for the adhesion-activation of polyamide mouldings for electroless metallization comprises treating the substrates, successively or simultaneously, with the solution of a mixture of CaCl.sub.2, LiCl and/or MgCl.sub.2 with AlCl.sub.3, FeCl.sub.3 and/or TiCl.sub.4 in a lower alcohol and with an activator solution based on inorganic complex compounds of the formulaM.sup.n+ [E.sup.m+ Hal.sub.z.sup.- ]in whichM represents two hydrogen or alkali metal atoms or one alkaline earth metal atom,Hal represents a halogen, preferably Cl, andE represents a noble metal atom of the 1st or 8th subgroup of the periodic table, having the valency m and the coordination number z (z-m=n),or with customary colloidal or ionic systems of these noble metals.

Abstract: The metallization of porous solid bodies, such as, for example, ion exchange materials, by loading the surfaces of the metal-free substrates with transition metal ions and subsequently treating them with reducing agents can be improved by activating the substrates, before or after the loading with metal ions, with elements of group 1 or 8 of the periodic table or compounds thereof and sensitizing any activating ions still present. The metallization products are useful hydrogenation catalysts.