Patents by Inventor Kirsten Alting

Kirsten Alting has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10479059
    Abstract: A film comprising the following layers: I. a layer based on a polyamide whose monomer units contain an average of at least 8 carbon atoms, II. an immediately adjacent layer composed of a moulding composition comprising a polyamide as in I. and a copolymer having functional groups is used for the production of a composite with a substrate which comprises PA6, PA66, PA6/66 or PPA, giving secure adhesion.
    Type: Grant
    Filed: January 15, 2008
    Date of Patent: November 19, 2019
    Assignee: Evonik Degussa GmbH
    Inventors: Kirsten Alting, Roland Wursche, Harald Haeger, Martin Wielpuetz
  • Publication number: 20140037937
    Abstract: A film whose outer layer is composed of a molding composition which is in essence composed of the following components: a) from 3 to 50% by weight of a polyamide, selected from the group of PA11 and PA12, and b) from 50 to 97% by weight of a polyamide, selected from the group of PA1012 and PA1212, where the percentages are based on the entirety of components a) and b), is suitable for decoration of moldings which retain their gloss during their service time.
    Type: Application
    Filed: October 10, 2013
    Publication date: February 6, 2014
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Roland Wursche, Sonja Bollmann, Harald Haeger, Martin Wielpuetz, Kirsten Alting, Michael Beyer, Franz-Erich Baumann
  • Patent number: 8614005
    Abstract: A film whose outer layer is composed of a molding composition which is in essence composed of the following components: a) from 3 to 50% by weight of a polyamide, selected from the group of PA11 and PA12, and b) from 50 to 97% by weight of a polyamide, selected from the group of PA1012 and PA1212, where the percentages are based on the entirety of components a) and b), is suitable for decoration of moldings which retain their gloss during their service time.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: December 24, 2013
    Assignee: Evonik Degussa GmbH
    Inventors: Roland Wursche, Sonja Bollmann, Harald Haeger, Martin Wielpuetz, Kirsten Alting, Michael Beyer, Franz-Erich Baumann
  • Patent number: 8357455
    Abstract: The invention relates to the use of a molding composition which comprises at least 50% by weight of a copolyamide, which is composed of the following monomer combination: a) from 65 to 99 mol % of a substantially equimolar mixture composed of an unbranched aliphatic diamine having from 6 to 18 carbon atoms and of an unbranched aliphatic dicarboxylic acid having from 6 to 18 carbon atoms, ?where the mixture composed of diamine and dicarboxylic acid comprises an average of from 8 to 12 carbon atoms, b) from 1 to 35 mol % of a substantially equimolar mixture composed of a cycloaliphatic diamine having from 8 to 20 carbon atoms and of a dicarboxylic acid having from 6 to 18 carbon atoms, for production of a printable or printed item, such as a ski topcoat.
    Type: Grant
    Filed: November 9, 2005
    Date of Patent: January 22, 2013
    Assignee: Evonik Degussa GmbH
    Inventors: Franz-Erich Baumann, Roland Wursche, Harald Häger, Sonja Bollmann, Kirsten Alting
  • Publication number: 20120270022
    Abstract: A process for producing a composite of a polyarylene ether ketone foil a metal foil is provided. The process includes: providing a foil of thickness from 5 to 1200 ?m made of a molding composition which comprises: from 60 to 96 parts by weight of polyarylene ether ketone, from 2 to 25 parts by weight of hexagonal boron nitride and from 2 to 25 parts by weight of talc, where the sum of the parts by weight of the components is 100; providing a metal foil of thickness from 10 to 150 ?m; and pressing the foils without using an adhesive at a temperature in the range from Tm?40K to Tm+40K and at a pressure in the range from 4 to 5000 bar. Also provided is the adhesive-free composite foil which is suitable for producing dimensionally stable circuit boards.
    Type: Application
    Filed: April 20, 2012
    Publication date: October 25, 2012
    Applicant: Evonik Degussa GmbH
    Inventors: Kirsten ALTING, Joerg BLASCHKE
  • Publication number: 20120094116
    Abstract: A film whose outer layer is composed of a molding composition which is in essence composed of the following components: a) from 3 to 50% by weight of a polyamide, selected from the group of PA11 and PA12, and b) from 50 to 97% by weight of a polyamide, selected from the group of PA1012 and PA1212, where the percentages are based on the entirety of components a) and b), is suitable for decoration of moldings which retain their gloss during their service time.
    Type: Application
    Filed: December 21, 2011
    Publication date: April 19, 2012
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Roland WURSCHE, Sonja Bollmann, Harald Häger, Martin Wielpütz, Kirsten Alting, Michael Beyer, Franz-Erich Baumann
  • Patent number: 8007916
    Abstract: A composite part is produced by a process in which at least one of components a) and b) of said composite part is treated with an Openair plasma on a contact surface between said components a) and b) prior to production of the composite part, followed by molding-on of the other component; wherein said components are as follows: a) a part which entirely or to some extent comprises a molding composition comprising at least 40% by weight of a polyamide whose monomer units contain an average of at least 8 carbon atoms, and b) a part comprising another molding composition.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: August 30, 2011
    Assignee: Evonik Degussa GmbH
    Inventors: Karl Kuhmann, Klaus Hülsmann, Martin Wielpütz, Walter-Konrad Mertens, Ursula Schaub, Kirsten Alting, Simon Amesöder, Leo Hoffmann
  • Publication number: 20100221551
    Abstract: The present invention relates to a composite part containing (i) a part composed of an ABS molding composition, and (ii) a multilayer film including at least one layer comprising a polyamide molding composition, and at least one layer comprising an adhesion promoter, wherein the adhesion promoter contains from 2 to 100% by weight of a copolymer, and wherein the copolymer contains (a) from 70 to 99.9% by weight of monomer units derived from vinyl compounds selected from the group consisting of acrylic acid derivatives, methacrylic acid derivatives, and vinylaromatics; and (b) from 0.1 to 30% by weight of monomer units comprising a functional group selected from the group consisting of a carboxylic anhydride group, an epoxy group, and an oxazoline group.
    Type: Application
    Filed: May 14, 2010
    Publication date: September 2, 2010
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Roland WURSCHE, Sonja Bollmann, Martin Wielpuetz, Kirsten Alting, Harald Haeger
  • Publication number: 20090286096
    Abstract: A film comprising the following layers: I. a layer based on a polyamide whose monomer units contain an average of at least 8 carbon atoms, II. an immediately adjacent layer composed of a moulding composition comprising a polyamide as in I. and a copolymer having functional groups is used for the production of a composite with a substrate which comprises PA6, PA66, PA6/66 or PPA, giving secure adhesion.
    Type: Application
    Filed: January 15, 2008
    Publication date: November 19, 2009
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Kirsten Alting, Roland Wursche, Harald Haeger, Martin Wielpuetz
  • Publication number: 20080261010
    Abstract: A film whose outer layer is composed of a molding composition which is in essence composed of the following components: a) from 3 to 50% by weight of a polyamide, selected from the group of PA11 and PA12, and b) from 50 to 97% by weight of a polyamide, selected from the group of PA1012 and PA1212, where the percentages are based on the entirety of components a) and b), is suitable for decoration of moldings which retain their gloss during their service time.
    Type: Application
    Filed: January 4, 2006
    Publication date: October 23, 2008
    Applicant: DEGUSSA GmbH
    Inventors: Roland Wursche, Sonja Bollmann, Harald Hager, Martin Wielputz, Kirsten Alting, Michael Beyer, Franz-Erich Baumann
  • Publication number: 20080119632
    Abstract: The invention relates to the use of a molding composition which comprises at least 50% by weight of a copolyamide, which is composed of the following monomer combination: a) from 65 to 99 mol % of a substantially equimolar mixture composed of an unbranched aliphatic diamine having from 6 to 18 carbon atoms and of an unbranched aliphatic dicarboxylic acid having from 6 to 18 carbon atoms, where the mixture composed of diamine and dicarboxylic acid comprises an average of from 8 to 12 carbon atoms, b) from 1 to 35 mol % of a substantially equimolar mixture composed of a cycloaliphatic diamine having from 8 to 20 carbon atoms and of a dicarboxylic acid having from 6 to 18 carbon atoms, for production of a printable or printed item, such as a ski topcoat.
    Type: Application
    Filed: November 9, 2005
    Publication date: May 22, 2008
    Applicant: DEGUSSA GmbH
    Inventors: Franz-Erich Baumann, Roland Wursche, Harald Hager, Sonja Bollmann, Kirsten Alting
  • Publication number: 20070166560
    Abstract: An adhesion promoter which comprises from 2 to 100% by weight of a copolymer which contains the following monomer units: a) from 70 to 99.9% by weight of monomer units which derive from vinyl compounds selected from acrylic acid derivatives, methacrylic acid derivatives, and vinylaromatics, and also b) from 0.1 to 30% by weight of monomer units which contain a functional group selected from a carboxylic anhydride group, an epoxy group, and an oxazoline group, is used for production of a bond between I. a layer composed of a polyamide molding compound, and II. a part composed of an ABS molding composition.
    Type: Application
    Filed: June 9, 2005
    Publication date: July 19, 2007
    Applicant: Degussa AG
    Inventors: Roland Wursche, Sonja Bollmann, Martin Wielputz, Kirsten Alting, Harald Hager
  • Publication number: 20060292387
    Abstract: A composite part is produced by a process in which at least one of components a) and b) of said composite part is treated with an Openair plasma on a contact surface between said components a) and b) prior to production of the composite part, followed by molding-on of the other component; wherein said components are as follows: a) a part which entirely or to some extent comprises a molding composition comprising at least 40% by weight of a polyamide whose monomer units contain an average of at least 8 carbon atoms, and b) a part comprising another molding composition.
    Type: Application
    Filed: January 30, 2006
    Publication date: December 28, 2006
    Applicant: Degussa AG
    Inventors: Karl Kuhmann, Klaus Hulsmann, Martin Wielputz, Walter-Konrad Mertens, Ursula Schaub, Kirsten Alting, Simon Amesoder, Leo Hoffmann
  • Publication number: 20060281873
    Abstract: A polyamide molding composition which can be used for production of a printable or printed item contains a) at most 90 parts by weight of a polyamide obtained from a lactam or from an amino carboxylic acid having at least 10 carbon atoms; and b) from 10 to 100 parts by weight of PA1010, wherein a total of components a) and b) is 100 parts by weight.
    Type: Application
    Filed: June 8, 2006
    Publication date: December 14, 2006
    Applicant: DEGUSSA AG
    Inventors: Kirsten Alting, Franz-Erich Baumann, Sonja Bollmann, Andreas Dowe, Roland Wursche, Georg Schafer