Patents by Inventor Kirsten Luetzeler

Kirsten Luetzeler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9334356
    Abstract: The invention relates to a molding compound, comprising the following components: a) 60 to 96% by weight polyaryletherketone, b) 2 to 25% by weight hexagonal bornite, and c) 2 to 25% by weight talcum, wherein the sum of the parts by weight of components a), b), and c) is 100. Said compounds can be used to produce a film having a thickness of 5 to 1200 ?m, which is suitable for producing dimensionally stable circuit boards.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: May 10, 2016
    Assignee: Evonik Degussa GmbH
    Inventors: Joerg Blaschke, Kirsten Luetzeler, Walter Zink, Ricardo Luiz Willemann, Kathrin Salwiczek, Georg Schaefer
  • Patent number: 8535811
    Abstract: A polyamide molding composition which can be used for production of a printable or printed item contains a) at most 90 parts by weight of a polyamide obtained from a lactam or from an amino carboxylic acid having at least 10 carbon atoms; and b) from 10 to 100 parts by weight of PA1010, wherein a total of components a) and b) is 100 parts by weight.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: September 17, 2013
    Assignee: Evonik Degussa GmbH
    Inventors: Kirsten Luetzeler, Franz-Erich Baumann, Sonja Bollmann, Andreas Dowe, Roland Wursche, Georg Schaefer
  • Publication number: 20120196113
    Abstract: The invention relates to a molding compound, comprising the following components: a) 60 to 96% by weight polyaryletherketone, b) 2 to 25% by weight hexagonal bornite, and c) 2 to 25% by weight talcum, wherein the sum of the parts by weight of components a), b), and c) is 100. Said compounds can be used to produce a film having a thickness of 5 to 1200 ?m, which is suitable for producing dimensionally stable circuit boards.
    Type: Application
    Filed: October 19, 2010
    Publication date: August 2, 2012
    Applicant: Evonik Degussa GmbH
    Inventors: Joerg Blaschke, Kirsten Luetzeler, Walter Zink, Ricardo Luiz Willemann, Kathrin Salwiczek, Georg Schaefer
  • Publication number: 20110244209
    Abstract: A polyamide molding composition which can be used for production of a printable or printed item contains a) at most 90 parts by weight of a polyamide obtained from a lactam or from an amino carboxylic acid having at least 10 carbon atoms; and b) from 10 to 100 parts by weight of PA1010, wherein a total of components a) and b) is 100 parts by weight.
    Type: Application
    Filed: June 1, 2011
    Publication date: October 6, 2011
    Applicant: DEGUSSA AG
    Inventors: Kirsten Luetzeler, Franz-Erich Baumann, Sonja Bollmann, Andreas Dowe, Roland Wursche, Georg SCHÄFER
  • Patent number: 8003201
    Abstract: A polyamide molding composition which can be used for production of a printable or printed item contains a) at most 90 parts by weight of a polyamide obtained from a lactam or from an amino carboxylic acid having at least 10 carbon atoms; and b) from 10 to 100 parts by weight of PA1010, wherein a total of components a) and b) is 100 parts by weight.
    Type: Grant
    Filed: June 8, 2006
    Date of Patent: August 23, 2011
    Assignee: Evonik Degussa GmbH
    Inventors: Kirsten Luetzeler, Franz-Erich Baumann, Sonja Bollmann, Andreas Dowe, Roland Wursche, Georg Schaefer
  • Publication number: 20110045269
    Abstract: A component which comprises the following components: I. a top layer of a moulding compound which contains at least 50% by weight of PA613 and II. a substrate of a thermoplastic moulding compound has a surface with high scratch resistance and high chemical resistance.
    Type: Application
    Filed: June 23, 2009
    Publication date: February 24, 2011
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Roland Wursche, Sonja Bollmann, Franz-Erich Baumann, Beatrice Kueting, Kirsten Luetzeler, Andreas Pawlik, Martin Wielpuetz
  • Publication number: 20100062272
    Abstract: A transparent component, which comprises the following subcomponents: I. an outer layer composed of a polyamide moulding composition, which comprises the following constituents: a) from 50 to 100 parts by weight of polyamide, which can be prepared from the following monomers: ?) from 70 to 100 mol % of diamine, selected from m-xylylenediamine, p-xylylenediamine and mixtures thereof, ?) from 0 to 30 mol % of other diamines having from 6 to 14 carbon atoms, where the mol % data here are based on the entirety of diamine, and also ?) from 70 to 100 mol % of aliphatic dicarboxylic acids having from 10 to 18 carbon atoms and ?) from 0 to 30 mol % of other dicarboxylic acids having from 6 to 9 carbon atoms, where the mol % data here are based on the entirety of dicarboxylic acid; b) from 0 to 50 parts by weight of another polyamide, where the parts by weight of a) and b) give a total of 100, II.
    Type: Application
    Filed: December 4, 2007
    Publication date: March 11, 2010
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Roland Wursche, Karl Kuhmann, Beatrice Kueting, Patrick Kreidler, Kirsten Luetzeler, Klaus Huelsmann
  • Publication number: 20100055425
    Abstract: A film which comprises a layer composed of a moulding composition composed of a semicrystalline polyamide whose enthalpy of fusion is at least 8 J/g is used for production of a composite part with a substrate composed of a moulding composition composed of a substantially amorphous polyamide whose enthalpy of fusion is less than 8 J/g.
    Type: Application
    Filed: August 24, 2007
    Publication date: March 4, 2010
    Applicant: EVONIK DEGUSSA GMBH
    Inventors: Kirsten Luetzeler, Klaus Huelsmann, Martin Wielpuetz, Roland Wursche
  • Publication number: 20100003524
    Abstract: A composite part is composed of I. a multilayer film, which comprises the following layers: a) a layer composed of a polyamide moulding composition and b) following in the inwards direction, a layer composed of an adhesion promoter, which comprises from 5 to 100% by weight of a copolymer, which contains the following monomer units: from 70 to 99.9% by weight of monomer units which derive from vinyl compounds selected from acrylic acid derivatives, methacrylic acid derivatives, ?-olefins and vinylaromatics, and from 0.1 to 30% by weight of monomer units which contain a functional group selected from a carboxylic anhydride group, an epoxide group and an oxazoline group, and II. a substrate composed of a polycarbonate moulding composition.
    Type: Application
    Filed: August 22, 2007
    Publication date: January 7, 2010
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Kirsten Luetzeler, Martin Wielpuetz, Frank Lorenz, Klaus Huelsmann, Roland Wursche
  • Publication number: 20100003534
    Abstract: A composite part is composed of I. a multilayer film, which comprises the following layers: a) a layer composed of a polyamide moulding composition and b) following in the inwards direction, a layer composed of an adhesion promoter, which comprises from 5 to 100% by weight of a copolymer, which contains the following monomer units: from 70 to 99.9% by weight of monomer units which derive from vinyl compounds selected from acrylic acid derivatives, methacrylic acid derivatives, ?-olefins and vinylaromatics, and from 0.1 to 30% by weight of monomer units which contain a functional group selected from a carboxylic anhydride group, an epoxide group and an oxazoline group, and II. a substrate composed of a polyalkyl (meth)acrylate moulding composition.
    Type: Application
    Filed: August 22, 2007
    Publication date: January 7, 2010
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Kirsten Luetzeler, Klaus Huelsmann, Martin Wielpuetz, Frank Lorenz, Roland Wursche