Patents by Inventor Kirt Reed Williams
Kirt Reed Williams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200064369Abstract: A MEMS sensor that comprises a sensing reference plane, at least one anchor coupled to the sensing reference plane, wherein the sensing reference plane is divided by a first and a second axis forming four quadrants on the sensing reference plane, at least one proof mass coupled to the at least one anchor, wherein one of the at least one proof mass moves under an external excitation, and a pattern of sensing elements on the sensing reference plane to detect motion normal of the at least one proof mass relative to the sensing reference plane, wherein the pattern of sensing elements comprises at least three sensing elements in each of the four quadrants.Type: ApplicationFiled: November 4, 2019Publication date: February 27, 2020Applicant: InvenSense, Inc.Inventors: Matthew Julian THOMPSON, Kirt Reed WILLIAMS
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Patent number: 10466268Abstract: A MEMS sensor that comprises a sensing reference plane, at least one anchor coupled to the sensing reference plane, wherein the sensing reference plane is divided by a first and a second axis forming four quadrants on the sensing reference plane, at least one proof mass coupled to the at least one anchor, wherein one of the at least one proof mass moves under an external excitation, and a pattern of sensing elements on the sensing reference plane to detect motion normal of the at least one proof mass relative to the sensing reference plane, wherein the pattern of sensing elements comprises at least three sensing elements in each of the four quadrants.Type: GrantFiled: March 8, 2018Date of Patent: November 5, 2019Assignee: InvenSense, Inc.Inventors: Matthew Julian Thompson, Kirt Reed Williams
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Publication number: 20180196082Abstract: A MEMS sensor that comprises a sensing reference plane, at least one anchor coupled to the sensing reference plane, wherein the sensing reference plane is divided by a first and a second axis forming four quadrants on the sensing reference plane, at least one proof mass coupled to the at least one anchor, wherein one of the at least one proof mass moves under an external excitation, and a pattern of sensing elements on the sensing reference plane to detect motion normal of the at least one proof mass relative to the sensing reference plane, wherein the pattern of sensing elements comprises at least three sensing elements in each of the four quadrants.Type: ApplicationFiled: March 8, 2018Publication date: July 12, 2018Applicant: InvenSense, Inc.Inventors: Matthew Julian THOMPSON, Kirt Reed WILLIAMS
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Patent number: 9952252Abstract: A system and method for reducing offset in a MEMS sensor are disclosed. In a first aspect, the system is a MEMS sensor that comprises a sensing reference plane, at least one anchor coupled to the sensing reference plane, at least one proof mass coupled to the at least one anchor, wherein one of the at least one proof mass moves under an external excitation, a pattern of sensing elements coupled between the sensing reference plane and the at least one proof mass to detect motion normal to the sensing reference plane, wherein the pattern of sensing elements shares at least three axes of polarity anti-symmetry, and a signal processing circuit to combine the pattern of sensing elements thereby providing an output proportional to the external excitation. In a second aspect, the sensing reference plane is divided by two axes forming four quadrants on the sensing reference plane.Type: GrantFiled: May 15, 2015Date of Patent: April 24, 2018Assignee: InvenSense, Inc.Inventors: Matthew Julian Thompson, Kirt Reed Williams
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Patent number: 9738511Abstract: A MEMS (microelectromechanical systems) structure comprises a MEMS wafer. A MEMS wafer includes a cap with cavities bonded to a structural layer through a dielectric layer disposed between the cap and the structural layer. Unique configurations of MEMS devices and methods of providing such are set forth which provide for, in part, creating rounded, scalloped or chamfered MEMS profiles by shaping the etch mask photoresist reflow, by using a multi-step deep reactive ion etch (DRIE) with different etch characteristics, or by etching after DRIE.Type: GrantFiled: March 25, 2014Date of Patent: August 22, 2017Assignee: INVENSENSE, INC.Inventors: Jongwoo Shin, Kirt Reed Williams, Cerina Zhang, Kuolung (Dino) Lei
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Publication number: 20160334438Abstract: A system and method for reducing offset in a MEMS sensor are disclosed. In a first aspect, the system is a MEMS sensor that comprises a sensing reference plane, at least one anchor coupled to the sensing reference plane, at least one proof mass coupled to the at least one anchor, wherein one of the at least one proof mass moves under an external excitation, a pattern of sensing elements coupled between the sensing reference plane and the at least one proof mass to detect motion normal to the sensing reference plane, wherein the pattern of sensing elements shares at least three axes of polarity anti-symmetry, and a signal processing circuit to combine the pattern of sensing elements thereby providing an output proportional to the external excitation. In a second aspect, the sensing reference plane is divided by two axes forming four quadrants on the sensing reference plane.Type: ApplicationFiled: May 15, 2015Publication date: November 17, 2016Inventors: Matthew Julian THOMPSON, Kirt Reed WILLIAMS
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Patent number: 9296606Abstract: A method and system for a MEMS device is disclosed. The MEMS device includes a free layer, with a first portion and a second portion. The MEMS device also includes a underlying substrate, the free layer movably positioned relative to the underlying substrate. The first portion and second portion of the free layer are coupled through at least one stem. A sense material is disposed over portions of the second portion of the free layer. Stress in the sense material and second portion of the free layer does not cause substantial deflection of the first portion.Type: GrantFiled: February 4, 2014Date of Patent: March 29, 2016Assignee: INVENSENSE, INC.Inventors: Kirt Reed Williams, Matthew Julian Thompson, Joseph Seeger
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Patent number: 9182454Abstract: Improved electric field (steered-electron electric-field, or SEEF) sensors and methods of manufacturing the same are provided. The SEEF sensors described herein may have increased sensitivity to low-frequency electric fields while being smaller than previously known sensors, and may allow for low-power electric field detection. The invention described herein allows for sensitive, long-term electric field monitoring for applications ranging from personnel detection to underground facility monitoring, as well as extraordinarily small vector sensing (full Poynting vector) for compact direction-finding of emitters of interest. Exemplary electric field sensors may accurately sense, measure, characterize and/or transmit electric field data over a wide frequency range. Importantly, such sensing, measuring, and/or characterizing do not require any physical or resistive contact between the sensor and a source of an electric field.Type: GrantFiled: May 10, 2012Date of Patent: November 10, 2015Assignees: Leidos, Inc., Palo Alto Research Center IncorporatedInventors: Kirt Reed Williams, Scott Limb, Dirk De Bruyker
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Publication number: 20150284239Abstract: A method and system for a MEMS device is disclosed. The MEMS device includes a free layer, with a first portion and a second portion. The MEMS device also includes a underlying substrate, the free layer movably positioned relative to the underlying substrate. The first portion and second portion of the free layer are coupled through at least one stem. A sense material is disposed over portions of the second portion of the free layer. Stress in the sense material and second portion of the free layer does not cause substantial deflection of the first portion.Type: ApplicationFiled: February 4, 2014Publication date: October 8, 2015Applicant: INVENSENSE, INC.Inventors: KIRT REED WILLIAMS, MATTHEW JULIAN THOMPSON, JOSEPH SEEGER
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Publication number: 20150076631Abstract: A MEMS (microelectromechanical systems) structure comprises a MEMS wafer. A MEMS wafer includes a cap with cavities bonded to a structural layer through a dielectric layer disposed between the cap and the structural layer. Unique configurations of MEMS devices and methods of providing such are set forth which provide for, in part, creating rounded, scalloped or chamfered MEMS profiles by shaping the etch mask photoresist reflow, by using a multi-step deep reactive ion etch (DRIE) with different etch characteristics, or by etching after DRIE.Type: ApplicationFiled: March 25, 2014Publication date: March 19, 2015Applicant: InvenSense, Inc.Inventors: Jongwoo SHIN, Kirt Reed WILLIAMS, Cerina ZHANG, Kuolung (Dino) LEI
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Publication number: 20140264655Abstract: In an integrated MEMS device, moving silicon parts with smooth surfaces can stick together if they come into contact. By roughening at least one smooth surface, the effective area of contact, and therefore surface adhesion energy, is reduced and hence the sticking force is reduced. The roughening of a surface can be provided by etching the smooth surfaces in gas, plasma, or liquid with locally non-uniform etch rate. Various etch chemistries and conditions lead to various surface roughness.Type: ApplicationFiled: October 23, 2013Publication date: September 18, 2014Applicant: InvenSense, Inc.Inventors: Kirt Reed WILLIAMS, Kegang HUANG, Wencheng XU, Jongwoo SHIN, Martin LIM
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Patent number: 6549394Abstract: A capacitor having a bottom plate, a top plate and a support connected to the center portion of the top plate for positioning the top plate over the bottom plate and separated therefrom by a gap. The outer portion of the top plate moves relative to the bottom plate when a potential is applied between the plates. The outer portion may be connected to the center portion of the top plate by springs such that the movement of the top plate relative to the bottom plate is accommodated by bending at least one of the springs. The capacitor may also include an insulating layer between the top and bottom plates disposed so as to prevent the top plate from shorting to the bottom plate. A spacer for setting the minimum distance between the outer portion of the top plate and the bottom plate may also be included.Type: GrantFiled: March 22, 2002Date of Patent: April 15, 2003Assignee: Agilent Technologies, Inc.Inventor: Kirt Reed Williams