Abstract: A substrate treatment apparatus includes a treatment container having a treatment space for a substrate, a support portion provided in the treatment space, and configured to support the substrate, and a rotary nozzle unit provided in the treatment space, the rotary nozzle unit configured to spray a treatment liquid onto a central region of a lower surface of the substrate by rotating about a rotational shaft within a first angular range, and to spray the treatment liquid onto an edge region of the lower surface of the substrate by rotating about the rotational shaft within a second angular range.

Abstract: Proposed are a chilling unit, a heat treatment apparatus including same, and a heat treatment method. More particularly, proposed is a technology capable of rapidly and effectively lowering the temperature of a heating plate by bringing a heat exchange medium of a chilling unit into contact with the heating plate and then circulating a refrigerant after performing a heat treatment process of a substrate through a heat treatment apparatus.

Abstract: A transferring module includes a support plate on which a substrate is supported, and an adsorption portion disposed on the support plate, adsorbing and fixing a lower surface of the substrate, and including a groove formed inwardly concavely in one direction in an outer peripheral surface.

Abstract: Proposed is a substrate processing apparatus for cleaning the bottom surface of a substrate. The apparatus includes a processing container configured to form a processing space for a substrate, a substrate support unit provided inside the processing space and configured to support the substrate, a first nozzle unit configured to have a first nozzle member provided on a side of the substrate support unit inside the processing space and supplying a processing fluid toward a center area of a bottom surface of the substrate, and a second nozzle member provided to be fixedly coupled to the substrate support unit and supplying a processing fluid toward an edge area of the bottom surface of the substrate, wherein the first nozzle member is provided to rotate between a center position and an end position of the bottom surface of the substrate.

Abstract: Provided is an apparatus for treating a substrate. The apparatus for treating the substrate includes a chamber having an inner space, a support unit configured to support the substrate in the inner space, a gas supply tube configured to supply a gas onto the substrate supported on the support unit, a gas exhaust tube configured to exhaust the gas from the inner space, and a gas block connected to the gas supply tube and the gas exhaust tube and provided above the chamber.

Abstract: A pump for supplying a liquid is provided. The pump including a flexible tube body including a pump chamber; a first flange provided at one end of the tube body; and a second flange provided at the other end of the tube body; and a driving unit for transmitting rotational force to the tube body to twist the tube body, in which the tube body has a bent portion bent at a predetermined angle.

Abstract: Disclosed is an apparatus of processing a substrate, and more particularly, is a transfer unit for preventing contamination of a position sensor installed in a hand and a substrate processing apparatus including the same, which may prevent contamination of a position sensor that measures an alignment state of a substrate.

Abstract: Provided is a pump for supplying a liquid. The pump includes: a tube including a pump chamber communicating with a chemical liquid inlet and a chemical liquid outlet, and configured to discharge a chemical liquid through a change in volume due to contraction and expansion; and a driving unit contracting or expanding the tube in a longitudinal direction, in which the tube includes: a flexible tube body including a pump chamber which has an increased internal volume when is contracted in a longitudinal direction and has a decreased internal volume when is expanded in the longitudinal direction, and which has a jar shape of which a radius is increased from the chemical liquid inlet to a center of the pump chamber, and the radius is decreased from the pump chamber to the chemical liquid outlet; a first flange provided at one end of the tube body and including the chemical liquid inlet; and a second flange provided at the other end of the tube body and including the chemical liquid outlet.

Abstract: Disclosed is an apparatus for treating a substrate, the apparatus including: a housing having an entrance through which a substrate is loaded, and having an interior space; a support unit for supporting the substrate in the interior space; and a drive unit for moving the support unit between a first position and a second position; a compartment plate for dividing the interior space into a treatment space and a drive space, and having an opening formed while extending from the first position toward the second position; and an exhaust port connected to the drive space to exhaust an atmosphere in the drive space, and provided to be more adjacent to the second position than to the first position, in which the support unit includes: a support plate which is positioned in the treatment space, and on which the substrate is placed; a support shaft supporting the support plate, and extending from the treatment space to the drive space through the opening; and a blocking plate positioned to overlap the opening when vie

Abstract: An apparatus for treating a substrate includes a treating vessel having an inner space, a support unit that supports and rotates the substrate in the inner space, and an exhaust unit that releases an air flow in the inner space. The exhaust unit includes an air-flow guide duct into which the air flow is introduced in a tangential direction with respect to a rotating direction of the substrate supported on the support unit.

Abstract: Provided is a support unit including a support plate on which the substrate is placed, and a support protrusion provided on the support plate and separating the substrate from the support plate, wherein the support plate includes a first protrusion protruding from an upper surface of the support plate, wherein the first protrusion is provided in a support region provided by the support protrusion.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes substrate treating apparatus comprising: a treating container having an inner space; a support unit configured to support and rotate a substrate within the inner space; an exhaust duct configured to exhaust the inner space; and at least one guide member combined with the treating container and configured to guide an airflow within the inner space, and wherein the at least one guide member is arranged such that the airflow within the inner space obliquely flows with respect to a rotation direction of the substrate supported by the support unit when seen from above.

Abstract: Provided is an apparatus for treating a substrate.

Abstract: An apparatus for treating a substrate, the apparatus comprising: a processing container having an inner space; a support unit having a support plate configured to support and rotate the substrate in the inner space; a liquid supply unit supplying treating liquid to the substrate supported by the support unit; and an exhaust unit exhausting an air flow in the inner space, wherein the processing container includes a bottom wall and a side wall extending from the outside end of the bottom wall, the processing container including a first gas-liquid separator provided at the side wall.

Abstract: Proposed is a substrate processing apparatus for cleaning the bottom surface of a substrate. The apparatus includes a processing container configured to form a processing space for a substrate, a substrate support unit provided inside the processing space and configured to support the substrate, a first nozzle unit configured to have a first nozzle member provided on a side of the substrate support unit inside the processing space and supplying a processing fluid toward a center area of a bottom surface of the substrate, and a second nozzle member provided to be fixedly coupled to the substrate support unit and supplying a processing fluid toward an edge area of the bottom surface of the substrate, wherein the first nozzle member is provided to rotate between a center position and an end position of the bottom surface of the substrate.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes substrate treating apparatus comprising: a treating container having an inner space; a support unit configured to support and rotate a substrate within the inner space; an exhaust duct configured to exhaust the inner space; and at least one guide member combined with the treating container and configured to guide an airflow within the inner space, and wherein the at least one guide member is arranged such that the airflow within the inner space obliquely flows with respect to a rotation direction of the substrate supported by the support unit when seen from above.

Abstract: The inventive concept provides an apparatus for treating a substrate. The apparatus comprises a processing container having an inner space; a support unit configured to support and rotate the substrate in the inner space; a liquid supply unit configured to supply a treating liquid to the substrate supported by the support unit; and an exhaust unit configured to exhaust an air flow from the inner space, wherein the exhaust unit includes an air flow guide duct with an inlet provided to introduce the air flow into the air flow guide duct in a tangential direction to a rotating direction of the substrate supported on the support unit.

Abstract: A substrate treatment apparatus is provided. The substrate treatment apparatus includes a substrate support part provided with a seating surface and configured to support a substrate, a guide ring annularly disposed along an edge of the substrate support part to surround the substrate, and a centering part provided inside the guide ring and configured to center the substrate by moving in a direction parallel to the seating surface to pressurize the edge of the substrate.

Abstract: Proposed are a chilling unit, a heat treatment apparatus including same, and a heat treatment method. More particularly, proposed is a technology capable of rapidly and effectively lowering the temperature of a heating plate by bringing a heat exchange medium of a chilling unit into contact with the heating plate and then circulating a refrigerant after performing a heat treatment process of a substrate through a heat treatment apparatus.

Abstract: An apparatus for treating a substrate includes a processing container having an inner space; a support unit having a support plate configured to support and rotate the substrate in the inner space; a liquid supply unit configured to supply treating liquid to the substrate supported by the support unit; and an exhaust unit configured to exhaust an air flow in the inner space, wherein the exhaust unit includes an air flow guide duct guiding a flow direction of an air flow flowing on the substrate to an outer side of the substrate due to a rotation of the substrate supported by the support unit, and the air flow guide duct having an inlet into which an air flow is introduced, the inlet provided at a substantially same level with the substrate supported by the support unit.