Abstract: The instant invention relates to oligo- and poly-carbonates terminated with silicon containing groups which are useful as reducers of surface energy for organic materials such as polycarbonates, polyesters or polyketones or their mixtures, blends or alloys. Polymers with such reduced surface energy possess self-cleaning, anti-soiling, anti-graffiti, oil resistance, solvent resistance, chemical resistance, self-lubricating, scratch resistance, low moisture absorption, dirt pickup resistance, slip properties and a hydrophobic surface; and display anti-adhesion properties against proteins and against microorganisms such as for example, bacteria, fungi and algae.

Abstract: The instant invention relates to new compounds of the formula I R1 and R2 are each independently of the other a fluorine containing group, R3 and R4 are each independently of the other hydrogen, a fluorine containing group, C1-C12alkyl, phenyl or R4, together with the carbon atom to which they are bonded, form a C5-C8-cycloalkylidene ring that is unsubstituted or substituted by from 1 to 3 C1-C4alkyl groups; R5, R6, R7 and R8 are each independently of the other hydrogen, C1-C12alkyl or C3-C12alkenyl, X1 and X2 are each independently of the other a direct bond or C1-C12alkylene, m is 1 to 10,000, and n is 0 to 10,000. These new compounds of the formula I are useful as reducers of surface energy for organic materials such as polycarbonates, polyesters or polyketones or their mixtures, blends or alloys.

Abstract: The instant invention relates to new compounds of the formula I wherein the general symbols are as defined in claim 1 and R1 and R2 are each independently of the other a silicon containing group. These new compounds of the formula I are useful as reducers of surface energy for organic materials such as polycarbonates, polyesters or polyketones or their mixtures, blends or alloys. Polymers with such a reduced surface energy possess an “easy to clean”, “self-cleaning” “antisoiling”, “soil-release” “antigraffiti”, “oil resistance”, “solvent resistance”, “chemical resistance”, “self lubricating”, “scratch resistance”, “low moisture absorption”, “dirt pickup resistance”, “slip properties” and “hydrophobic surface”; and antiadhesion properties against proteins and against microorganism such as for example bacteria, fungi and algae.

Abstract: A semiconductor package construction aimed at improving thermal performance. A heatspreader is provided having a metal alloy preform attached to it already. Then, a few dots of conductive epoxy are dispensed around the die. The heatspreader with the preformed metal alloy is pressed on the adhesive and then the part is cured. By coupling the die to the heatspreader with conductive epoxy, the die is constrained from warping. By removing the necessity of coating the die, the cost of fabrication is reduced. There is only a very marginal cost increase in the back end for dispensing the dots. For this, the process and equipment already exists in the backend. By reducing die backside warpage due, the die remains in good contact with the heatspreader, thus improving thermal performance.

Abstract: A semiconductor package construction aimed at improving thermal performance. A heatspreader is provided having a metal alloy preform attached to it already. Then, a few dots of conductive epoxy are dispensed around the die. The heatspreader with the preformed metal alloy is pressed on the adhesive and then the part is cured. By coupling the die to the heatspreader with conductive epoxy, the die is constrained from warping. By removing the necessity of coating the die, the cost of fabrication is reduced. There is only a very marginal cost increase in the back end for dispensing the dots. For this, the process and equipment already exists in the backend. By reducing die backside warpage due, the die remains in good contact with the heatspreader, thus improving thermal performance.