Patents by Inventor Kisuke Seki

Kisuke Seki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Abrasive and method for manufacturing the same
    Patent number: 4548617
    Abstract: An abrasive for removing flashes of a molded product, which comprises synthetic resin particles, each particle having a plurality of cutting edges and of cracks capable of easily forming cleavages upon collision against a workpiece. A method for manufacturing such synthetic resin abrasive particles which comprises a step of intentionally forming a number of cracks in the resin particles.
    Type: Grant
    Filed: August 12, 1983
    Date of Patent: October 22, 1985
    Assignees: Tokyo Shibaura Denki Kabushiki Kaisha, Mitsui Toatsu Chemicals, Inc.
    Inventors: Takashi Miyatani, Junji Nakata, Kisuke Seki, Takafumi Kageyama