Patents by Inventor Kit Baughman

Kit Baughman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6155675
    Abstract: A high-durability printhead for an ink cartridge printing system. The printhead includes a substrate having ink ejectors (e.g. resistors) thereon and an orifice plate positioned above the substrate. The orifice plate (which preferably involves a non-metallic polymer film) has a top surface, bottom surface and a plurality of openings therethrough. To improve the durability of the orifice plate, a protective coating is applied to the top surface and/or the bottom surface of the plate. Representative coatings involve dielectric compositions (including diamond-like carbon) or at least one layer of metal. This approach improves the abrasion and deformation resistance of the plate and avoids "ruffling" and "dimpling" problems.
    Type: Grant
    Filed: August 28, 1997
    Date of Patent: December 5, 2000
    Assignee: Hewlett-Packard Company
    Inventors: Lee Van Nice, Gerald E. Heppell, Neal W. Meyer, Donald L. Michael, Kit Baughman, Thach G. Troung, Rui Yang, Moses M. David, James R. White
  • Patent number: 6135586
    Abstract: A pagewide printhead for an inkjet printer employs a stretch-to-fit flex circuit with orifices indexed to reference indentations on the flex circuit. Heater resistors disposed on a block of thermally stable insulating material are indexed to reference features accurately located on the block. The reference indentations are fitted to the reference indentations to provide accurate registration of the orifices to the heater resistors.
    Type: Grant
    Filed: October 31, 1995
    Date of Patent: October 24, 2000
    Assignee: Hewlett-Packard Company
    Inventors: Paul H. McClelland, Douglas A. Sexton, Kit Baughman, Marvin G. Wong, Eldurkar Bhaskar, Marzio Leban
  • Patent number: 6132025
    Abstract: Components of the printing device are attached by a process employing thermo-compressive welding. The process results in a unitary, graded interface between the attached components and eliminates the need for applying thermal-cure adhesives to secure the components.
    Type: Grant
    Filed: October 22, 1997
    Date of Patent: October 17, 2000
    Assignee: Hewlett-Packard Company
    Inventors: Kit Baughman, Paul H. McClelland
  • Patent number: 6062679
    Abstract: A high-durability printhead for an ink cartridge printing system includes a substrate having ink ejectors (e.g. resistors) thereon and an orifice plate positioned above the substrate. The orifice plate (which preferably involves a non-metallic polymer film) has a top surface, bottom surface and a plurality of openings therethrough. To improve the durability of the orifice plate, a protective coating is applied to the top surface and/or the bottom surface of the plate. Representative coatings involve dielectric compositions (including diamond-like carbon) or at least one layer of metal. This approach improves the abrasion and deformation resistance of the plate and avoids "dimpling" problems. Likewise, an intermediate barrier layer of diamond-like carbon is used between the orifice plate and the substrate. As result, an additional level of structural integrity is imparted to the orifice plate and printhead.
    Type: Grant
    Filed: August 28, 1997
    Date of Patent: May 16, 2000
    Assignee: Hewlett-Packard Company
    Inventors: Neal W. Meyer, Donald L. Michael, Lee Van Nice, Gerald E. Heppell, Kit Baughman
  • Patent number: 5718044
    Abstract: Components of the printing device are attached by a process employing thermo-compressive welding. The process results in a unitary, graded interface between the attached components and eliminates the need for applying thermal-cure adhesives to secure the components.
    Type: Grant
    Filed: November 28, 1995
    Date of Patent: February 17, 1998
    Assignee: Hewlett-Packard Company
    Inventors: Kit Baughman, Paul H. McClelland