Abstract: A solderable gold conductor composition is formed by dispersing gold and certain inorganic binders in an inert liquid vehicle composition which can be used to produce conductor patterns which patterns adhere to fired ceramic substrates and to which can be soldered leads of electronic components. Limited ranges in the composition of, and the amount of, the binder particularly the amount of copper oxide are effective to produce adhesion of the composition to fired substrates and in permitting copper leads of electronic devices to be soldered to pads of the gold composition using a lead-indium solder after the composition has been fired on a substrate. Strong solder joints are produced without the necessity for physically or chemically cleaning the pads prior to soldering. The binders comprise certain amounts of the crystalline materials, copper in the form of copper oxides CuO or Cu.sub.2 O, cadmium in the form of CdO, lead in the form of PbF.sub.

Abstract: A solderable conductor pattern is formed on a ceramic substrate. The material of the conductor pattern is made by dispersing gold and certain inorganic binders in an inert liquid vehicle composition. Limited variations in the ranges of the amounts of the material in the composition particularly the range in the amount of copper oxide in the binder produce good adhesion of the pattern to fired substrates and simultaneously provide strong solder joints between leads of electronic devices soldered with a lead-indium solder to pads of a pattern of such material after the pattern has been fired on a substrate without the necessity for physically or chemically cleaning the pads. The binders of the material comprise certain amounts of the crystalline materials, copper in the form of its oxides CuO or Cu.sub.2 O, cadmium in the form of CdO, lead in the form of PbF.sub.2, and the balance being a glass which also contains lead and some cadmium.