Patents by Inventor Kit Ying Wong

Kit Ying Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Implementing self-assembly nanometer-sized structures within metal—polymer interface
    Patent number: 8506751
    Abstract: An adhesion bond between a metallic surface layer and a second surface is formed by treating the layers with a material comprising sulphur-containing molecules. The sulphur-containing molecules are applied as a surface treatment of the surfaces, so that the sulphur-containing molecules act as a coupling agent to bond chemically to both substrates form nanometer-sized structures on the surfaces. The nanometer-sized structures are incorporated into a self-assembly interlayer in between the surfaces, with the interlayer forming a bond to both surfaces.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: August 13, 2013
    Assignee: The Hong Kong University of Science and Technology
    Inventors: Kit Ying Wong, Matthew Ming Fai Yuen, Bing Xu
  • Implementing self-assembly nanometer-sized structures within metal - polymer interface
    Publication number: 20100297450
    Abstract: An adhesion bond between a metallic surface layer and a second surface is formed by treating the layers with a material comprising sulphur-containing molecules. The sulphur-containing molecules are applied as a surface treatment of the surfaces, so that the sulphur-containing molecules act as a coupling agent to bond chemically to both substrates form nanometer-sized structures on the surfaces. The nanometer-sized structures are incorporated into a self-assembly interlayer in between the surfaces, with the interlayer forming a bond to both surfaces.
    Type: Application
    Filed: April 20, 2010
    Publication date: November 25, 2010
    Applicant: The Hong Kong University of Science and Technology
    Inventors: Kit Ying Wong, Matthew Ming Fai Yuen, Bing Xu