Patents by Inventor Kitada Katsutsugu

Kitada Katsutsugu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metallic powder and a paste made from it, and a metallic powder manufacture device
    Patent number: 4904311
    Abstract: A metallic powder which is formed by the extrusion, from multiple microscopic nozzle holes, of molten metal, which while falling and cooling changes shape from a droplet to a generally spherical shape and then solidifies, this microscopic metallic powder (around 20-90 .mu.m in size for example) having non-curved sections in parts of the generally curved surface and being suitable as solder.
    Type: Grant
    Filed: December 29, 1988
    Date of Patent: February 27, 1990
    Assignee: Electroplating Engineers of Japan, Limited
    Inventor: Kitada Katsutsugu