Abstract: Proposed is a solar power equalization system, more particularly, a solar power equalization system, wherein connection of an output-reduced string is switched to a power compensation device for fast charging, and after fast charging, compensation for output is performed, thereby minimizing the influence of the reduction in output of a string on the total output and increasing power generation efficiency.

Abstract: It is introduced that a device of manufacturing lithium sulfate comprising: a reaction body in which a reaction of lithium phosphate and sulfuric acid is performed, the reaction body being divided into an upper space and a lower space; a pressurizer for applying pressure to the inside of the reaction body; a stirrer disposed in the upper space for stirring the lithium phosphate and sulfuric acid to produce a mixture containing lithium sulfate and phosphoric acid; and a filter disposed inside the reaction body and separating the filtrate containing the phosphoric acid into the lower space by filtering the mixture.

Abstract: A cassette for ultra-thin glass includes a pair of plates spaced apart from and facing each other, and a plurality of supports mounted between the pair of plates and including a plurality of mounting grooves that support sides of sheets of ultra-thin glass. Each of the plurality of mounting grooves includes an inclined portion inclined toward a middle of each of the plurality of mounting grooves, and a straight portion extending from the inclined portion and having a constant width in an axial direction of the plurality of supports. A height of the straight portion in a radial direction of the plurality of supports is equal to or greater than a height of the inclined portion in the radial direction.

Abstract: A display device includes a substrate, a first electrode and a second electrode which are spaced apart from each other in a second direction, light-emitting elements spaced apart from each other in the first direction, a first contact electrode electrically contacting the light-emitting elements, and a second contact electrode electrically contacting the light-emitting elements. The first contact electrode electrically contacts the first electrode through a first contact portion disposed on the first electrode, the second contact electrode electrically contacts the second electrode through a second contact portion disposed on the second electrode, the first contact portion is disposed on an end portion in the first direction of the first contact electrode, and the second contact portion is disposed on an end portion in the first direction of the second contact electrode.

Abstract: The present invention relates to a composition comprising glycocholic acid or taurocholic acid and phosphatidylcholine at a particular mixing ratio for reducing localized fat without side effects such as a pain, edema, necrosis of muscle cells, fibroblasts and vascular endothelial cells other than adipocytes, anesthesia of administration sites, extensive swelling, erythema, induration, paresthesia, nodule, pruritus, burning sensation, nerve injury, and dysphagia, and a method for preparing the same. The inventor has found that the effect of PPC injectable composition on fat reduction may be reduced or enhanced during its subcutaneous administration, depending on the types of solubilizing agents, especially the types of bile acids, which are combined so as to prepare a safe and stable PPC injection using insoluble PPC.

Abstract: Disclosed herein are a composition for forming a hard coating layer that is easy to mold, a hard coating layer including the composition, and a laminate including the hard coating layer. The composition may include a hard coating resin, a photoinitiator, a thermal initiator, and a solvent, where the weight ratio of the photoinitiator to the thermal initiator ranges from 1:50 to 10:1.

Abstract: A solid-state drive device includes a memory module in which at least one non-volatile memory device is mounted, a first heat storage unit and a second heat storage unit covering upper and lower parts of the memory module, respectively, to store heat emitted by the memory module, and having at least portions connected to each other, respectively, a cover having a space in which the memory module and the first and second heat storage units are received and arranged with a spacing distance from the first and second heat storage units, respectively, and an inner frame arranged between the cover and at least one of the first and second heat storage units, to provide the spacing distance.

Abstract: An electronic device includes a circuit board including at least one electronic component, a housing accommodating the circuit board, an emissivity control layer disposed in an upper portion of the circuit board and transmitting radiant heat generated by the electronic component, and a temperature controller controlling an amount of the radiant heat transmitted to the housing by adjusting the emissivity of the emissivity control layer. The temperature controller may adjust the emissivity of the emissivity control layer to a first range value, when the electronic device is in an idle state, not performing a foreground operation, and may adjust the emissivity of the emissivity control layer to a second range value, lower than the first range value, when the electronic device is in a busy state, performing the foreground operation.

Abstract: An electronic device includes a circuit board including at least one electronic component, a housing accommodating the circuit board, an emissivity control layer disposed in an upper portion of the circuit board and transmitting radiant heat generated by the electronic component, and a temperature controller controlling an amount of the radiant heat transmitted to the housing by adjusting the emissivity of the emissivity control layer. The temperature controller may adjust the emissivity of the emissivity control layer to a first range value, when the electronic device is in an idle state, not performing a foreground operation, and may adjust the emissivity of the emissivity control layer to a second range value, lower than the first range value, when the electronic device is in a busy state, performing the foreground operation.

Abstract: A solid-state drive device includes a memory module in which at least one non-volatile memory device is mounted, a first heat storage unit and a second heat storage unit covering upper and lower parts of the memory module, respectively, to store heat emitted by the memory module, and having at least portions connected to each other, respectively, a cover having a space in which the memory module and the first and second heat storage units are received and arranged with a spacing distance from the first and second heat storage units, respectively, and an inner frame arranged between the cover and at least one of the first and second heat storage units, to provide the spacing distance.

Abstract: The present invention relates to a composition comprising glycocholic acid or taurocholic acid and phosphatidylcholine at a particular mixing ratio for reducing localized fat without side effects such as a pain, edema, necrosis of muscle cells, fibroblasts and vascular endothelial cells other than adipocytes, anesthesia of administration sites, extensive swelling, erythema, induration, paresthesia, nodule, pruritus, burning sensation, nerve injury, and dysphagia, and a method for preparing the same. The inventor has found that the effect of PPC injectable composition on fat reduction may be reduced or enhanced during its subcutaneous administration, depending on the types of solubilizing agents, especially the types of bile acids, which are combined so as to prepare a safe and stable PPC injection using insoluble PPC.

Abstract: A semiconductor storage device includes a circuit substrate. The circuit substrate includes a main body and a connection tab connected to a side of the main body. The a main body includes a first chip mounting region and a second chip mounting region. A first semiconductor chip of a first type is mounted on the first chip mounting region. A second semiconductor chip of a second type is mounted on the second chip mounting region. The first type of the first semiconductor chip is different from the second type of the second semiconductor chip. The circuit substrate further includes a first thermal via in the connection tab and comprising a conductive material.

Abstract: A semiconductor storage device includes a circuit substrate. The circuit substrate includes a main body and a connection tab connected to a side of the main body. The a main body includes a first chip mounting region and a second chip mounting region. A first semiconductor chip of a first type is mounted on the first chip mounting region. A second semiconductor chip of a second type is mounted on the second chip mounting region. The first type of the first semiconductor chip is different from the second type of the second semiconductor chip. The circuit substrate further includes a first thermal via in the connection tab and comprising a conductive material.

Abstract: A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Abstract: A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Abstract: Disclosed herein are a lead pin for a printed circuit board and a printed circuit board using the same. The lead pin for a printed circuit board includes: a connection pin; and a pin head part formed at one end portion of the connection pin and including a protrusion, the diameter thereof being formed to be increasingly small based on a surface contacting the connection pin and the outer peripheral surface thereof being provided with a protrusion-shaped or depression-shaped band, whereby it forms a protrusion-shaped band or a depression-shaped band on the pin head part of the lead pin to increase a contacting area with the solder, thereby improving an adhesion between the lead pin and the printed circuit board.

Abstract: There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Abstract: A lead pin for a package substrate includes a coupling pin, a head portion, and a flowing prevention portion. The coupling pin is to be inserted into a hole which is formed in an external substrate. The head portion is formed at one end of the coupling pin. The flowing prevention portion is formed on the top surface of the head portion and prevents a solder paste from flowing toward the coupling pin on the top surface of the head portion when the head portion is mounted on the package substrate.

Abstract: Disclosed herein are a lead pin for a printed circuit board and a printed circuit board using the same. The lead pin for a printed circuit board includes: a connection pin; and a pin head part formed at one end portion of the connection pin and including a protrusion, the diameter thereof being formed to be increasingly small based on a surface contacting the connection pin and the outer peripheral surface thereof being provided with a protrusion-shaped or depression-shaped band, whereby it forms a protrusion-shaped band or a depression-shaped band on the pin head part of the lead pin to increase a contacting area with the solder, thereby improving an adhesion between the lead pin and the printed circuit board.

Abstract: Disclosed herein are a lead pin for a package substrate and a package substrate using the same. The lead pin for a package substrate, includes: a connection pin having a first through hole; and a pin head part provided with a groove including a second through hole formed therein and having a first head formed at one end part of the connection pin in a trapezoidal column shape, wherein the first through hole and the groove are connected to each other through the second through hole through which the upper portion and the lower portion the lead pin penetrate each other, whereby voids generated at the time of reflow can be discharged to the outside through the through hole formed in the lead pin, thereby making it possible to reduce a defect rate generated during a process of manufacturing a package substrate.