Abstract: A method for aligning a wafer probing system includes securing a wafer to a movable table; moving the table a predetermined reference position below an image sensing device for sensing a wafer circuit pattern of the wafer; transmitting the sensed wafer circuit pattern to an alignment adjustment device; bringing the table to a correlated reference position; moving the table to a first movement amount below a probing device; comparing the first movement amount to a first stored movement amount data; and moving the table a second stored movement amount such that at least one electrode pad of the wafer contacts a probe of the probing device, wherein the second stored movement amount is determined by comparison of the first movement value with the first stored movement amount data.

Abstract: A wafer inspecting system is provided, in which the inspecting time for one cassette stocking plurality of wafers are shortened. The wafer, which is stored in the cassette among four cassettes stocked in the cassette stocking part, is taken out from the cassette by the automated truck of the wafer conveying system one by one, and then, conveyed to the respective wafer probers by the automated truck. And, the wafer that has been inspected by the respective wafer probers is conveyed to the former cassette and stored by the automated trucks, and further, another wafer to be inspected is taken out from the cassette 36A and conveyed to one of the wafer probers. And, when all wafers stored in the cassette have been inspected, the cassette is taken out from the cassette stocking part and the following steps are performed. As a result, the inspecting time for one cassette can be shortened substantially.