Abstract: When both surfaces of a wafer are sequentially subjected to processing, the wafer is made to be surely supported so that a predetermined processing and transporting can be performed. On one surface of the wafer a first fixing jig (3a) is fixed in close contact. After having performed a predetermined processing to the opposite surface of the wafer, a second fixing jig (3b) is fixed in close contact with the opposite surface of the wafer. The first fixing jig (3a) is removed and the wafer is handed over to the second fixing jig (3b). Each of the fixing jigs is made up of a jig main body (31), and a close contact layer (32) which is disposed on one surface thereof. The jig main body has a plurality of supporting projections (33) to support the close contact layer, and a side wall (34). The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space (35) enclosed by the side wall, between the close contact layer and the jig main body.

Abstract: A fixing jig is made up of a plate-like jig main body (2) and a close contact layer (3) which detachably holds a work (W) in close contact therewith. The jig main body has: on one surface thereof a plurality of supporting projections (4) to support the close contact layer; and also has, along an outer peripheral portion of said one surface, a side wall (5) which is of substantially the same height as the supporting projections. The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space (6) between the close contact layer and the jig main body. By sucking the air within the partitioned space via a ventilation hole (7) formed in the jig main body, the close contact layer is deformed. The work is thus surely supported and fixed also in performing a processing in which a force is applied to the work.

Abstract: A double floor structure capable of being adapted to the conditions of construction and the needs of users at low cost. A double floor structure (K) provided with support legs (1) which are provided on a lower floor and rows of beams which form an upper floor. The support legs (1) are each provided with an upper member (14) which supports a beam from the lower side, an intermediate member (13) which supports the upper member (14) from the lower side, and a lower member (12) which supports the intermediate member (13) from the lower side. The upper member (14), the intermediate member (13), and the lower member (12) consist of metallic, extruded shape material and are disposed in such a manner that the direction of the extrusion is aligned with the top-bottom direction.

Abstract: A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.

Abstract: A double floor structure capable of being adapted to the conditions of construction and the needs of users at low cost. A double floor structure (K) provided with support legs (1) which are provided on a lower floor and rows of beams which form an upper floor. The support legs (1) are each provided with an upper member (14) which supports a beam from the lower side, an intermediate member (13) which supports the upper member (14) from the lower side, and a lower member (12) which supports the intermediate member (13) from the lower side. The upper member (14), the intermediate member (13), and the lower member (12) consist of metallic, extruded shape material and are disposed in such a manner that the direction of the extrusion is aligned with the top-bottom direction.

Abstract: A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.

Abstract: A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.

Abstract: When both surfaces of a wafer are sequentially subjected to processing, the wafer is made to be surely supported so that a predetermined processing and transporting can be performed. On one surface of the wafer a first fixing jig (3a) is fixed in close contact. After having performed a predetermined processing to the opposite surface of the wafer, a second fixing jig (3b) is fixed in close contact with the opposite surface of the wafer. The first fixing jig (3a) is removed and the wafer is handed over to the second fixing jig (3b). Each of the fixing jigs is made up of a jig main body (31), and a close contact layer (32) which is disposed on one surface thereof. The jig main body has a plurality of supporting projections (33) to support the close contact layer, and a side wall (34). The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space (35) enclosed by the side wall, between the close contact layer and the jig main body.

Abstract: A fixing jig is made up of a plate-like jig main body (2) and a close contact layer (3) which detachably holds a work (W) in close contact therewith. The jig main body has: on one surface thereof a plurality of supporting projections (4) to support the close contact layer; and also has, along an outer peripheral portion of said one surface, a side wall (5) which is of substantially the same height as the supporting projections. The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space (6) between the close contact layer and the jig main body. By sucking the air within the partitioned space via a ventilation hole (7) formed in the jig main body, the close contact layer is deformed. The work is thus surely supported and fixed also in performing a processing in which a force is applied to the work.

Abstract: A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.

Abstract: This shielding box comprises a molded body formed like a box having a bottom wall, side walls formed to rise from the outer peripheries of the bottom wall, and an opening described by the edges of the side walls opposite the bottom wall. The side walls are connected to the bottom wall through elastic connectors formed to act as plate springs with respect to the bottom wall, and at least one of the inner surface and outer surface of the molded body is electrically conductive.

Abstract: A pedestal unit usable for a raised floor is disclosed which comprises: a pair of beams; and a pair of pedestal frames for supporting the beams at both ends of the beams, respectively. Each pedestal frame comprises: a pair of leg members; a pair of base plates for supporting the leg members; respectively, and a connecting member with a predetermined length for rigidly connecting the legs member each other with a predetermined interval. The pedestal frame may be installed under a middle portion of the beams, which frame may be installed after installation of pedestal frames at ends of beams for easy adjustment. Additional pedestal frames for supporting additional beams may be fixed to the pedestal frames or the beam. A supporting surface of leg member may have a mount provided by casting and be cut for accurate dimensions.

Abstract: For the purpose of providing a staircase which has a lightweight structure, high efficiency in manufacturing and constructing, and creates a sense of lightness in weight, a staircase is composed with a pair of right and left stringers made of truss structural members (10), and treads (12). The truss structural members (10) are composed of the upper chord members (1) and the lower chord members (2) inclined with the slope of the staircase, and a plurality of lattice members (4) for linking the upper chord members (1) and the lower chord members (2), and between the truss structural members (10) are fixed a plurality of linking members (11) which are laid horizontally at each riser height and on which the treads (12) are fixedly supported.

Abstract: A multicore cable includes a plurality of cables in parallel and is formed by fusion-welding the plurality of cables with a resin jacket. Each of the plurality of cables is formed by winding a shield around a signaling core wire, which is covered with an insulating material, and a grounding core wire. The resin jacket and the shield are stripped so that a stair portion is formed. The stair portion is coated with an electrically conductive adhesive. A vibration is exerted on the grounding core wire, thereby connecting the shield with the grounding core wire with the electrically conductive adhesive. Eventually, the shield and the grounding core wire are bonded with the electrically conductive adhesive. This allows an electrical connection between the shield and the grounding core wire to be maintained in a desirable condition, thus making it possible to suppress a characteristic impedance variation of the signaling core wire caused by an external factor.

Abstract: In a pulley arrangement of a belt-type continuously variable transmission, a ring member (6) integrated with a first cylinder member (3) is coupled to a second cylinder member (5) using splines (6d and 5c) to limit mutual movements of the first and second cylinder members and using snap ring (7) to limit the axial displacement therebetween in peripheral directions of the respective first and second cylinder members. The first cylinder member is slidably contacted on an outer peripheral surface of a hollow cylindrical portion of a second conical pulley component. The second cylinder member is fixed onto an outer peripheral surface of a shaft portion of a first conical pulley component.

Abstract: A multicore cable includes a plurality of cables in parallel and is formed by fusion-welding the plurality of cables with a resin jacket. Each of the plurality of cables is formed by winding a shield around a signaling core wire, which is covered with an insulating material, and a grounding core wire. The resin jacket and the shield are stripped so that a stair portion is formed. The stair portion is coated with an electrically conductive adhesive. A vibration is exerted on the grounding core wire, thereby connecting the shield with the grounding core wire with the electrically conductive adhesive. Eventually, the shield and the grounding core wire are bonded with the electrically conductive adhesive. This allows an electrical connection between the shield and the grounding core wire to be maintained in a desirable condition, thus making it possible to suppress a characteristic impedance variation of the signaling core wire caused by an external factor.

Abstract: In a pulley working fluid (oil) passage arrangement for a belt-type continuously variable transmission having a V belt wound about a letter V-shaped groove formed with mutually opposing oblique surfaces of movable and stationary sheaves and a working fluid pressure cylinder chamber to which a working fluid pressure is supplied so as to move the movable sheave toward or away from the stationary sheave, thus a gear shift being varied, a first working fluid passage communicated with an axle chamber working fluid passage is extended in an axial direction of the axle member at an opposing surface thereof against the axle member and the movable sheave and a second working fluid passage having one end communicated with the first working fluid passage and the other end opened to a working fluid pressure cylinder chamber is extended along a radial direction of the axle member.

Abstract: A continuously variable transmission includes a main shaft having a stepped portion in the vicinity of an end thereof, stationary and movable flanges, and a stopper for preventing a movement of the movable flange. The stepped portion of the main shaft, an end of the movable flange, and the stopper cooperate to define a space around the main shaft.

Abstract: Proposed is a novel electroconductive composite plastic resin sheet consisting of an insulating base sheet of a plastic resin and an electroconductive coating layer formed on at least one of the surfaces of the base sheet, which is suitable as a material of a carrier tape used in transportation, storage and mounting works of chip-formed electronic devices such as ICs. The electroconductive composite plastic resin sheet of the invention characteristically consists of:(A) a base sheet having a thickness in the range from 100 to 1000 .mu.m formed from an electrically insulating polystyrene-based plastic resin; and(B) a coating layer having a thickness in the range from 0.1 to 30 .mu.

Abstract: A pulley device for a continuously variable transmission includes a shaft having first and second ends, the second end being formed with two axially separated ring grooves. A C-shaped ring is engaged with one of the two ring grooves disposed near to a movable conical plate. A ring-shaped retainer is arranged to restrain radial movement of the C-shaped ring. A snap ring is engaged with the other of the two ring grooves to restrain an axial position of the retainer.