Patents by Inventor KIYOHARU MOMOSAKI

KIYOHARU MOMOSAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solid-state image pickup apparatus, method of manufacturing solid-state image pickup apparatus, and electronic apparatus
    Patent number: 11177300
    Abstract: A size reduction of an image pickup module by using resin molding, including a reduction in height, area, or the like thereof is achieved in an actual product. Provided is a module, including a substrate; a semiconductor component in which a first surface of a semiconductor device manufactured by chip-size packaging is provided and fixed along a plate-shaped translucent member, and a second surface of the semiconductor device is fixed with the second surface caused to face the substrate; a frame portion made of resin and formed on the substrate to surround the semiconductor component; and an interposition member which is made of resin and with which a gap between the semiconductor component and the substrate is filled. The interposition member is connected and fixed to the frame portion to be integrated therewith.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: November 16, 2021
    Assignee: SONY CORPORATION
    Inventors: Hirokazu Seki, Go Asayama, Kiyoharu Momosaki, Rei Takamori, Masakazu Baba
  • SOLID-STATE IMAGE PICKUP APPARATUS, METHOD OF MANUFACTURING SOLID-STATE IMAGE PICKUP APPARATUS, AND ELECTRONIC APPARATUS
    Publication number: 20180083056
    Abstract: A size reduction of an image pickup module by using resin molding, including a reduction in height, area, or the like thereof is achieved in an actual product. Provided is a module, including a substrate; a semiconductor component in which a first surface of a semiconductor device manufactured by chip-size packaging is provided and fixed along a plate-shaped translucent member, and a second surface of the semiconductor device is fixed with the second surface caused to face the substrate; a frame portion made of resin and formed on the substrate to surround the semiconductor component; and an interposition member which is made of resin and with which a gap between the semiconductor component and the substrate is filled. The interposition member is connected and fixed to the frame portion to be integrated therewith.
    Type: Application
    Filed: March 2, 2016
    Publication date: March 22, 2018
    Applicant: SONY CORPORATION
    Inventors: HIROKAZU SEKI, GO ASAYAMA, KIYOHARU MOMOSAKI, REI TAKAMORI, MASAKAZU BABA