Patents by Inventor Kiyoharu Takano

Kiyoharu Takano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pop semiconductor device manufacturing method
    Patent number: 8048358
    Abstract: The objective of the invention is to prevent electrostatic destruction of semiconductor chips during resin molding. With the semiconductor device manufacturing method, a substrate 400 that includes on the surface multiple semiconductor chips 410 and liquid resin 434 supplied to multiple semiconductor devices is supported by an electrically insulated lower die 200. An upper die 110 in which multiple shape-forming parts (cavities) 112 are formed is pressed against lower die 200 through the medium of a polymer release film 300, and liquid resin 434 on the substrate is molded.
    Type: Grant
    Filed: September 24, 2009
    Date of Patent: November 1, 2011
    Assignee: Texas Instruments Incorporated
    Inventors: Kiyoharu Takano, Makoto Yoshino, Yoshimi Takahashi
  • POP Semiconductor Device Manufacturing Method
    Publication number: 20100015759
    Abstract: The objective of the invention is to prevent electrostatic destruction of semiconductor chips during resin molding. With the semiconductor device manufacturing method, a substrate 400 that includes on the surface multiple semiconductor chips 410 and liquid resin 434 supplied to multiple semiconductor devices is supported by an electrically insulated lower die 200. An upper die 110 in which multiple shape-forming parts (cavities) 112 are formed is pressed against lower die 200 through the medium of a polymer release film 300, and liquid resin 434 on the substrate is molded.
    Type: Application
    Filed: September 24, 2009
    Publication date: January 21, 2010
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Kiyoharu TAKANO, Makoto YOSHINO, Yoshimi TAKAHASHI
  • POP Semiconductor Device Manufacturing Method
    Publication number: 20070243667
    Abstract: The objective of the invention is to prevent electrostatic destruction of semiconductor chips during resin molding. With the semiconductor device manufacturing method, a substrate 400 that includes on the surface multiple semiconductor chips 410 and liquid resin 434 supplied to multiple semiconductor devices is supported by an electrically insulated lower die 200. An upper die 110 in which multiple shape-forming parts (cavities) 112 are formed is pressed against lower die 200 through the medium of a polymer release film 300, and liquid resin 434 on the substrate is molded.
    Type: Application
    Filed: April 16, 2007
    Publication date: October 18, 2007
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Kiyoharu Takano, Makoto Yoshino, Yoshimi Takahashi