Patents by Inventor Kiyohide Misawa

Kiyohide Misawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface acoustic wave device, communication device using the same, and antenna duplexer
    Patent number: 6469593
    Abstract: A surface acoustic wave device includes a package having a coefficient of linear expansion; and a piezoelectric element forming a surface acoustic wave element, and mounted on the package by a flip chip bonding. The piezoelectric element has different coefficients of linear expansion in a direction of propagation of surface acoustic waves generated by an interdigital electrode of the surface acoustic wave element and in a vertical direction thereto, and further has a long side existing to a direction having a coefficient of linear expansion close to the coefficient of linear expansion of the package. The piezoelectric element is cut out from a single crystal having X, Y, and Z crystal axes, and the X crystal axis agrees with a direction of propagation of the surface acoustic wave.
    Type: Grant
    Filed: January 11, 2001
    Date of Patent: October 22, 2002
    Assignee: Fujitsu Media Devices Limited
    Inventors: Toshio Nishizawa, Masanori Ueda, Osamu Kawauchi, Kiyohide Misawa, Hiroyuki Furusato
  • Surface-acoustic-wave device for flip-chip mounting
    Patent number: 6417574
    Abstract: A SAW device includes a piezoelectric substrate and a package body holding the piezoelectric substrate, wherein the package body includes a bottom part carrying the piezoelectric substrate in a face-down state and a side wall part laterally surrounding the piezoelectric substrate, the bottom part carrying a wiring pattern for electrical connection with an electrode pattern on the piezoelectric substrate, the wiring pattern including a first ground pattern and a second ground pattern in a mutually separated relationship, the first ground pattern and the second ground pattern being connected electrically with each other.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: July 9, 2002
    Assignee: Fujitsu Media Devices Limted
    Inventors: Kiyohide Misawa, Osamu Kawachi, Hiroyuki Furusato, Masanori Ueda
  • Surface acoustic wave device, communication device using the same, and antenna duplexer
    Publication number: 20020057141
    Abstract: A surface acoustic wave device includes a package having a coefficient of linear expansion; and a piezoelectric element forming a surface acoustic wave element, and mounted on the package by a flip chip bonding. The piezoelectric element has different coefficients of linear expansion in a direction of propagation of surface acoustic waves generated by an interdigital electrode of the surface acoustic wave element and in a vertical direction thereto, and further has a long side existing to a direction having a coefficient of linear expansion close to the coefficient of linear expansion of the package. The piezoelectric element is cut out from a single crystal having X, Y, and Z crystal axes, and the X crystal axis agrees with a direction of propagation of the surface acoustic wave.
    Type: Application
    Filed: January 11, 2001
    Publication date: May 16, 2002
    Applicant: FUJITSU MEDIA DEVICES LIMITED
    Inventors: Toshio Nishizawa, Masanori Ueda, Osamu Kawauchi, Kiyohide Misawa, Hiroyuki Furusato