Abstract: A wafer box having a variable wafer slot size including a wafer box body of a rectangular parallelpiped shape having parallel wafer inserting grooves formed in inner side surfaces thereof extending in a vertical direction, a plurality of parallel fixing plate inserting grooves formed in the end surfaces and extending in a vertical direction, and an open upper part. At least one fixing plate, also having a plurality of wafer receiving grooves formed on at least one surface thereof, is inserted into a selected pair of the fixing plate inserting grooves. Both ends of the plate are shaped so as to be easily insertable and removable. Buffer members are placed between the side surfaces in the upper and lower portions of the box to support the wafers from the upper and lower sides thereof. A closure covers the upper part of the box.

Abstract: A process for producing a circular gallium arsenide wafer including the steps of growing a gallium arsenide single-crystal boule in the form of a longitudinal half of a cylinder by the boat method in such a manner that the intersection of the flat surface produced by the boat method and the plane vertical to the direction of crystal growth extends in a <110> direction, slicing the boule into wafers to expose a (100) plane or a plane inclined within 0.5 to 5 degress with respect to the (100) plane, assembling the resulting triangular-like wafers into a triangular-like prism, grinding the opposite edges of the flat surface of the outer periphery of the triangular-like prism of wafers in a direction in which the wafers are assembled; and separating the triangular-like prism into discrete circular wafers.