Patents by Inventor Kiyohiko Mihara

Kiyohiko Mihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for preparing semiconductor devices
    Patent number: 4217689
    Abstract: A process for preparing semiconductor devices by forming an insulation coating, such as a low melting point glass, on the surface of a semiconductor substrate and then forming a shaved groove through the insulation coating to the inner part of the semiconductor substrate. The insulation coating is one that is easily subject to cracking when shaved by a high speed rotating diamond blade having substantially parallel side surfaces.The low melting point glass and the semiconductor substrate are shaved by a diamond blade having a tapered edge which rotates in high speed, without forming a crack in the insulation coating or breaking a part of the semiconductor substrate. The semiconductor substrate is divided along the shaved groove in a dicing step to obtain separated semiconductor pellets.
    Type: Grant
    Filed: July 6, 1977
    Date of Patent: August 19, 1980
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshiyuki Fujii, Kiyohiko Mihara, Shigeru Hokuyo, Yoshio Ishibashi