Patents by Inventor Kiyohiro Isogawa

Kiyohiro Isogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making semiconductor device
    Patent number: 7071034
    Abstract: A semiconductor device includes a first lead having an inner portion on which a semiconductor chip is mounted, a second lead having an inner portion electrically connected to the semiconductor chip via a wire and a resin package for sealing the semiconductor chip and the wire. The inner portions, the semiconductor chip and the wire are coated with a coating film formed of amorphous fluororesin.
    Type: Grant
    Filed: January 12, 2005
    Date of Patent: July 4, 2006
    Assignee: Rohm Co., Ltd.
    Inventors: Takashi Ueda, Kiyohiro Isogawa
  • Semiconductor device with coated semiconductor chip
    Patent number: 6940184
    Abstract: A semiconductor device includes a first lead having an inner portion on which a semiconductor chip is mounted, a second lead having an inner portion electrically connected to the semiconductor chip via a wire and a resin package for sealing the semiconductor chip and the wire. The inner portions, the semiconductor chip and the wire are coated with a coating film formed of amorphous fluororesin.
    Type: Grant
    Filed: January 11, 2002
    Date of Patent: September 6, 2005
    Assignee: Rohm Co., Ltd.
    Inventors: Takashi Ueda, Kiyohiro Isogawa
  • Method of making semiconductor device
    Publication number: 20050127507
    Abstract: A semiconductor device includes a first lead having an inner portion on which a semiconductor chip is mounted, a second lead having an inner portion electrically connected to the semiconductor chip via a wire and a resin package for sealing the semiconductor chip and the wire. The inner portions, the semiconductor chip and the wire are coated with a coating film formed of amorphous fluororesin.
    Type: Application
    Filed: January 12, 2005
    Publication date: June 16, 2005
    Applicant: ROHM CO., LTD.
    Inventors: Takashi Ueda, Kiyohiro Isogawa
  • Semiconductor device and method of making the same
    Publication number: 20020093081
    Abstract: A semiconductor device includes a first lead having an inner portion on which a semiconductor chip is mounted, a second lead having an inner portion electrically connected to the semiconductor chip via a wire and a resin package for sealing the semiconductor chip and the wire. The inner portions, the semiconductor chip and the wire are coated with a coating film formed of amorphous fluororesin.
    Type: Application
    Filed: January 11, 2002
    Publication date: July 18, 2002
    Applicant: Rohm Co., Ltd.
    Inventors: Takashi Ueda, Kiyohiro Isogawa