Patents by Inventor Kiyohisa Tateyama
Kiyohisa Tateyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20170084470Abstract: A drying time after cleaning a surface of a cleaning target including a wall which constitutes a processing chamber of a substrate processing apparatus and a device provided within the processing chamber can be shortened. After performing a cleaning process of dissolving a removal target adhering to the surface of the cleaning target with water by discharging the water into the processing chamber 20 and allowing the surface of the cleaning target 42, 20a and 53 to be wet with the water, a solvent supplying process of supplying a solvent having higher volatility than the water toward the water adhering to the surface of the cleaning target is performed by discharging the solvent into the processing chamber. Then, a drying process of drying the surface of the cleaning target is performed.Type: ApplicationFiled: September 13, 2016Publication date: March 23, 2017Inventors: Hiroyuki Suzuki, Takahisa Otsuka, Kiyohisa Tateyama, Takashi Nakazawa
-
Patent number: 7182531Abstract: In this developing method and apparatus, a concentration measuring unit 222 picks part of developing fluid in a blending tank 186 to measure the resist concentration by an absorption photometry and feeds the detected resist concentration to a control unit 240. The control unit 240 controls respective valves 210, 212, 216 of a TMAH concentrate solution 200, a solvent pipe 204 and a drain pipe 208 in a manner that the developing fluid in the blending tank 186 has a TMAH concentration corresponding to a measured resist-concentration value to accomplish a constant developing rate, performing component control of the developing fluid. The developing fluid transferred from the blending tank 186 to a supply tank 188 is fed to a developer nozzle DN in a developing section 126 through a developer pipe 224 owing to the drive of a pump 228. Accordingly, even if the developing fluid is reused in the developing process in multiple times, it is possible to make sure of the uniformity in development.Type: GrantFiled: June 29, 2006Date of Patent: February 27, 2007Assignee: Tokyo Electron LimitedInventors: Kiyohisa Tateyama, Masafumi Nomura, Taketora Shinogi
-
Publication number: 20060246384Abstract: In this developing method and apparatus, a concentration measuring unit 222 picks part of developing fluid in a blending tank 186 to measure the resist concentration by an absorption photometry and feeds the detected resist concentration to a control unit 240. The control unit 240 controls respective valves 210, 212, 216 of a TMAH concentrate solution 200, a solvent pipe 204 and a drain pipe 208 in a manner that the developing fluid in the blending tank 186 has a TMAH concentration corresponding to a measured resist-concentration value to accomplish a constant developing rate, performing component control of the developing fluid. The developing fluid transferred from the blending tank 186 to a supply tank 188 is fed to a developer nozzle DN in a developing section 126 through a developer pipe 224 owing to the drive of a pump 228. Accordingly, even if the developing fluid is reused in the developing process in multiple times, it is possible to make sure of the uniformity in development.Type: ApplicationFiled: June 29, 2006Publication date: November 2, 2006Applicant: TOKYO ELECTRON LIMITEDInventors: Kiyohisa Tateyama, Masafumi Nomura, Taketora Shinogi
-
Patent number: 7101646Abstract: In this developing method and apparatus, a concentration measuring unit 222 picks part of developing fluid in a blending tank 186 to measure the resist concentration by an absorption photometry and feeds the detected resist concentration to a control unit 240. The control unit 240 controls respective valves 210, 212, 216 of a TMAH concentrate solution 200, a solvent pipe 204 and a drain pipe 208 in a manner that the developing fluid in the blending tank 186 has a TMAH concentration corresponding to a measured resist-concentration value to accomplish a constant developing rate, performing component control of the developing fluid. The developing fluid transferred from the blending tank 186 to a supply tank 188 is fed to a developer nozzle DN in a developing section 126 through a developer pipe 224 owing to the drive of a pump 228. Accordingly, even if the developing fluid is reused in the developing process in multiple times, it is possible to make sure of the uniformity in development.Type: GrantFiled: September 20, 2005Date of Patent: September 5, 2006Assignee: Tokyo Electron LimitedInventors: Kiyohisa Tateyama, Masafumi Nomura, Taketora Shinogi
-
Publication number: 20060024622Abstract: In this developing method and apparatus, a concentration measuring unit 222 picks part of developing fluid in a blending tank 186 to measure the resist concentration by an absorption photometry and feeds the detected resist concentration to a control unit 240. The control unit 240 controls respective valves 210, 212, 216 of a TMAH concentrate solution 200, a solvent pipe 204 and a drain pipe 208 in a manner that the developing fluid in the blending tank 186 has a TMAH concentration corresponding to a measured resist-concentration value to accomplish a constant developing rate, performing component control of the developing fluid. The developing fluid transferred from the blending tank 186 to a supply tank 188 is fed to a developer nozzle DN in a developing section 126 through a developer pipe 224 owing to the drive of a pump 228. Accordingly, even if the developing fluid is reused in the developing process in multiple times, it is possible to make sure of the uniformity in development.Type: ApplicationFiled: September 20, 2005Publication date: February 2, 2006Applicant: TOKYO ELECTRON LIMITEDInventors: Kiyohisa Tateyama, Masafumi Nomura, Taketora Shinogi
-
Patent number: 6969572Abstract: In this developing method and apparatus, a concentration measuring unit 222 picks part of developing fluid in a blending tank 186 to measure the resist concentration by an absorption photometry and feeds the detected resist concentration to a control unit 240. The control unit 240 controls respective valves 210, 212, 216 of a TMAH concentrate solution 200, a solvent pipe 204 and a drain pipe 208 in a manner that the developing fluid in the blending tank 186 has a TMAH concentration corresponding to a measured resist-concentration value to accomplish a constant developing rate, performing component control of the developing fluid. The developing fluid transferred from the blending tank 186 to a supply tank 188 is fed to a developer nozzle DN in a developing section 126 through a developer pipe 224 owing to the drive of a pump 228. Accordingly, even if the developing fluid is reused in the developing process in multiple times, it is possible to make sure of the uniformity in development.Type: GrantFiled: November 13, 2003Date of Patent: November 29, 2005Assignee: Tokyo Electron LimitedInventors: Kiyohisa Tateyama, Masafumi Nomura, Taketora Shinogi
-
Patent number: 6962477Abstract: A substrate transfer apparatus capable of preventing contaminants from sticking to a substrate again when the substrate is unloaded, wherein a first support member and a second support member are provided on an arm, the first support member supporting the substrate when the substrate is loaded into a processing machine and the second support member supporting the substrate when the substrate is unloaded from the processing machine.Type: GrantFiled: November 16, 2004Date of Patent: November 8, 2005Assignee: Tokyo Electron LimitedInventors: Kiyohisa Tateyama, Hideyuki Takamori
-
Patent number: 6889764Abstract: A cooling device for cooling an object to be processed to a target temperature comprises a plurality of contact members mounted on a placing table, for supporting the object such that the object opposes a top surface of the placing table with an interval, temperature sensors for outputting temperature information of the object supported by the contact members, a first cooling unit for cooling the placing table to a temperature lower than the target temperature to cool the object, a second cooling unit for heating the object cooled by the first cooling unit to a temperature almost equal to the target temperature, and a contrast circuit for performing a switching operation between cooling by the first cooling unit and heating by the second cooling unit on the basis of the temperature information from the temperature sensors.Type: GrantFiled: March 8, 2001Date of Patent: May 10, 2005Assignee: Tokyo Electron LimitedInventors: Tetsuya Sada, Osamu Hirose, Kiyohisa Tateyama
-
Publication number: 20050095115Abstract: A substrate transfer apparatus capable of preventing contaminants from sticking to a substrate again when the substrate is unloaded, wherein a first support member and a second support member are provided on an arm, the first support member supporting the substrate when the substrate is loaded into a processing machine and the second support member supporting the substrate when the substrate is unloaded from the processing machine.Type: ApplicationFiled: November 16, 2004Publication date: May 5, 2005Inventors: Kiyohisa Tateyama, Hideyuki Takamori
-
Patent number: 6837672Abstract: A substrate transfer apparatus capable of preventing contaminants from sticking to a substrate again when the substrate is unloaded, wherein a first support member and a second support member are provided on an arm, the first support member supporting the substrate when the substrate is loaded into a processing machine and the second support member supporting the substrate when the substrate is unloaded from the processing machine.Type: GrantFiled: October 2, 2000Date of Patent: January 4, 2005Assignee: Tokyo Electron LimitedInventors: Kiyohisa Tateyama, Hideyuki Takamori
-
Patent number: 6799910Abstract: After the first workpieces have been processed in the first process portion while the second workpieces are being processed in the second process portion, the first process portion in which the first process condition has been set for the third process condition. By repeating such processes, a plurality of workpieces can be successively processed in different types of process conditions.Type: GrantFiled: May 9, 2003Date of Patent: October 5, 2004Assignee: Tokyo Electron LimitedInventor: Kiyohisa Tateyama
-
Patent number: 6749688Abstract: A coating apparatus has a spin chuck for attracting and holding a semiconductor wafer in a horizontal state by means of vacuum. A movable beam is arranged above the spin chuck. The movable beam includes first and second nozzles integrally formed. The first nozzle is used for supplying a photo-resist liquid while the second nozzle is used for supplying a solvent for the photo-resist liquid. When a coating process is performed, the movable beam above the wafer is horizontally moved in one direction. The solvent is first supplied onto the wafer from the second nozzle, and the coating or photo-resist liquid is then supplied from the first nozzle, following the solvent. Wettability of the wafer relative to the photo-resist is increased by the solvent, prior to supply of the photo-resist liquid.Type: GrantFiled: March 17, 1999Date of Patent: June 15, 2004Assignee: Tokyo Electron LimitedInventors: Kiyohisa Tateyama, Kimio Motoda, Noriyuki Anai
-
Publication number: 20040096760Abstract: In this developing method and apparatus, a concentration measuring unit 222 picks part of developing fluid in a blending tank 186 to measure the resist concentration by an absorption photometry and feeds the detected resist concentration to a control unit 240. The control unit 240 controls respective valves 210, 212, 216 of a TMAH concentrate solution 200, a solvent pipe 204 and a drain pipe 208 in a manner that the developing fluid in the blending tank 186 has a TMAH concentration corresponding to a measured resist-concentration value to accomplish a constant developing rate, performing component control of the developing fluid. The developing fluid transferred from the blending tank 186 to a supply tank 188 is fed to a developer nozzle DN in a developing section 126 through a developer pipe 224 owing to the drive of a pump 228. Accordingly, even if the developing fluid is reused in the developing process in multiple times, it is possible to make sure of the uniformity in development.Type: ApplicationFiled: November 13, 2003Publication date: May 20, 2004Applicant: TOKYO ELECTRON LIMITEDInventors: Kiyohisa Tateyama, Masafumi Nomura, Taketora Shinogi
-
Patent number: 6706322Abstract: A drive pulley is disposed to a driving motor. A plurality of follower pulleys are disposed to a rotating shaft of a spin chuck that vacuum sucks a substrate. A belt is passed from one follower pulley to the drive pulley. Belts are passed from the other follower pulleys to the drive shafts of a plurality of air motors. Since the air motors assist the driving of the driving motor, a large substrate can be rotated at a predetermined rotating acceleration. Thus, a film forming apparatus and a film forming method that allow the quantity of process solution supplied to be reduced and a film of process solution to be equally formed on a substrate can be provided.Type: GrantFiled: February 5, 2002Date of Patent: March 16, 2004Assignee: Tokyo Electron LimitedInventors: Kiyohisa Tateyama, Tsutae Omori
-
Publication number: 20030210907Abstract: After the first workpieces have been processed in the first process portion while the second workpieces are being processed in the second process portion, the first process portion in which the first process condition has been set for the third process condition. By repeating such processes, a plurality of workpieces can be successively processed in different types of process conditions.Type: ApplicationFiled: May 9, 2003Publication date: November 13, 2003Applicant: TOKYO ELECTRON LIMITEDInventor: Kiyohisa Tateyama
-
Patent number: 6635113Abstract: A substrate is held on a spin chuck, and resist solution is supplied to the surface of the substrate at a plurality of positions spaced at predetermined intervals from a plurality of resist nozzles provided the bottom surface of a resist pipe provided over a first direction across the surface of the substrate. Thereafter, the substrate is oscillated or rotated, thereby making the resist solution on the substrate a thin coating film with a uniform thickness. In the coating apparatus and method, which are excellent in responsiveness to a degree of viscosity of coating solution, various kinds of treatment agents with a wide range of viscosity can be used, and mechanical accuracy such as the space between the nozzles and the substrate, accuracy of the nozzle size, and the like can be loosened.Type: GrantFiled: May 18, 1999Date of Patent: October 21, 2003Assignee: Tokyo Electron LimitedInventors: Hideyuki Takamori, Noriyuki Anai, Masafumi Nomura, Kiyohisa Tateyama, Tsutae Omori
-
Publication number: 20020187423Abstract: A substrate coated with a coating solution, for example, a resist solution is heated at a predetermined temperature, thereafter putted in a non-heated state, and then heated at a second predetermined temperature. Alternatively, a heating process in which a substrate coated with a resist solution is heated and a non-heated process in which the substrate is putted in a non-heated state are repeated a plurality of times. The adoption of the above treating methods can prevent the occurrence of transfer which is an index of ununiformity of film thickness of a resist solution and the like and change in line width of a circuit pattern, thus improving yield in substrate treatment.Type: ApplicationFiled: August 7, 2002Publication date: December 12, 2002Inventors: Hideyuki Takamori, Kiyohisa Tateyama, Kengo Mizosaki, Noriyuki Anai, Yoshitaka Matsuda
-
Publication number: 20020152954Abstract: A substrate is held on a spin chuck, and resist solution is supplied to the surface of the substrate at a plurality of positions spaced at predetermined intervals from a plurality of resist nozzles provided the bottom surface of a resist pipe provided over a first direction across the surface of the substrate. Thereafter, the substrate is oscillated or rotated, thereby making the resist solution on the substrate a thin coating film with a uniform thickness. In the coating apparatus and method, which are excellent in responsiveness to a degree of viscosity of coating solution, various kinds of treatment agents with a wide range of viscosity can be used, and mechanical accuracy such as the space between the nozzles and the substrate, accuracy of the nozzle size, and the like can be loosened.Type: ApplicationFiled: May 18, 1999Publication date: October 24, 2002Inventors: HIDEYUKI TAKAMORI, NORIYUKI ANAI, MASAFUMI NOMURA, KIYOHISA TATEYAMA, TSUTAE OMORI
-
Patent number: 6451515Abstract: A substrate coated with a coating solution, for example, a resist solution is heated at a predetermined temperature, thereafter putted in a non-heated state, and then heated at a second predetermined temperature. Alternatively, a heating process in which a substrate coated with a resist solution is heated and a non-heated process in which the substrate is putted in a non-heated state are repeated a plurality of times. The adoption of the above treating methods can prevent the occurrence of transfer which is an index of ununiformity of film thickness of a resist solution and the like and change in line width of a circuit pattern, thus improving yield in substrate treatment.Type: GrantFiled: August 4, 1999Date of Patent: September 17, 2002Assignee: Tokyo Electron LimitedInventors: Hideyuki Takamori, Kiyohisa Tateyama, Kengo Mizosaki, Noriyuki Anai, Yoshitaka Matsuda
-
Patent number: 6443641Abstract: Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.Type: GrantFiled: June 6, 2001Date of Patent: September 3, 2002Assignee: Tokyo Electron LimitedInventors: Hideyuki Takamori, Kiyohisa Tateyama, Kengo Mizosaki, Noriyuki Anai, Mitsuhiro Sakai, Shinobu Tanaka, Yoichi Honda, Yuji Shimomura