Patents by Inventor Kiyohito Ishida

Kiyohito Ishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11066728
    Abstract: The present invention relates to a Ni-based heat-resistant alloy including Ir: 5.0 mass % or more and 50.0 mass % or less, Al: 1.0 mass % or more and 8.0 mass % or less, W: 5.0 mass % or more and 25.0 mass % or less, and balance Ni, having an L12-structured ?? phase present in the matrix, and including at least one of Zr: 0.01 mass % or more and 3.0 mass % or less and Hf: 0.01 mass % or more and 3.0 mass % or less. This Ni-based heat-resistant alloy has improved toughness over a conventional Ni-based heat-resistant alloy based on a Ni—Ir—Al—W-based alloy, and is also excellent in ambient-temperature strength.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: July 20, 2021
    Assignees: TOHOKU TECHNO ARCH CO., LTD., TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Kiyohito Ishida, Toshihiro Omori, Yutaka Sato, Koichi Sakairi, Kunihiro Tanaka, Tatsuya Nakazawa
  • Patent number: 11053570
    Abstract: The present invention relates to a Ni-based heat-resistant alloy including Ir: 5.0 mass % or more and 50.0 mass % or less, Al: 1.0 mass % or more and 8.0 mass % or less, W: 5.0 mass % or more and 25.0 mass % or less, and balance Ni, having an L12-structured ?? phase present in the matrix, and including at least one of Ru: 0.8 mass % or more and 5.0 mass % or less and Re: 0.8 mass % or more and 5.0 mass % or less. This Ni-based heat-resistant alloy has improved toughness over a conventional Ni-based heat-resistant alloy based on a Ni—Ir—Al—W-based alloy, and is also excellent in ambient-temperature strength.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: July 6, 2021
    Assignees: TOHOKU TECHNO ARCH CO., LTD., TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Kiyohito Ishida, Toshihiro Omori, Yutaka Sato, Koichi Sakairi, Kunihiro Tanaka, Tatsuya Nakazawa
  • Publication number: 20190338398
    Abstract: The present invention relates to a Ni-based heat-resistant alloy including Ir: 5.0 mass % or more and 50.0 mass % or less, Al: 1.0 mass % or more and 8.0 mass % or less, W: 5.0 mass % or more and 25.0 mass % or less, and balance Ni, having an L12-structured ?? phase present in the matrix, and including at least one of Ru: 0.8 mass % or more and 5.0 mass % or less and Re: 0.8 mass % or more and 5.0 mass % or less. This Ni-based heat-resistant alloy has improved toughness over a conventional Ni-based heat-resistant alloy based on a Ni—Ir—Al—W-based alloy, and is also excellent in ambient-temperature strength.
    Type: Application
    Filed: December 4, 2017
    Publication date: November 7, 2019
    Applicants: TOHOKU TECHNO ARCH CO., LTD., TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Kiyohito ISHIDA, Toshihiro OMORI, Yutaka SATO, Koichi SAKAIRI, Kunihiro TANAKA, Tatsuya NAKAZAWA
  • Publication number: 20190316229
    Abstract: The present invention relates to a Ni-based heat-resistant alloy including Ir: 5.0 mass % or more and 50.0 mass % or less, Al: 1.0 mass % or more and 8.0 mass % or less, W: 5.0 mass % or more and 25.0 mass % or less, and balance Ni, having an L12-structured ?? phase present in the matrix, and including at least one of Zr: 0.01 mass % or more and 3.0 mase/0 or less and Hf: 0.01 mass % or more and 3.0 mass % or less. This Ni-based heat-resistant alloy has improved toughness over a conventional Ni-based heat-resistant alloy based on a Ni—Ir—Al—W-based alloy, and is also excellent in ambient-temperature strength.
    Type: Application
    Filed: December 5, 2017
    Publication date: October 17, 2019
    Applicants: TOHOKU TECHNO ARCH CO., LTD., TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Kiyohito ISHIDA, Toshihiro OMORI, Yutaka SATO, Koichi SAKAIRI, Kunihiro TANAKA, Tatsuya NAKAZAWA
  • Patent number: 10351939
    Abstract: A Cu—Al—Mn-based alloy having superelastic characteristics and having a recrystallized texture substantially formed of a ? single phase, in which 70% or more of crystal grains is within a range of 0° to 50° in a deviation angle from <001> orientation of a crystalline orientation measured in a working direction by electron back-scatter diffraction patterning.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: July 16, 2019
    Assignees: TOHOKU UNIVERSITY, FURUKAWA TECHNO MATERIAL CO., LTD., FURUKAWA ELECTRIC CO., LTD.
    Inventors: Toshihiro Omori, Shingo Kawata, Ryosuke Kainuma, Kiyohito Ishida, Toyonobu Tanaka, Kenji Nakamizo, Sumio Kise, Koji Ishikawa, Misato Nakano, Satoshi Teshigawara
  • Patent number: 10094012
    Abstract: The present invention relates to a NiIr-base heat-resistant alloy which includes a Ni—Ir—Al—W-base alloy which contains Ir: 5.0 to 50.0 mass %, Al: 1.0 to 8.0 mass %, W: 5.0 to 20.0 mass %, and the balance is Ni, and a ?? phase having an L12 structure precipitating and dispersing in a matrix as an essential strengthening phase, and a ratio (Y/X) of a peak intensity (Y) of (201) plane of the Ir3W phase observed in the range of 2?=48° to 50° to a peak intensity (X) of (111) plane of the ?? phase observed in the range of 2?=43° to 45° in X-ray diffraction analysis is 0.5 or less. The alloy exhibits good high-temperature property stably.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: October 9, 2018
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Kiyohito Ishida, Toshihiro Omori, Yutaka Sato, Kunihiro Tanaka, Muneki Nakamura, Koichi Sakairi, Tatsuya Nakazawa
  • Patent number: 10081855
    Abstract: The present invention is a heat-resistant Ni-base alloy including a Ni—Ir—Al—W alloy having essential additive elements of Ir, Al, and W added to Ni, wherein the heat-resistant Ni-base alloy includes Ir: 5.0 to 50.0 mass %, Al: 1.0 to 8.0 mass %, and W: 5.0 to 20.0 mass %, the balance being Ni, and a ?? phase having an L12 structure disperses in a matrix as an essential strengthening phase. The heat-resistant material including the Ni-base alloy may contain one or more additive elements selected from B: 0.001 to 0.1 mass %, Co: 5.0 to 20.0 mass %, Cr: 1.0 to 25.0 mass %, Ta: 1.0 to 10.0 mass %, Nb: 1.0 to 5.0 mass %, Ti: 1.0 to 5.0 mass %, V: 1.0 to 5.0 mass %, and Mo: 1.0 to 5.0 mass %, or 0.001 to 0.5 mass % of C.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: September 25, 2018
    Assignees: TANAKA KIKINZOKU KOGYO K.K., TOHOKU TECHNO ARCH CO., LTD.
    Inventors: Kiyohito Ishida, Toshihiro Omori, Yutaka Sato, Kunihiro Tanaka, Muneki Nakamura, Koichi Sakairi
  • Publication number: 20170130310
    Abstract: The present invention relates to a NiIr-base heat-resistant alloy which includes a Ni—Ir—Al—W-base alloy which contains Ir: 5.0 to 50.0 mass %, Al: 1.0 to 8.0 mass %, W: 5.0 to 20.0 mass %, and the balance is Ni, and a ?? phase having an L12 structure precipitating and dispersing in a matrix as an essential strengthening phase, and a ratio (Y/X) of a peak intensity (Y) of (201) plane of the Ir3W phase observed in the range of 2?=48° to 50° to a peak intensity (X) of (111) plane of the ?? phase observed in the range of 2?=43° to 45° in X-ray diffraction analysis is 0.5 or less. The alloy exhibits good high-temperature property stably.
    Type: Application
    Filed: March 23, 2015
    Publication date: May 11, 2017
    Applicant: Tanaka Kikinzoku Kogyo K.K.
    Inventors: Kiyohito ISHIDA, Toshihiro OMORI, Yutaka SATO, Kunihiro TANAKA, Muneki NAKAMURA, Koichi SAKAIRI, Tatsuya NAKAZAWA
  • Patent number: 9617622
    Abstract: A hydrogen gas generating member includes a metal alloy having dispersed aluminum. The metal alloy includes an Al—X alloy, where X is Sn: 10.1 to 99.5% by mass, Bi: 30.1 to 99.5% by mass, In: 10.1 to 99.5% by mass, Sn +Bi: 20.1 to 99.5% by mass, Sn +In: to 10 to 99.5% by mass, Bi+In: 20.1 to 99.5% by mass, or Sn+Bi+In: 20 to 99.5% by mass. Hydrogen gas is generated by bringing the hydrogen gas generating member into contact with water.
    Type: Grant
    Filed: August 11, 2008
    Date of Patent: April 11, 2017
    Assignee: Japan Science and Technology Agency
    Inventors: Kiyohito Ishida, Ryosuke Kainuma, Ikuo Ohnuma, Toshihiro Omori, Yoshikazu Takaku, Takehito Hagisawa
  • Patent number: 9605334
    Abstract: The present invention is a heat-resistant material comprising a Rh-based alloy, wherein the Rh-based alloy is a high heat-resistant and high strength alloy comprising a Rh-based alloy where Al and W as essential additive elements are added to Rh (0.2 to 15.0 mass % of Al, 15.0 to 45.0 mass % of W and Rh as the remainder), and a ?? phase (Rh3 (Al, W)) having an L12 structure is dispersed as a strengthening phase in a matrix. The Rh-based alloy of the present invention can be further improved in workability and high temperature oxidation characteristics by optionally adding B, C, Mg, Ca, Y, La or misch metals, Ni, Co, Cr, Fe, Mo, Ti, Nb, Ta, V, Zr, Hf, Ir, Re, Pd, Pt or Ru as an additive element. The Rh-based alloy of the present invention is a heat-resistant material having excellent high-temperature-resistant characteristics and a good balance of factors such as weight.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: March 28, 2017
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Kiyohito Ishida, Yoshikazu Takaku, Toshihiro Omori
  • Patent number: 9476474
    Abstract: A copper alloy wire is a filamentary material of a copper alloy containing, in percent by mass, Ni: 3.0 to 15.0%, Al: 0.5 to 5.0%, and Si: 0.1 to 3.0%, with the remainder being composed of Cu and incidental impurities, which is provided with the tensile strength (?B) of 900 to 1300 MPa and electrical conductivity of 10 to 22% IACS and, in addition to that property, satisfies an intensity ratio of A:B:C of 1.0:1.2 to 6.0:2.2 to 8.0 when A, B and C represent diffraction intensities of Cu (111), Cu (200) and Cu (220), respectively, according to an X-ray diffraction method in a predetermined cross section, and which is used for an operation or contact spring by incorporating in mobile phones and various small electronic instruments by formulating into a copper alloy spring used, particularly, for an electrical conductive spring.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: October 25, 2016
    Assignees: Nippon Seisen Co., Ltd.
    Inventors: Kiyohito Ishida, Takayuki Akizuki
  • Patent number: 9453274
    Abstract: A process for producing a Co-base alloy which has a basic composition including, in terms of mass proportion, 0.1%-10% Al, 3.0-45% W, and Co as the remainder and has an intermetallic compound of the L12 type [Co3 (Al,W)] dispersed and precipitated therein. Part of the Co may be replaced with Ni, Ir, Fe, Cr, Re, or Ru, while part of the Al and W may be replaced with Ni, Ti, Nb, Zr, V, Ta or Hf. The intermetallic compound [Co3 (Al, W)] has a high melting point, and this compound and the matrix are mismatched little with respect to lattice constant. Thus, the cobalt-base alloy can have high-temperature strength equal to that of nickel-base alloys and excellent structure stability.
    Type: Grant
    Filed: September 4, 2013
    Date of Patent: September 27, 2016
    Assignee: JAPAN SCIENCE AND TECHNOLOGY AGENCY
    Inventors: Kiyohito Ishida, Ryosuke Kainuma, Katunari Oikawa, Ikuo Ohnuma, Jun Sato
  • Publication number: 20160060740
    Abstract: A Cu—Al—Mn-based alloy rod having superelastic characteristics and having a recrystallized microstructure substantially formed of a ? single phase, wherein, for a longitudinal direction cross section of the rod, a region, in which a grain size of each of grains is a radius of the rod or more, is 90% or more of the longitudinal direction cross section at any location of the rod, and wherein an average grain size of the grains, in which the grain size is the radius of the rod or more, is 80% or more of a diameter of the rod; a Cu—Al—Mn-based alloy sheet; a production method thereof; a vibration damping material using thereof; a vibration damping structure constructed by using the vibration damping material.
    Type: Application
    Filed: November 10, 2015
    Publication date: March 3, 2016
    Applicants: TOHOKU UNIVERSITY, FURUKAWA ELECTRIC CO., LTD., FURUKAWA TECHNO MATERIAL CO., LTD.
    Inventors: Toshihiro OMORI, Tomoe KUSAMA, Ryosuke KAINUMA, Kiyohito ISHIDA, Toyonobu TANAKA, Sumio KISE, Kenji NAKAMIZO, Koji ISHIKAWA, Misato FUJII, Satoshi TESHIGAWARA
  • Publication number: 20160040276
    Abstract: The present invention is a heat-resistant Ni-base alloy including a Ni—Ir—Al—W alloy having essential additive elements of Ir, Al, and W added to Ni, wherein the heat-resistant Ni-base alloy includes Ir: 5.0 to 50.0 mass %, Al: 1.0 to 8.0 mass %, and W: 5.0 to 20.0 mass %, the balance being Ni, and a ?? phase having an L12 structure disperses in a matrix as an essential strengthening phase. The heat-resistant material including the Ni-base alloy may contain one or more additive elements selected from B: 0.001 to 0.1 mass %, Co: 5.0 to 20.0 mass %, Cr: 1.0 to 25.0 mass %, Ta: 1.0 to 10.0 mass %, Nb: 1.0 to 5.0 mass %, Ti: 1.0 to 5.0 mass %, V: 1.0 to 5.0 mass %, and Mo: 1.0 to 5.0 mass %, or 0.001 to 0.5 mass % of C.
    Type: Application
    Filed: March 11, 2014
    Publication date: February 11, 2016
    Inventors: Kiyohito ISHIDA, Toshihiro OMORI, Yutaka SATO, Kunihiro TANAKA, Muneki NAKAMURA, Koichi SAKAIRI
  • Publication number: 20150225826
    Abstract: A Cu—Al—Mn-based alloy having superelastic characteristics and having a recrystallized texture substantially formed of a ? single phase, in which 70% or more of crystal grains is within a range of 0° to 50° in a deviation angle from <001> orientation of a crystalline orientation measured in a working direction by electron back-scatter diffraction patterning.
    Type: Application
    Filed: March 16, 2015
    Publication date: August 13, 2015
    Applicants: TOHOKU UNIVERSITY, FURUKAWA ELECTRIC CO., LTD, FURUKAWA TECHNO MATERIAL CO., LTD.
    Inventors: Toshihiro OMORI, Shingo KAWATA, Ryosuke KAINUMA, Kiyohito ISHIDA, Toyonobu TANAKA, Kenji NAKAMIZO, Sumio KISE, Koji ISHIKAWA, Misato NAKANO, Satoshi TESHIGAWARA
  • Publication number: 20140345758
    Abstract: The present invention is a heat-resistant material comprising a Rh-based alloy, wherein the Rh-based alloy is a high heat-resistant and high strength alloy comprising a Rh-based alloy where Al and W as essential additive elements are added to Rh (0.2 to 15.0 mass % of Al, 15.0 to 45.0 mass % of W and Rh as the remainder), and a ?? phase (Rh3 (Al, W)) having an L12 structure is dispersed as a strengthening phase in a matrix. The Rh-based alloy of the present invention can be further improved in workability and high temperature oxidation characteristics by optionally adding B, C, Mg, Ca, Y, La or misch metals, Ni, Co, Cr, Fe, Mo, Ti, Nb, Ta, V, Zr, Hf, Ir, Re, Pd, Pt or Ru as an additive element. The Rh-based alloy of the present invention is a heat-resistant material having excellent high-temperature-resistant characteristics and a good balance of factors such as weight.
    Type: Application
    Filed: April 16, 2012
    Publication date: November 27, 2014
    Inventors: Kiyohito Ishida, Yoshikazu Takaku, Toshihiro Omori
  • Patent number: 8815027
    Abstract: An Fe-based shape memory alloy comprising 25-42 atomic % of Mn, 12-18 atomic % of Al, and 5-12 atomic % of Ni, the balance being Fe and inevitable impurities, and an Fe-based shape memory alloy comprising 25-42 atomic % of Mn, 12-18 atomic % of Al, and 5-12 atomic % of Ni, as well as 15 atomic % or less in total of at least one selected from the group consisting of 0.1-5 atomic % of Si, 0.1-5 atomic % of Ti, 0.1-5 atomic % of V, 0.1-5 atomic % of Cr, 0.1-5 atomic % of Co, 0.1-5 atomic % of Cu, 0.1-5 atomic % of Mo, 0.1-5 atomic % of W, 0.001-1 atomic % of B and 0.001-1 atomic % of C, the balance being Fe and inevitable impurities.
    Type: Grant
    Filed: October 6, 2010
    Date of Patent: August 26, 2014
    Assignee: Japan Science and Technology Agency
    Inventors: Kiyohito Ishida, Ryosuke Kainuma, Ikuo Ohnuma, Toshihiro Omori, Keisuke Ando
  • Publication number: 20140010704
    Abstract: To provide a copper alloy wire being a filamentary material of a copper alloy containing, in percent by mass, Ni: 3.0 to 15.0%, Al: 0.5 to 5.0%, and Si: 0.1 to 3.0%, with the remainder being composed of Cu and incidental impurities, which is provided with the tensile strength (?B) of 900 to 1300 MPa and electrical conductivity of 10 to 22% IACS and, in addition to that property, satisfies an intensity ratio of A:B:C of 1.0:1.2 to 6.0:2.2 to 8.
    Type: Application
    Filed: December 13, 2011
    Publication date: January 9, 2014
    Applicants: Nippon Seisen Co., Ltd.
    Inventors: Kiyohito Ishida, Takayuki Akizuki
  • Publication number: 20140007995
    Abstract: A process for producing a Co-base alloy which has a basic composition including, in terms of mass proportion, 0.1%-10% Al, 3.0-45% W, and Co as the remainder and has an intermetallic compound of the L12 type [Co3 (Al, W)] dispersed and precipitated therein. Part of the Co may be replaced with Ni, Ir, Fe, Cr, Re, or Ru, while part of the Al and W may be replaced with Ni, Ti, Nb, Zr, V, Ta or Hf. The intermetallic compound [Co3 (Al, W)] has a high melting point, and this compound and the matrix are mismatched little with respect to lattice constant. Thus, the cobalt-base alloy can have high-temperature strength equal to that of nickel-base alloys and excellent structure stability.
    Type: Application
    Filed: September 4, 2013
    Publication date: January 9, 2014
    Inventors: Kiyohito Ishida, Ryosuke Kainuma, Katunari Oikawa, Ikuo Ohnuma, Jun Sato
  • Publication number: 20130333812
    Abstract: To provide a copper alloy of the FCC structure containing Ni: 3.0 to 29.5 mass %, Al: 0.5 to 7.0 mass %, and Si: 0.1 to 1.5 mass %, with the remainder consisting of Cu and incidental impurities, wherein the copper alloy is of the high strength, but is excellent in workability, and has high electrical conductivity, and can control property thereof, by precipitating a ?? phase of the L12 structure including Si at an average particle diameter of 100 nm or less in a parent phase of the copper alloy.
    Type: Application
    Filed: December 13, 2011
    Publication date: December 19, 2013
    Applicants: Tohoku Techno Arch Co., Ltd., Nippon Seisen Co., Ltd.
    Inventors: Kiyohito Ishida, Rysuke Kainuma, Ikuo Ohnuma, Toshihiro Omori, Takashi Miyamoto, Hiroki Sato