Patents by Inventor Kiyohito MASUDA

Kiyohito MASUDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220394874
    Abstract: A portable electronic device includes a housing, an antenna module that is disposed in the vicinity of an inner surface of the housing with a gap from the inner surface, and a first heat diffusion member that is provided in the housing to be separated from the inner surface of the housing and is thermally connected to the antenna module. A path through which heat generated by the antenna module is transferred along the first heat diffusion member, is separated from the inner surface of the housing.
    Type: Application
    Filed: November 15, 2019
    Publication date: December 8, 2022
    Inventors: KIYOHITO MASUDA, KOSUKE KUWAHARA
  • Patent number: 9761970
    Abstract: A housing is configured to receive a plug that includes an upper face, a lower face, and a front face. The housing also includes a cutout portion that traverses the upper face and the lower face, opens to the front face of the housing, extends for a length of the plug, and is formed in a direction of insertion of the plug. An opening is configured to receive the plug, which is formed on the front face of the housing and connected to the cutout so that a plug is received by the opening. A distance from the upper face to the lower face of the housing is approximately equal to a diameter of the plug.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: September 12, 2017
    Assignees: Sony Corporation, Sony Mobile Communications Inc.
    Inventors: Koichi Izawa, Kiyohito Masuda
  • Publication number: 20160141779
    Abstract: A housing is configured to receive a plug that includes an upper face, a lower face, and a front face. The housing also includes a cutout portion that traverses the upper face and the lower face, opens to the front face of the housing, extends for a length of the plug, and is formed in a direction of insertion of the plug. An opening is configured to receive the plug, which is formed on the front face of the housing and connected to the cutout so that a plug is received by the opening. A distance from the upper face to the lower face of the housing is approximately equal to a diameter of the plug.
    Type: Application
    Filed: November 14, 2014
    Publication date: May 19, 2016
    Applicant: Sony Corporation
    Inventors: Koichi IZAWA, Kiyohito MASUDA