Abstract: An optical filter layer composed of an infrared cut filter layer, an optical low pass filter layer and the like is formed on a glass substrate. The optical filter layer is made either by attaching or depositing. The glass substrate with the optical filter layer is attached to a semiconductor wafer, in which imaging sections are arranged in a matrix. The glass substrate and the semiconductor wafer are diced along each imaging section to separate individual solid state imaging device.

Abstract: An optical filter layer composed of an infrared cut filter layer, an optical low pass filter layer and the like is formed on a glass substrate. The optical filter layer is made either by attaching or depositing. The glass substrate with the optical filter layer is attached to a semiconductor wafer, in which imaging sections are arranged in a matrix. The glass substrate and the semiconductor wafer are diced along each imaging section to separate individual solid state imaging device.

Abstract: A light-transmissive support disk supports a tube for attracting an LED chip, and a light-transmissive electrically conductive film is disposed on the support base. The LED chip is electrically connected to a negative terminal of a DC power supply by the light-transmissive electrically conductive film. An imaging unit is disposed coaxially with the tube and has a CCD camera for capturing an image of a light-emitting state of the LED chip via the support disk and a cover member when the LED chip attracted by the tube emits light. The light-emitting center of the LED chip can be detected accurately, and bonded easily and highly accurately on a board at a desired position thereon.

Abstract: A light-transmissive support disk supports a tube for attracting an LED chip, and a light-transmissive electrically conductive film is disposed on the support base. The LED chip is electrically connected to a negative terminal of a DC power supply by the light-transmissive electrically conductive film. An imaging unit is disposed coaxially with the tube and has a CCD camera for capturing an image of a light-emitting state of the LED chip via the support disk and a cover member when the LED chip attracted by the tube emits light. The light-emitting center of the LED chip can be detected accurately, and bonded easily and highly accurately on a board at a desired position thereon.

Abstract: A bonding apparatus for bonding a component on a board at a predetermined position thereon has a displacement mechanism for displacing a board holding unit for holding a board and a component holding unit for holding a component relatively to each other to reach a bonding position, a laser distance measuring mechanism for measuring a distance of said board holding unit or said component holding unit from said bonding position directly with a laser beam, and an imaging mechanism for detecting a position of said component with cameras and positionally correcting the component if necessary. The bonding apparatus allows components, i.e., LED chips, to be positioned highly accurately without being affected by spaced intervals between the components.

Abstract: A bonding apparatus has a probe for causing an LED chip to emit light before the LED chip is bonded on a board, an imaging system for recognizing the center of a light-emitting area of the LED chip and recognizing coordinates of a contour reference point of the LED chip with respect to the recognized center of the light-emitting area, and a light-emitting-element holding mechanism for positioning the LED chip in a bonding position on the board based on the recognized coordinates of the contour reference point. The center of the light-emitting area of the LED chip can be positioned highly accurately in a desired position on the board without being adversely affected by variations in the contour dimensions of the LED chip.

Abstract: A wrapping sheet is disposed on a roll so that marginal portions of the wrapping sheet extend beyond the respective side faces of the roll. A wrapping sheet winding apparatus for winding the wrapping sheet around the roll has a pair of chucks which are drivingly engaged with a core of the roll and rotate the roll to wind therearound the wrapping sheet. Each of the chucks is provided with suction holes formed on the outer peripheral surface thereof.