Patents by Inventor Kiyoji Inoue

Kiyoji Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6278437
    Abstract: An LCD apparatus, when fed with images in a video format whose pixel configuration is smaller than that of the LCD screen, fills the resulting blank area with a particular color through simple and low-speed image data processing. This LCD apparatus has rewritable memories, 24-bit latch circuits that cooperate with a blue-fill circuit and a black-fill circuit to write data of a particular color to the memories at all the addresses corresponding to the LCD screen, an overwriter for overwriting the memories with input image data only at the addresses corresponding to the area of the LCD screen in which images are displayed, and a reader for reading all the data stored in the memories to feed it to an LCD module.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: August 21, 2001
    Assignees: Sanyo Electric Co., Ltd., Tottori Sanyo Electric Co., Ltd.
    Inventors: Tomoyoshi Iga, Takeshi Inoue, Shingo Togawa, Kiyoji Inoue
  • Patent number: 5759668
    Abstract: The invention provides an improved heat seal structure for electronic devices. A heat seal structure comprises a base of synthetic resin formed integrally with an outwardly extending projection, with a gas vent running through the base and projection, the gas vent being sealed off by melting the projection, the improvement that the gas vent is configured generally in the shape of the letter V or Y bifurcating in the outward direction. In another embodiment, the projection has an annular extension disposed on the outward side of the base and adapted to be melted for a double seal effect. In another version of the structure, heat-sealing is performed with a sealing member or composition interposed in the gas vent. In still further embodiments, heat sealing is performed using a sealing member melting at a temperature below the melting point of the resin forming the base.
    Type: Grant
    Filed: March 26, 1997
    Date of Patent: June 2, 1998
    Assignee: Omron Corporation
    Inventors: Tatsuro Ishikawa, Hiroyuki Sagawa, Kiyoji Inoue, Tetsuo Shinkai, Atsushi Kamizasa