Patents by Inventor Kiyokaza Ikeya

Kiyokaza Ikeya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5562473
    Abstract: A socket (100) for the temporary mounting of an electric part such as an IC package (130) for burn-in testing and the like is shown in which a plurality of contact elements (10, 10') are mounted in the socket each having a stationary part (10a), a spring cantilever arm part (10b) and a contact edge part (10e). The contact elements (10, 10') are mounted so that the leads (130a) of an IC package (130) are each received on a respective contact edge part (10e). When the cover (102) of the socket is closed, wall member (105a) engages the top portion of the leads (130a) and exerts a generally vertical downward force on the contact edges (10e) causing them to be depressed to effect electrical connection between leads (130a) and respective contact elements (10, 10').
    Type: Grant
    Filed: August 23, 1994
    Date of Patent: October 8, 1996
    Assignee: Texas Instruments Incorporated
    Inventors: Kiyokaza Ikeya, Osamu Yamazaki