Patents by Inventor Kiyokazu Ishizaki

Kiyokazu Ishizaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS
    Publication number: 20080173472
    Abstract: According to one embodiment, a printed circuit board includes a printed wiring board including a through hole part, an electronic component including a component body and a lead member inserted into the through hole part to be electrically connected thereto, a metal member disposed around and separated from the through hole part, and a solder resist disposed at least around the metal member, at least a part of the component body being mounted on the solder resist
    Type: Application
    Filed: July 26, 2007
    Publication date: July 24, 2008
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Minoru Takizawa, Kazuhiko Nagao, Kiyokazu Ishizaki, Kuniyasu Hosoda
  • Printed wiring board, semiconductor package with printed wiring board and electronic device having printed circuit board
    Publication number: 20070253148
    Abstract: According to one embodiment, a printed circuit board includes an insulating substrate, a plurality of lands formed on the insulating substrate, a conductive wiring pattern coupled to the lands, a protective film covering the insulating substrate and having an opening larger than the outer profile of each of the lands, a plurality of bumps bonded to the lands and a circuit component electrically connected to the lands via the bumps. Each land has a land body having a gap along an opening rim of the opening, and an extension part extending from a part of the land body to the opening rim of the opening.
    Type: Application
    Filed: July 31, 2006
    Publication date: November 1, 2007
    Inventor: Kiyokazu Ishizaki