Patents by Inventor Kiyokazu Kamado

Kiyokazu Kamado has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7432580
    Abstract: A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed on a surface of the one side of the substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil.
    Type: Grant
    Filed: December 20, 2005
    Date of Patent: October 7, 2008
    Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.
    Inventors: Akihiro Sato, Satoru Sekiguchi, Kiyokazu Kamado, Kazunari Kurokawa, Makoto Tsubonoya, Kiyoshi Mita, Yoichi Nabeta, Tetsuro Sawai, Toshikazu Imaoka
  • Patent number: 7365628
    Abstract: A semiconductor apparatus having a semiconductor chip, a first coil electrically connected to the semiconductor chip and a first electrode electrically connected to the first coil is comprised of a second electrode which can be electrically connected to the first electrode as well as which can be electrically connected to a second coil on the outside of the semiconductor apparatus, and is characterized by that inductance composed of the first coil and the second coil is obtained by electrically connecting the second electrode to the first electrode and the second coil.
    Type: Grant
    Filed: January 24, 2006
    Date of Patent: April 29, 2008
    Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.
    Inventors: Akihiro Sato, Satoru Sekiguchi, Kiyokazu Kamado, Makoto Tsubonoya, Kiyoshi Mita, Yoichi Nabeta
  • Publication number: 20060176137
    Abstract: A semiconductor apparatus having a semiconductor chip, a first coil electrically connected to the semiconductor chip and a first electrode electrically connected to the first coil is comprised of a second electrode which can be electrically connected to the first electrode as well as which can be electrically connected to a second coil on the outside of the semiconductor apparatus, and is characterized by that inductance composed of the first coil and the second coil is obtained by electrically connecting the second electrode to the first electrode and the second coil.
    Type: Application
    Filed: January 24, 2006
    Publication date: August 10, 2006
    Applicants: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.
    Inventors: Akihiro Sato, Satoru Sekiguchi, Kiyokazu Kamado, Makoto Tsubonoya, Kiyoshi Mita, Yoichi Nabeta
  • Publication number: 20060131724
    Abstract: A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed on a surface of the one side of the substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil.
    Type: Application
    Filed: December 20, 2005
    Publication date: June 22, 2006
    Applicants: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.
    Inventors: Akihiro Sato, Satoru Sekiguchi, Kiyokazu Kamado, Kazunari Kurokawa, Makoto Tsubonoya, Kiyoshi Mita, Yoichi Nabeta, Tetsuro Sawai, Toshikazu Imaoka
  • Patent number: 6606174
    Abstract: In a data transmission, a driving circuit 14 drives a light receiving element 15 in accordance with data from an external control circuit. In accordance with IrDA or remote control communication, driving capability of the driving circuit is changed. In a data reception, received data is transferred to a first or a second signal processing circuit in accordance with the IrDA or remote control communication and processed according to each communication format. In this configuration, a single light emitting or light receiving element permits data communication in different kinds of data communication formats.
    Type: Grant
    Filed: September 29, 1999
    Date of Patent: August 12, 2003
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Tsutomu Ishikawa, Satoru Sekiguchi, Hiroshi Kobori, Kiyokazu Kamado, Hideo Kunio, Isao Ochiai, Kiyoshi Takada, Hiroshi Inoguchi