Patents by Inventor Kiyokazu Moriizumi

Kiyokazu Moriizumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10614189
    Abstract: Enclosed herein is a component retrieve device including a memory, and a processor coupled to the memory and configured to receive information for specifying a retrieval target component, refer to a retrieval history of a retrieving person who has retrieved the retrieval target component, specify components similar to the retrieval target component, and output information of the specified components.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: April 7, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Kiyokazu Moriizumi, Yuji Maeda, Hajime Kubota, Masayuki Itoh
  • Publication number: 20180330035
    Abstract: There is provided a component retrieve device including a memory, and a processor coupled to the memory and the processor configured to receive information for specifying a retrieval target component, refer to a retrieval history of a retrieving person who has retrieved the retrieval target component, specify components similar to the retrieval target component, and output information of specified components similar to the retrieval target component.
    Type: Application
    Filed: May 1, 2018
    Publication date: November 15, 2018
    Applicant: FUJITSU LIMITED
    Inventors: Kiyokazu Moriizumi, Yuji Maeda, Hajime Kubota, Masayuki ITOH
  • Patent number: 9545044
    Abstract: An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: January 10, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Katsumi Takada, Kiyokazu Moriizumi, Masayuki Itoh
  • Patent number: 9541602
    Abstract: An electronic component inspection apparatus includes a light source arranged in a mounting area where at least one electronic component is mounted to a board and a light-receiving sensor arranged outside the mounting area to detect an intensity of a light received from the light source. A computer executes a program to perform a process of determining a state of joining parts in the mounting area based on a result of comparison of the intensity of the light received by the light-receiving sensor with an intensity of distribution previously acquired.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: January 10, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Hiroshi Kurosawa, Masayuki Itoh, Kiyokazu Moriizumi
  • Publication number: 20160155089
    Abstract: A computer-readable recording medium stores therein a program that causes a computer to execute a process. The process includes receiving a condition for using a component; referring to a stored content of a first storage unit that stores a characteristic value of the component for each condition for using the component, thereby acquiring a characteristic value that is related to the received condition; referring to a stored content of a second storage unit that stores a price of the component, thereby acquiring the price that is related to the component; normalizing the acquired price by using the acquired characteristic value; and outputting the normalized price.
    Type: Application
    Filed: February 3, 2016
    Publication date: June 2, 2016
    Applicant: FUJITSU LIMITED
    Inventors: Tomokazu NAKASHIMA, Masayuki ITOH, Kiyokazu MORIIZUMI
  • Patent number: 9307686
    Abstract: An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: April 5, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Katsumi Takada, Kiyokazu Moriizumi, Masayuki Itoh
  • Publication number: 20150113799
    Abstract: An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.
    Type: Application
    Filed: December 10, 2014
    Publication date: April 30, 2015
    Inventors: Katsumi TAKADA, Kiyokazu MORIIZUMI, Masayuki ITOH
  • Publication number: 20140361782
    Abstract: An electronic component inspection apparatus includes a light source arranged in a mounting area where at least one electronic component is mounted to a board and a light-receiving sensor arranged outside the mounting area to detect an intensity of a light received from the light source. A computer executes a program to perform a process of determining a state of joining parts in the mounting area based on a result of comparison of the intensity of the light received by the light-receiving sensor with an intensity of distribution previously acquired.
    Type: Application
    Filed: August 22, 2014
    Publication date: December 11, 2014
    Inventors: Hiroshi KUROSAWA, Masayuki ITOH, Kiyokazu MORIIZUMI
  • Publication number: 20120275128
    Abstract: An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.
    Type: Application
    Filed: March 14, 2012
    Publication date: November 1, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Katsumi TAKADA, Kiyokazu MORIIZUMI, Masayuki ITOH
  • Publication number: 20120095884
    Abstract: The part information providing system includes a part information database a retrieving section, and a notifying section. The part information database stores part information including a price of a first part and identification information of a cheaper second part, serving as a substitute for the first part, in association with identification of the first part. The retrieving section retrieves identification information of a third part, which is a component of a device, from the database and, if the identification information of the third part is associated with that of the second part, retrieves the second part, which serves as a substitute for the third part and is cheaper than the third part, from the part using the identification information of the second part by following a link of the identification information of the second part. The notifying section notifies a user of information about the second part retrieved.
    Type: Application
    Filed: September 8, 2011
    Publication date: April 19, 2012
    Applicant: Fujitsu Limited
    Inventors: Misako TANABE, Kiyokazu Moriizumi, Minoru Yabumoto
  • Publication number: 20110208484
    Abstract: A design apparatus for an electronic device is provided. The apparatus includes: a selection unit that selects a first component which meets a characteristic condition, from a component database which includes a characteristic and a recommended level of each of components, the recommended level being variable; a first determination unit that acquires a recommended level of the first component from the component database, and determines the acquired recommended level; a creation unit that creates design data of the electronic device including the first component; and a second determination unit that acquires, after the creation, a recommended level of the first component from the component database, and determines the acquired recommended level after the creation.
    Type: Application
    Filed: February 1, 2011
    Publication date: August 25, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Kouhei EZAKI, Kiyokazu Moriizumi, Takayuki Watanabe, Yuji Maeda
  • Publication number: 20100246149
    Abstract: A connection member is disposed between a semiconductor package and a printed wiring board. The connection member includes: a base member formed of an insulating material; a plurality of through-holes provided in the base member at corresponding positions between a plurality of first terminal pads of the semiconductor package and a plurality of second terminal pads of the printed wiring board; and an electronic component inserted in the plurality of through-holes, the electronic component having a first electrode and a second electrode at ends thereof, the first electrode connected to one of the first terminal pads, the second electrode connected to one of the second terminal pads.
    Type: Application
    Filed: March 5, 2010
    Publication date: September 30, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Tomokazu Nakashima, Kiyokazu Moriizumi, Masayuki Itoh
  • Publication number: 20100124952
    Abstract: A mobile terminal device having communicating functions includes a housing; an antenna housed in the housing to be freely pulled out; a pull-out mechanism that pulls out the antenna from within the housing in accordance with an instruction to pull out the antenna; and an instructing section that gives the instruction to pull-out the antenna to the pull-out mechanism in accordance with a predetermined event for any one of the communicating functions.
    Type: Application
    Filed: October 27, 2009
    Publication date: May 20, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Kiyokazu Moriizumi, Kouhei Ezaki, Yoshinori Mesaki
  • Patent number: 7579553
    Abstract: A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at least a first surface and a second surface that communicate with each other, and an insulative substrate that supports the plurality of posts.
    Type: Grant
    Filed: February 15, 2001
    Date of Patent: August 25, 2009
    Assignee: Fujitsu Limited
    Inventor: Kiyokazu Moriizumi
  • Patent number: 7298605
    Abstract: The present invention provides a low-cost electrolytic capacitor wherein the deformation of the casing due to the thermal expansion during reflowing is prevented. An electrolytic capacitor of a surface mounting type having a capacitor element that consists of a dielectric film and an electrode foil, a metal casing that holds the capacitor element, and an electrolyte solution in which the capacitor element held in the casing is immersed, wherein the casing is equipped with a gas absorbing member that absorbs the gas generated in the casing.
    Type: Grant
    Filed: September 26, 2005
    Date of Patent: November 20, 2007
    Assignee: Fujitsu Limited
    Inventors: Masayuki Itoh, Kiyokazu Moriizumi, Takao Ishikawa, Tomokazu Nakashima, Masako Okazaki
  • Patent number: 7222420
    Abstract: A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at least a first surface and a second surface that communicate with each other, and an insulative substrate that supports the plurality of posts.
    Type: Grant
    Filed: March 17, 2004
    Date of Patent: May 29, 2007
    Assignee: Fujitsu Limited
    Inventor: Kiyokazu Moriizumi
  • Publication number: 20060285275
    Abstract: The present invention provides a low-cost electrolytic capacitor wherein the deformation of the casing due to the thermal expansion during reflowing is prevented. An electrolytic capacitor of a surface mounting type having a capacitor element that consists of a dielectric film and an electrode foil, a metal casing that holds the capacitor element, and an electrolyte solution in which the capacitor element held in the casing is immersed, wherein the casing is equipped with a gas absorbing member that absorbs the gas generated in the casing.
    Type: Application
    Filed: September 26, 2005
    Publication date: December 21, 2006
    Inventors: Masayuki Itoh, Kiyokazu Moriizumi, Takao Ishikawa, Tomokazu Nakashima, Masako Okazaki
  • Patent number: 7005318
    Abstract: A mounted circuit substrate has at least one conductive layer. The side faces of a component mounting pad is formed on a surface of the substrate, and includes at least a columnar pattern made of a metal highly resistant to erosion by solder. The side faces of the component mounting pad are completely covered with an organic insulating layer. Therefore, the component mounting pad can withstand molten solder stresses accompanying component replacement even when component replacement is done many times.
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: February 28, 2006
    Assignee: Fujistu Limited
    Inventors: Kiyokazu Moriizumi, Manabu Watanabe
  • Publication number: 20040173890
    Abstract: A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at least a first surface and a second surface that communicate with each other, and an insulative substrate that supports the plurality of posts.
    Type: Application
    Filed: March 17, 2004
    Publication date: September 9, 2004
    Applicant: Fujitsu Limited
    Inventor: Kiyokazu Moriizumi
  • Publication number: 20040166617
    Abstract: A mounted circuit substrate has at least one conductive layer. The side faces of a component mounting pad is formed on a surface of the substrate, and includes at least a columnar pattern made of a metal highly resistant to erosion by solder. The side faces of the component mounting pad are completely covered with an organic insulating layer. Therefore, the component mounting pad can withstand molten solder stresses accompanying component replacement even when component replacement is done many times.
    Type: Application
    Filed: February 24, 2004
    Publication date: August 26, 2004
    Applicant: FUJITSU LIMITED
    Inventors: Kiyokazu Moriizumi, Manabu Watanabe