Patents by Inventor Kiyokazu Moriizumi
Kiyokazu Moriizumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10614189Abstract: Enclosed herein is a component retrieve device including a memory, and a processor coupled to the memory and configured to receive information for specifying a retrieval target component, refer to a retrieval history of a retrieving person who has retrieved the retrieval target component, specify components similar to the retrieval target component, and output information of the specified components.Type: GrantFiled: May 1, 2018Date of Patent: April 7, 2020Assignee: FUJITSU LIMITEDInventors: Kiyokazu Moriizumi, Yuji Maeda, Hajime Kubota, Masayuki Itoh
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Publication number: 20180330035Abstract: There is provided a component retrieve device including a memory, and a processor coupled to the memory and the processor configured to receive information for specifying a retrieval target component, refer to a retrieval history of a retrieving person who has retrieved the retrieval target component, specify components similar to the retrieval target component, and output information of specified components similar to the retrieval target component.Type: ApplicationFiled: May 1, 2018Publication date: November 15, 2018Applicant: FUJITSU LIMITEDInventors: Kiyokazu Moriizumi, Yuji Maeda, Hajime Kubota, Masayuki ITOH
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Patent number: 9545044Abstract: An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.Type: GrantFiled: December 10, 2014Date of Patent: January 10, 2017Assignee: FUJITSU LIMITEDInventors: Katsumi Takada, Kiyokazu Moriizumi, Masayuki Itoh
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Patent number: 9541602Abstract: An electronic component inspection apparatus includes a light source arranged in a mounting area where at least one electronic component is mounted to a board and a light-receiving sensor arranged outside the mounting area to detect an intensity of a light received from the light source. A computer executes a program to perform a process of determining a state of joining parts in the mounting area based on a result of comparison of the intensity of the light received by the light-receiving sensor with an intensity of distribution previously acquired.Type: GrantFiled: August 22, 2014Date of Patent: January 10, 2017Assignee: FUJITSU LIMITEDInventors: Hiroshi Kurosawa, Masayuki Itoh, Kiyokazu Moriizumi
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Publication number: 20160155089Abstract: A computer-readable recording medium stores therein a program that causes a computer to execute a process. The process includes receiving a condition for using a component; referring to a stored content of a first storage unit that stores a characteristic value of the component for each condition for using the component, thereby acquiring a characteristic value that is related to the received condition; referring to a stored content of a second storage unit that stores a price of the component, thereby acquiring the price that is related to the component; normalizing the acquired price by using the acquired characteristic value; and outputting the normalized price.Type: ApplicationFiled: February 3, 2016Publication date: June 2, 2016Applicant: FUJITSU LIMITEDInventors: Tomokazu NAKASHIMA, Masayuki ITOH, Kiyokazu MORIIZUMI
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Patent number: 9307686Abstract: An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.Type: GrantFiled: March 14, 2012Date of Patent: April 5, 2016Assignee: FUJITSU LIMITEDInventors: Katsumi Takada, Kiyokazu Moriizumi, Masayuki Itoh
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Publication number: 20150113799Abstract: An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.Type: ApplicationFiled: December 10, 2014Publication date: April 30, 2015Inventors: Katsumi TAKADA, Kiyokazu MORIIZUMI, Masayuki ITOH
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Publication number: 20140361782Abstract: An electronic component inspection apparatus includes a light source arranged in a mounting area where at least one electronic component is mounted to a board and a light-receiving sensor arranged outside the mounting area to detect an intensity of a light received from the light source. A computer executes a program to perform a process of determining a state of joining parts in the mounting area based on a result of comparison of the intensity of the light received by the light-receiving sensor with an intensity of distribution previously acquired.Type: ApplicationFiled: August 22, 2014Publication date: December 11, 2014Inventors: Hiroshi KUROSAWA, Masayuki ITOH, Kiyokazu MORIIZUMI
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Publication number: 20120275128Abstract: An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.Type: ApplicationFiled: March 14, 2012Publication date: November 1, 2012Applicant: FUJITSU LIMITEDInventors: Katsumi TAKADA, Kiyokazu MORIIZUMI, Masayuki ITOH
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Publication number: 20120095884Abstract: The part information providing system includes a part information database a retrieving section, and a notifying section. The part information database stores part information including a price of a first part and identification information of a cheaper second part, serving as a substitute for the first part, in association with identification of the first part. The retrieving section retrieves identification information of a third part, which is a component of a device, from the database and, if the identification information of the third part is associated with that of the second part, retrieves the second part, which serves as a substitute for the third part and is cheaper than the third part, from the part using the identification information of the second part by following a link of the identification information of the second part. The notifying section notifies a user of information about the second part retrieved.Type: ApplicationFiled: September 8, 2011Publication date: April 19, 2012Applicant: Fujitsu LimitedInventors: Misako TANABE, Kiyokazu Moriizumi, Minoru Yabumoto
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Publication number: 20110208484Abstract: A design apparatus for an electronic device is provided. The apparatus includes: a selection unit that selects a first component which meets a characteristic condition, from a component database which includes a characteristic and a recommended level of each of components, the recommended level being variable; a first determination unit that acquires a recommended level of the first component from the component database, and determines the acquired recommended level; a creation unit that creates design data of the electronic device including the first component; and a second determination unit that acquires, after the creation, a recommended level of the first component from the component database, and determines the acquired recommended level after the creation.Type: ApplicationFiled: February 1, 2011Publication date: August 25, 2011Applicant: FUJITSU LIMITEDInventors: Kouhei EZAKI, Kiyokazu Moriizumi, Takayuki Watanabe, Yuji Maeda
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Publication number: 20100246149Abstract: A connection member is disposed between a semiconductor package and a printed wiring board. The connection member includes: a base member formed of an insulating material; a plurality of through-holes provided in the base member at corresponding positions between a plurality of first terminal pads of the semiconductor package and a plurality of second terminal pads of the printed wiring board; and an electronic component inserted in the plurality of through-holes, the electronic component having a first electrode and a second electrode at ends thereof, the first electrode connected to one of the first terminal pads, the second electrode connected to one of the second terminal pads.Type: ApplicationFiled: March 5, 2010Publication date: September 30, 2010Applicant: FUJITSU LIMITEDInventors: Tomokazu Nakashima, Kiyokazu Moriizumi, Masayuki Itoh
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Publication number: 20100124952Abstract: A mobile terminal device having communicating functions includes a housing; an antenna housed in the housing to be freely pulled out; a pull-out mechanism that pulls out the antenna from within the housing in accordance with an instruction to pull out the antenna; and an instructing section that gives the instruction to pull-out the antenna to the pull-out mechanism in accordance with a predetermined event for any one of the communicating functions.Type: ApplicationFiled: October 27, 2009Publication date: May 20, 2010Applicant: FUJITSU LIMITEDInventors: Kiyokazu Moriizumi, Kouhei Ezaki, Yoshinori Mesaki
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Patent number: 7579553Abstract: A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at least a first surface and a second surface that communicate with each other, and an insulative substrate that supports the plurality of posts.Type: GrantFiled: February 15, 2001Date of Patent: August 25, 2009Assignee: Fujitsu LimitedInventor: Kiyokazu Moriizumi
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Patent number: 7298605Abstract: The present invention provides a low-cost electrolytic capacitor wherein the deformation of the casing due to the thermal expansion during reflowing is prevented. An electrolytic capacitor of a surface mounting type having a capacitor element that consists of a dielectric film and an electrode foil, a metal casing that holds the capacitor element, and an electrolyte solution in which the capacitor element held in the casing is immersed, wherein the casing is equipped with a gas absorbing member that absorbs the gas generated in the casing.Type: GrantFiled: September 26, 2005Date of Patent: November 20, 2007Assignee: Fujitsu LimitedInventors: Masayuki Itoh, Kiyokazu Moriizumi, Takao Ishikawa, Tomokazu Nakashima, Masako Okazaki
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Patent number: 7222420Abstract: A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at least a first surface and a second surface that communicate with each other, and an insulative substrate that supports the plurality of posts.Type: GrantFiled: March 17, 2004Date of Patent: May 29, 2007Assignee: Fujitsu LimitedInventor: Kiyokazu Moriizumi
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Publication number: 20060285275Abstract: The present invention provides a low-cost electrolytic capacitor wherein the deformation of the casing due to the thermal expansion during reflowing is prevented. An electrolytic capacitor of a surface mounting type having a capacitor element that consists of a dielectric film and an electrode foil, a metal casing that holds the capacitor element, and an electrolyte solution in which the capacitor element held in the casing is immersed, wherein the casing is equipped with a gas absorbing member that absorbs the gas generated in the casing.Type: ApplicationFiled: September 26, 2005Publication date: December 21, 2006Inventors: Masayuki Itoh, Kiyokazu Moriizumi, Takao Ishikawa, Tomokazu Nakashima, Masako Okazaki
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Patent number: 7005318Abstract: A mounted circuit substrate has at least one conductive layer. The side faces of a component mounting pad is formed on a surface of the substrate, and includes at least a columnar pattern made of a metal highly resistant to erosion by solder. The side faces of the component mounting pad are completely covered with an organic insulating layer. Therefore, the component mounting pad can withstand molten solder stresses accompanying component replacement even when component replacement is done many times.Type: GrantFiled: February 24, 2004Date of Patent: February 28, 2006Assignee: Fujistu LimitedInventors: Kiyokazu Moriizumi, Manabu Watanabe
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Publication number: 20040173890Abstract: A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at least a first surface and a second surface that communicate with each other, and an insulative substrate that supports the plurality of posts.Type: ApplicationFiled: March 17, 2004Publication date: September 9, 2004Applicant: Fujitsu LimitedInventor: Kiyokazu Moriizumi
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Publication number: 20040166617Abstract: A mounted circuit substrate has at least one conductive layer. The side faces of a component mounting pad is formed on a surface of the substrate, and includes at least a columnar pattern made of a metal highly resistant to erosion by solder. The side faces of the component mounting pad are completely covered with an organic insulating layer. Therefore, the component mounting pad can withstand molten solder stresses accompanying component replacement even when component replacement is done many times.Type: ApplicationFiled: February 24, 2004Publication date: August 26, 2004Applicant: FUJITSU LIMITEDInventors: Kiyokazu Moriizumi, Manabu Watanabe