Patents by Inventor Kiyokazu Yamazaki

Kiyokazu Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal base circuit board
    Patent number: 8426740
    Abstract: A metal base circuit board, having an insulating layer with a linear expansion coefficient of 60 ppm per degree C. or higher and 120 ppm per degree C. or lower, a metal foil provided on one side of the insulating layer, comprising a metal material with a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C. or lower, a circuit portion and a non-circuit potion having a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C.
    Type: Grant
    Filed: May 21, 2009
    Date of Patent: April 23, 2013
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Taiki Nishi, Takeshi Miyakawa, Kiyokazu Yamazaki, Takashi Saiki
  • Carbon catalyst and use thereof
    Patent number: 8372781
    Abstract: Provided is a carbon catalyst having an excellent catalytic activity on the decomposition of hydrogen peroxide. The carbon catalyst is a carbon catalyst for decomposing hydrogen peroxide, which is obtained by impregnating a carbonized material, which is obtained by carbonization of raw materials containing an organic compound as a carbon source, a metal, and an electrically conductive carbon material, with a metal, and subjecting the resultant to a heat treatment.
    Type: Grant
    Filed: October 1, 2010
    Date of Patent: February 12, 2013
    Assignee: Nisshinbo Holdings, Inc.
    Inventors: Shinichi Horiguchi, Kiyokazu Yamazaki, Koji Kamata
  • CARBON CATALYST AND USE THEREOF
    Publication number: 20120214662
    Abstract: Provided is a carbon catalyst having an excellent catalytic activity on the decomposition of hydrogen peroxide. The carbon catalyst is a carbon catalyst for decomposing hydrogen peroxide, which is obtained by impregnating a carbonized material, which is obtained by carbonization of raw materials containing an organic compound as a carbon source, a metal, and an electrically conductive carbon material, with a metal, and subjecting the resultant to a heat treatment.
    Type: Application
    Filed: October 1, 2010
    Publication date: August 23, 2012
    Applicant: NISSHINBO HOLDINGS INC.
    Inventors: Shinichi Horiguchi, Kiyokazu Yamazaki, Koji Kamata
  • METAL BASE CIRCUIT BOARD
    Publication number: 20110132644
    Abstract: Lifespan of LEDs can be lengthened, and the workability of the printed circuit board during circuit formation and during LED mounting can be improved. A metal base circuit board, having an insulating layer with a linear expansion coefficient of 60 ppm per degree C. or higher and 120 ppm per degree C. or lower, a metal foil provided on one side of the insulating layer, comprising a metal material with a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C. or lower, a circuit portion and a non-circuit potion having a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C.
    Type: Application
    Filed: May 21, 2009
    Publication date: June 9, 2011
    Inventors: Taiki Nishi, Takeshi Miyakawa, Kiyokazu Yamazaki, Takashi Saiki