Patents by Inventor Kiyokazu Yonekura

Kiyokazu Yonekura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Aromatic oligomer, phenolic resin composition containing the same, and epoxy resin composition and cured product obtained therefrom
    Publication number: 20030069357
    Abstract: This invention relates to an aromatic oligomer which is useful as a modifier of epoxy resin compositions, to a phenolic resin composition comprising said aromatic oligomer and to an epoxy resin composition comprising said aromatic oligomer and is useful for encapsulating electric and electronic parts and as a circuit board material. The aromatic oligomer of this invention is obtained by polymerizing monomers mainly consisting of aromatic olefins comprising 20 wt % or more of acenaphthylenes and shows a softening point of 80-250° C. The phenolic resin composition or epoxy resin composition of this invention is obtained by incorporating 3-200 parts by weight of the aromatic oligomer per 100 parts by weight of phenolic resin or epoxy resin. The cured epoxy resin of this invention is obtained by curing the epoxy resin composition.
    Type: Application
    Filed: October 8, 2002
    Publication date: April 10, 2003
    Inventors: Masashi Kaji, Kiyokazu Yonekura