Abstract: According to one embodiment, a flexible printed circuit has a first circuit substrate and a second circuit substrate extending over the first circuit substrate. The first circuit substrate has a connector area. The second circuit substrate has an opening and an adhesive layer. The opening allows the connector area to be exposed. The opening has an opening edge which has a predetermined shape and defines the opening. The second circuit substrate has in the opening a depressed portion depressed deeper than the opening edge. Among various constituents of the second circuit substrate, at least the adhesive layer is depressed from the opening edge at the depressed portion.

Abstract: According to one embodiment, a flexible printed circuit has a first circuit substrate and a second circuit substrate extending over the first circuit substrate. The first circuit substrate has a connector area. The second circuit substrate has an opening and an adhesive layer. The opening allows the connector area to be exposed. The opening has an opening edge which has a predetermined shape and defines the opening. The second circuit substrate has in the opening a depressed portion depressed deeper than the opening edge. Among various constituents of the second circuit substrate, at least the adhesive layer is depressed from the opening edge at the depressed portion.

Abstract: According to one embodiment, an electronic apparatus includes a circuit module. The circuit module includes a flexible substrate. The flexible substrate includes a base portion having a mounting surface, and an extension portion. On the mounting surface, conductor patterns are provided. A switch is provided in a fore-end portion of the extension portion and includes an operating portion operated by a pushing portion of a housing. A first pressure receiving portion is located behind the switch. A second pressure receiving portion is provided on the mounting surface. The extension portion is folded back once toward the mounting surface.

Abstract: According to one embodiment, an electronic device includes a first attachment part; a second attachment part separated from the first attachment part; a flexible printed circuit board including a first connection part fixed to the first attachment part, a second connection part fixed to the second attachment part, a coupling part to couple the first connection part and the second connection part and provided with a slit extending in a first direction connecting the first connection part and the second connection part, and a bending part provided in the coupling part; and a bonding sheet provided on one side of the second connection part for bonding the second connection part and the first attachment part away from the coupling part in a second direction along a direction in which the second connection part extends, and to bond the second connection part and the first connection part inside the slit.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a connector, and a component connected to the connector. The component includes a first and third electrically conductive portion on a first surface, a second electrically conductive portion on a second surface, and a first and second cover portions. The second electrically conductive portion is connected to the first electrically conductive portion. The third electrically conductive portion is kept in contact with a terminal of the connector, and connected to the second electrically conductive portion. The first and second cover portions cover at least a part of the first and second electrically conductive portion.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a connector, and a component connected to the connector. The component includes a first and third electrically conductive portion on a first surface, a second electrically conductive portion on a second surface, and a first and second cover portions. The second electrically conductive portion is connected to the first electrically conductive portion. The third electrically conductive portion is kept in contact with a terminal of the connector, and connected to the second electrically conductive portion. The first and second cover portions cover at least a part of the first and second electrically conductive portion.

Abstract: According to one exemplary embodiment, a television apparatus includes: a housing; a circuit board housed in the housing; and an electronic component including a first face placed to a side of the circuit board and a second face placed opposite to the first face, and incorporating a silicon member. The electronic component comprises: an electrode provided at the first face and configured to be electrically connected to the circuit board; and a protrusion provided at the first face, placed between the silicon member and the circuit board, and separated from a surface of the circuit board.

Abstract: According to one embodiment, an electronic apparatus includes a flexible printed wiring board. The printed wiring board includes a plurality of insulating layers, a conductive layer, and a ground layer. The ground layer comprises a first conductive paste filled in a plurality of openings of a second insulating layer so as to cover a ground line exposed to bottoms of the plurality of openings. The ground layer further comprises a second conductive paste applied so as to continuously cover the first conductive paste and the second insulating layer. The first and second conductive pastes each contain conductive particles and binder resin that binds the conductive particles, and the second conductive paste has the conductive particles whose amount as compared to the binder resin is larger than the first conductive paste such that a volume resistivity of the second conductive paste becomes smaller than that of the first conductive paste.

Abstract: A flexible printed circuit board includes: a base film that has electrical insulation property; a conductive pattern that is formed on the base film and including a pair of differential signal lines and a ground line; an insulating layer that is formed on the conductive pattern; a conductive layer that is formed on the insulating layer; and a connecting portion that electrically connects the ground line and the conductive layer through a penetration hole formed on the insulating layer.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board accommodated in the hosing and including a first surface and a second surface located on an opposite side to the first surface, a flexible printed wiring board having an elasticity, electrically connected to the circuit board and provided from the first surface of the circuit board over to the second surface, and a pressing portion formed from a part of the flexible printed wiring board as it is bent, and pressing the flexible printed wiring board towards the first surface as it is brought into contact with the inner surface of the housing, which opposes the first surface of the circuit board.

Abstract: According to one embodiment, a plurality of conductive-paste-filling openings are provided in the cover layer to align with the conductive pattern portion, and a plurality of conductive portions are formed by filling conductive paste in the plurality of conductive-paste-filling openings to conductively join the metal layer to the conductive pattern portion.

Abstract: According to one embodiment, a printed wiring board includes an insulating layer, a first conductor pattern on the insulating layer configured to be a signal line, and a second conductor pattern on the insulating layer. The second conductor pattern includes a larger conductor area than the first conductor pattern, and a slit which allows the second conductor pattern to stretch to follow a thermal expansion of the insulating layer.

Abstract: According to one embodiment, an electronic apparatus includes a flexible printed wiring board. The printed wiring board includes a conductive layer including a signal line and a ground line, a second insulating layer layered on the conductive layer and including openings open to above the ground line, a ground layer covering the signal line and electrically connected to the ground line, and a third insulating layer covering the ground layer. The ground layer includes first and second conductive pastes. The first conductive paste is filled in the openings so as to cover the ground line exposed to bottoms of the openings. The second conductive paste is applied so as to continuously cover the first conductive paste and the second insulating layer. The second conductive paste has a smaller volume resistivity than the first conductive paste.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board accommodated in the hosing and including a first surface and a second surface located on an opposite side to the first surface, a flexible printed wiring board having an elasticity, electrically connected to the circuit board and provided from the first surface of the circuit board over to the second surface, and a pressing portion formed from a part of the flexible printed wiring board as it is bent, and pressing the flexible printed wiring board towards the first surface as it is brought into contact with the inner surface of the housing, which opposes the first surface of the circuit board.

Abstract: According to one embodiment, a printed wiring board includes an insulating layer, a first conductor pattern on the insulating layer configured to be a signal line, and a second conductor pattern on the insulating layer. The second conductor pattern includes a larger conductor area than the first conductor pattern, and a slit which allows the second conductor pattern to stretch to follow a thermal expansion of the insulating layer.

Abstract: According to one embodiment, an electronic apparatus includes a casing and a flexible printed wiring board contained in the casing. The flexible printed wiring board includes an insulating layer, which is sheet-like, a signal line formed on a first surface of the insulating layer, and a ground layer, which is conductive and formed on a second surface of the insulating layer opposite to the first surface. The ground layer includes a mesh portion having a mesh structure and a thin film portion which fills cells in the mesh structure of the mesh portion.

Abstract: According to one embodiment, there is provided a flexible printed circuit board including a base layer, a signal layer formed on a surface of the base layer, a cover layer covering the signal layer, a connecting pattern portion formed in the signal layer, an opening formed in the cover layer and surrounds periphery of the connecting pattern portion, a conductive shield material covering the cover layer in which part of the conductive shield material fills the opening, thereby adhering to an upper face and sides of the connecting pattern portion, and a protective layer covering the conductive shield material.

Abstract: According to one embodiment, a plurality of bumps are formed by repeatedly applying conductive paste to the conductive pattern portion, a plurality of bump-guiding openings are provided in the cover layer to align with the plurality of bumps, a plurality of crushed portions are formed by crushing heads of the plurality of bumps protruding from the cover layer through the bump-guiding openings, and a ground layer is formed on the cover layer. The ground layer is electrically connected to the plurality of crushed portions.

Abstract: According to one embodiment, a plurality of conductive-paste-filling openings are provided in the cover layer to align with the conductive pattern portion, and a plurality of conductive portions are formed by filling conductive paste in the plurality of conductive-paste-filling openings to conductively join the metal layer to the conductive pattern portion.

Abstract: An embodiment of a flexible printed wiring board includes: a base layer comprising one surface and the other surface, the one surface being exposed; a signal layer formed on the other surface of the base layer; a cover layer stacked on the base layer to cover the signal layer; and a ground layer coated on the cover layer to cover the signal layer, the ground layer comprising a conductive paste in which metal powder and metal nanoparticles are mixed.