Abstract: An object of the present invention is to provide an oligonucleotide useful as a therapeutic agent for dyslipidemia that has excellent binding affinity to the PCSK9 gene as well as stability and safety. The oligonucleotide of the present invention contains a sugar-modified nucleoside, the sugar-modified nucleoside has a bridging structure between 4?-position and 2?-position, and the oligonucleotide can bind to the human PCSK9 gene. Also, the present invention provides a therapeutic agent for dyslipidemia containing the oligonucleotide as an active ingredient, and the therapeutic agent preferably contains a bioabsorbable material as a carrier. The bioabsorbable material is preferably atelocollagen or peptide gel.

Abstract: An object of the present invention is to provide an oligonucleotide useful as a therapeutic agent for dyslipidemia that has excellent binding affinity to the PCSK9 gene as well as stability and safety. The oligonucleotide of the present invention contains a sugar-modified nucleoside, the sugar-modified nucleoside has a bridging structure between 4?-position and 2?-position, and the oligonucleotide can bind to the human PCSK9 gene. Also, the present invention provides a therapeutic agent for dyslipidemia containing the oligonucleotide as an active ingredient, and the therapeutic agent preferably contains a bioabsorbable material as a carrier. The bioabsorbable material is preferably atelocollagen or peptide gel.

Abstract: The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic wave shielding property, an excellent appearance property and an excellent legibility by a simple method. A process for the preparation of a light transmissive electromagnetic wave shielding material comprising; (A1) printing a pretreatment agent for electroless plating comprising a noble metal compound and a mixture of silane coupling agent and azole compound or a reaction product thereof in a mesh pattern on a transparent substrate 11 to form a mesh-patterned pretreatment layer 12, and (A2) subjecting the pretreatment layer 12 to electroless plating to form a mesh-patterned metal conductive layer 13 on the pretreatment layer 12.

Abstract: The present invention provides a process for efficiently preparing a light transmissive electromagnetic wave shielding material enhanced in light transmissive property, electromagnetic wave shielding property, appearance and legibility, and having high-accuracy mesh-pattern. The process for the preparation of a light transmissive electromagnetic wave shielding material comprising; printing in the form of mesh a pretreatment agent for electroless plating on a transparent substrate to form a mesh-shaped pretreatment layer, the pretreatment agent comprising a fine particle having an extremely-thin film of noble metal on its surface, and subjecting the mesh-shaped pretreatment layer to electroless plating to form a mesh-shaped metal conductive layer on the pretreatment layer.

Abstract: The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic wave shielding property, an excellent appearance property and an excellent legibility by a simple method. A process for the preparation of a light transmissive electromagnetic wave shielding material comprising; (A1) printing a pretreatment agent for electroless plating comprising a noble metal compound and a mixture of silane coupling agent and azole compound or a reaction product thereof in a mesh pattern on a transparent substrate 11 to form a mesh-patterned pretreatment layer 12, and (A2) subjecting the pretreatment layer 12 to electroless plating to form a mesh-patterned metal conductive layer 13 on the pretreatment layer 12.

Abstract: A method for producing an electromagnetic-wave-shielding light-transmitting window member comprising a transparent substrate and a conductive pattern formed by electroless plating on a surface of the transparent substrate. In the method, an ultraviolet-curable resin paste containing an electroless plating catalyst is applied to a surface of a transparent substrate, and the resulting printed pattern is cured by irradiation of ultraviolet light to form a resin pattern. Subsequently, a plating layer is deposited on the resin pattern by electroless plating treatment to form a conductive pattern. The ultraviolet-curable resin paste is selected from a group of sublimable resists and phthalocyanine-based sublimable materials and contains a volatile substance that is volatized by heating or irradiation. By using the ultraviolet-curable resin paste, a good conductive pattern having excellent adhesion to the transparent substrate can be formed with high accuracy, efficiently, and at low cost.

Abstract: The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic wave shielding property, an excellent appearance property and an excellent legibility by a simple method. A process for the preparation of a light transmissive electromagnetic wave shielding material comprising; (A1) printing a pretreatment agent for electroless plating comprising a composite metal oxide and/or a composite metal oxide hydrate and a synthetic resin in a mesh pattern on a transparent substrate 11 to form a mesh-patterned pretreatment layer 12, and (A3) subjecting the pretreatment layer 12 to electroless plating to form a mesh-patterned metal conductive layer on the pretreatment layer 13.

Abstract: The present invention provides a process for preparing the light transmissive electromagnetic wave shielding material having an enhanced productivity. A process for preparing a light transmissive electromagnetic shielding material comprising; coating a transparent substrate with a pretreatment agent for electroless plating comprising a noble metal compound and a mixture of silane coupling agent and azole compound or a reaction product thereof to form a coated layer and drying the coated layer to provide a pretreatment layer on the transparent substrate, forming a plating protective layer in the dot pattern on the pretreatment layer, and subjecting the exposing part of the pretreatment layer having no plating protective layer to electroless plating to form a metal conductive layer in the mesh pattern.

Abstract: A touch panel having excellent durability, in which depression is scarcely generated on the surface of the touch panel by pushing the surface with a pen, and a transparent conductive film and plate useful in the touch panel are provided. The transparent conductive film comprises a first polymer film having a transparent conductive thin layer thereon and a second polymer film having a hardcoat layer thereon, the first and second polymer films being bonded each other through an adhesive layer such that a surface having no transparent conductive thin layer of the first polymer film faces a surface having no hardcoat layer of the second polymer film, wherein work of the adhesive layer in elastic deformation is not less than 60%. The transparent conductive plate is provided with the adhesive layer, the touch panel is provided with the transparent conductive film or plate as an upper or lower electrode.

Abstract: An ultraviolet-curable resin paste containing an electroless plating catalyst is applied by printing to a surface of a transparent substrate 1, and the resulting printed pattern 2 is cured by irradiation of ultraviolet light to form a resin pattern 3. Subsequently, a plating layer 4 is deposited on the resin pattern 3 by electroless plating treatment to form a conductive pattern 5. The resin pattern 3 to be subjected to the electroless plating treatment has an uncured layer 3A provided on a surface thereof. During the electroless plating treatment, the uncured layer 3A is eroded in the plating bath and particles of the catalyst are exposed. It is possible to form a satisfactory plating layer 4 using the exposed catalyst particles as nuclei. By using the ultraviolet-curable resin paste, a good conductive pattern having excellent adhesion to the transparent substrate can be formed with high accuracy, efficiently, and at low cost.

Abstract: A touch panel having excellent durability, in which depression is scarcely generated on the surface of the touch panel by pushing the surface with a pen, and a transparent conductive film and plate useful in the touch panel are provided. The transparent conductive film comprises a first polymer film having a transparent conductive thin layer thereon and a second polymer film having a hardcoat layer thereon, the first and second polymer films being bonded each other through an adhesive layer such that a surface having no transparent conductive thin layer of the first polymer film faces a surface having no hardcoat layer of the second polymer film, wherein work of the adhesive layer in elastic deformation is not less than 60%. The transparent conductive plate is provided with the adhesive layer, the touch panel is provided with the transparent conductive film or plate as an upper or lower electrode.

Abstract: An adhesion-including film is provided, wherein the total light transmittance is varied in a width direction of the film. The adhesion-including film includes a mold release film, a first adhesive layer disposed on this mold release film, a second adhesive layer disposed on the first adhesive layer, a base film on the second adhesive layer, and an antireflection film disposed on the film surface opposite to the second adhesive layer of the base film. The first adhesive layer is highly colored as compared with the second adhesive layer. The second adhesive layer may be colorless. The thickness of the central portion of the first adhesive layer in the width direction of the film is larger than the thicknesses of both end sides. The total thickness of the first adhesive layer and the second adhesive layer is uniform all over the film.

Abstract: A holder for electroless plating to hold a plurality of ceramic elements for ceramic electronic parts during electroless plating treatment, each surface of said ceramic elements being to be electroless plated, said holder comprising a plurality of cells to house each of said plurality of ceramic elements separately, and each of said cells having such a structure as to permit the flow communication of a plating solution into the cell.

Abstract: A holder for electroless plating to hold a plurality of ceramic elements for ceramic electronic parts during electroless plating treatment, each surface of said ceramic elements being to be electroless plated, said holder comprising a plurality of cells to house each of said plurality of ceramic elements separately, and each of said cells having such a structure as to permit the flow communication of a plating solution into the cell.

Abstract: An adhesive composition for use in joining a polarizer plate to a substrate of a liquid crystal cell contains as a main component (1) an ethylene-vinyl acetate copolymer, (2) a copolymer of ethylene, vinyl acetate, and an acrylate and/or methacrylate monomer, (3) a copolymer of ethylene, vinyl acetate, and maleic acid and/or maleic anhydride, (4) a copolymer of ethylene, an acrylate and/or methacrylate monomer, and maleic acid and/or maleic anhydride or (5) an ionomer resin in the form of an ethylene-methacrylic acid copolymer having a metal ion for binding molecules thereof. The composition is thermosetting when it contains an organic peroxide. The composition is photo-curable when it contains a photosensitizer.

Abstract: A conductive paste capable of forming an excellent moisture-resistant electrode with a favorable ohmic contact formed between the electrode and the semiconductor element, said conductive paste comprising an aluminum powder and a glass frit containing at least one compound selected from the group consisting of barium borosilicate and calcium borosilicate as the principal component thereof, said glass frit accounting for 5 to 40% by weight with respect to the aluminum powder. Also claimed is a semiconductor ceramic component using the same.

Abstract: A sandwich glass is disclosed containing a thermoset resin layer interposed between glass plates, wherein the thermoset resin layer, prior to thermosetting, contains an uncured resin composition containing:(a) an organic peroxide,(b) an ethylene-vinyl acetate copolymer, and(c) at least one compound selected from the groupconsisting of at least one acryloxy or methacryloxy group-containing compound and a hydrocarbon resin having a ratio of hydrogenation .gtoreq.91%;wherein the at least one acryloxy or methacryloxy group-containing compound is selected from the group consisting of 1-methyl-1,3-dimethacryloxypropane, 2,2-dimethyl-1,3-diacryloxypropane, 2,2-dimethyl-1,3-dimethacryloxypropane, 2-hydroxy-1-acryloxy-3-methacryloxypropane, 2-hydroxy-1,3-dimethacryloxypropane, 1-hydroxy-2-methyl-1,3-diacryloxypropane and 1-hydroxy-2-methyl-1,3-dimethacryloxypropane and the ethylene-vinyl acetate copolymer contains vinyl acetate in an amount of 10-50% by weight.

Abstract: A plurality of semiconductor substrates having positive resistance-temperature coefficients are bonded to each other through a glass layer to be stacked. First and second terminal electrodes are formed on end surfaces of such a stacked structure respectively. First and second ohmic electrodes are formed on respective major surfaces of each semiconductor substrate, and the first and second ohmic electrodes are connected to the first and second terminal electrodes respectively. The ohmic electrodes contain a metal, other than silver, exhibiting an ohmic property, such as zinc, aluminum, nickel or chromium, for example. The terminal electrodes also contain a metal, other than silver, exhibiting an ohmic property. The terminal electrodes may be provided on surfaces thereof with layers which are made of a metal having excellent solderability.

Abstract: An ohmic electrode material for semiconductor ceramics comprises 48-96 weight % of aluminum and 4-52 weight % of silicon. A semiconductor ceramics element includes a semiconductor ceramics such as that of barium titanate system semiconductor ceramics and on the surface of the semiconductor ceramics is formed an ohmic electrode from the ohmic electrode material.

Abstract: A chip-type coil whose terminal electrodes are formed directly on a magnetic core and each comprise a mixture of electrically conductive material with insulating material, so that specific resistance of the terminal electrode can increase so as to reduce an eddy current flowing in the terminal electrode, thereby preventing Q-deterioration in the chip-type coil. Moreover, the chip-type coil is allowable of Q-deterioration caused by metal plating, thereby enabling the terminal electrodes to be applied with metal plating.