Abstract: Disclosed herein is a one-part polythiol-type epoxy resin composition having an excellent low-temperature quick curability and a good storage stability (shelf stability), which can be prepared by using, as essential components, (1) an epoxy resin having two or more epoxy groups per one molecule, (2) a thiol compound having two or more thiol groups per one molecule, (3) a solid dispersion-type latent curing accelerator and (4) a borate ester compound.

Abstract: Provided is an industrially advantageous process for producing an N-long chain acyl acidic amino acid by condensing an acidic amino acid with a long chain fatty acid halide in water in the presence of an alkali, wherein the reaction is performed in the presence of a polyhydric alcohol. The desired product is obtained in a high yield without the problems of odor and of safety owing to organic solvents and catalyst remaining in the desired product. The equipment for removal of the solvents is reduced, and production is simplified.

Abstract: N-long-chain acyl acidic amino acids or salts thereof are prepared by condensing an acidic amino acid or a salt thereof and a C.sub.8 -C.sub.22 long-chain fatty acid chloride in an aqueous solvent with stirring at a stirring power of not less than 0.2 kW/m.sup.3 while keeping the pH in the range of 10-13.

Abstract: An epoxy-resin composition containing, as essential components, (1) an epoxy resin having two or more epoxy groups in one molecule, (2) a solid-dispersing, amine adduct-type latent hardener, and (3) a titanium and/or zirconium alkoxide(s).

Abstract: An acid anhydride-containing one package epoxy resin composition consisting indispensably of (1) an epoxy resin having two or more epoxy groups in one molecule, (2) an acid anhydride, (3) at least one of (a) a liquid latent curing accelerator, (b) a latent curing accelerator soluble in an epoxy resin having two or more epoxy groups in one molecule and (c) a latent curing accelerator soluble in an acid anhydride, and (4) a dispersible latent curing accelerator, wherein the ratio of (1) to (2) is from 0.8 to 1.2, defined as the number of acid anhydride equivalents/the number of epoxy equivalents, and the amounts of (3) and (4) each are from 0.1 to 10 parts by weight to 100 parts by weight of the epoxy resin. The composition has excellent infiltrability, storage stability and reactivity.

Abstract: Epoxy resin compositions which contain (1) an epoxy resin which has two or more epoxy groups in its molecule, (2) a polythiol compound which has two or more thiol groups in its molecule and (3) an accelerator which is (i) a solid dispersion-type amine adduct latent curing accelerator or (ii) the product of a reaction between a compound which contains one or more isocyanate groups in its molecule and a compound which has at least one primary and/or secondary amino group in its molecule, exhibit excellent curability at relatively low heating temperatures as well as a long working life.

Abstract: A latent curing agent for epoxy resin, characterized in that the latent curing agent is the hydrazides of the formula (I);(NH.sub.2 NHCOCH.sub.2 CH.sub.2).sub.2 N(CH.sub.2).sub.11 CONHNH.sub.2 (I)The present curing agent is useful in formulating storable, one-package, heat-curable epoxy resin-based compositions.

Abstract: A curable epoxy resin composition, comprising (1) an alicyclic epoxy resin having an average of more than one epoxy group per molecule, (2) a polybasic acid hydrazide, and (3) a latent curing agent for said epoxy resin which comprises an addition product obtained by reacting (a) a polyfunctional epoxy compound with (b) a compound having at least one functional group in the molecule selected from the group consisting of OH, SH, COOH and CONHNH.sub.2 together with a tertiary amino group, or by reacting said components (a) and (b) with (c) an organic compound which has more than two active hydrogen atoms in the molecule, said reactions occurring under conditions in which the ratio of (a) to (b) or (a) to (b) and (c) ranges from 0.8 to 2.5 equivalents of (a) per equivalent of the total active hydrogen atoms in component (b) and in components (b) and (c), the molar ratio of (c) to (b) being 0.2:1 to 1:1, and said addition product having a softening point of 60.degree. to 180.degree. C.

Abstract: A latent curing agent for epoxy resin, characterized in that the latent curing agent is an adduct obtained by reacting (a) a polyfunctional epoxy compound, (b) a compound having at least one OH, NH.sub.2, NH or SH group together with a tertiary amino group in the molecule and (c) a carboxylic acid anhydride is a good curing agent for epoxy resins. The present curing agent is useful in formulating storable, one-package, heat-curable epoxy resin-based compositions.

Abstract: A latent curing agent for epoxy resin, characterized in that the latent curing agent is the hydrazides of the formula (I) or (II). ##STR1## The present curing agent is useful in formulating storable, one-package, heat-curable epoxy resin-based compositions.

Abstract: An addition product obtained by reacting (a) a polyfunctional epoxy compound and (b) a compound having at least one functional group of OH group, SH group, COOH group and CONHNH.sub.2 group together with a tertiary amino group in the molecule, and an addition product obtained (a), (b) and (c) an organic compound having two or more active hydrogen atoms in the molecule (excluding a compound having an epoxy group or tertiary amino group) are good curing agents for epxoy resin. The curing agents are useful in formulating novel storable one-package, heat-curable epoxy resin-based compositions.

Abstract: Hydrazides of the formula (I) or (II)N--CH.sub.2 CH.sub.2 CONHNH.sub.2).sub.3 (I)(NH.sub.2 NHCOCH.sub.2 CH.sub.2).sub.2 N--R--N--CH.sub.2 CH.sub.2 CONHNH.sub.2).sub.2 (II)are good latent curing agents for epoxy resin, in the formula (II) R is divalent hydrocarbon residue having 2-24 carbon atoms. The curing agents are useful in formulating novel storable one-package, heat-curable epoxy resin-based compositions.

Abstract: Hydrazides of the formula ##STR1## are good curing agents for epoxy resin, in the formula R.sub.1 and R.sub.2 being each hydrogen atom, C.sub.1 -C.sub.8 alkyl radical or --CH.sub.2 CH.sub.2 SCH.sub.3, R being hydrogen atom or methyl radical. The curing agents are useful in formulating novel storable one-package, heat-curable epoxy resins-based compositions.

Abstract: Hydrazides of the formula ##STR1## are good curing agents for epoxy resin. The curing agents are useful in formulating novel storable one-package, heat-curable epoxy resin-based compositions.