Abstract: A face alignment device of the present invention comprises two units that are each provided with: a convex semi-spherical block having a contact surface that makes contact with a clamp member for securing an object and a convex semi-spherical surface on the opposite side of the contact surface; and a base block having a concave portion corresponding to the semi-spherical surface of the convex semi-spherical block for rotatably holding the convex semi-spherical block, wherein the two units are arranged such that their contact surfaces face each other. The clamp member is attached to the contact surfaces of the respective units at eccentric positions from the center axes of the convex semi-spherical blocks. This is advantageous since a load required for rotational sliding between each of the semi-spherical surfaces of the convex semi-spherical blocks and each of the concave portions of the base blocks can be small.

Abstract: An apparatus for sealing a resin uses a liquid resin. A substrate has a frame for surrounding the substrate and is provided with a plurality of semiconductor devices. The substrate has a first opening portion. A squeegee guide plate is placed on the frame and has a second opening portion. The second opening portion is larger than first opening portion in size. A first squeegee moves along the squeegee guide plate in a first direction and rakes the liquid resin. The liquid resin is protuberated in order to bury the semiconductor devices. A second squeegee moves along the squeegee guide plate in a second direction opposite to the first direction and further rakes the liquid resin so as to smooth a surface of the liquid resin. A turning mechanism serves to turn the second squeegee in a circular arc form during the movement of the second squeegee.

Abstract: The present invention provides a face alignment device and a face alignment method, which can realize face alignment with a simple structure, a short period of time for adjustment, high productivity, high accuracy and without causing breakage and damage of the object.

Abstract: An apparatus for sealing a resin uses a liquid resin. A substrate has a frame for surrounding the substrate and is provided with a plurality of semiconductor devices. The substrate has a first opening portion. A squeegee guide plate is placed on the frame and has a second opening portion. The second opening portion is larger than first opening portion in size. A first squeegee moves along the squeegee guide plate in a first direction and rakes the liquid resin. The liquid resin is protuberated in order to bury the semiconductor devices. A second squeegee moves along the squeegee guide plate in a second direction opposite to the first direction and further rakes the liquid resin so as to smooth a surface of the liquid resin. A turning mechanism serves to turn the second squeegee in a circular arc form during the movement of the second squeegee.