Abstract: A pattern position detecting apparatus has an ITV camera for receiving the image of a pattern of the IC chip and a memory for storing therein the image signal from the ITV camera as a pattern data. When the pattern data is read out from the memory, a pattern section is shifted every second picture-element array in the horizontal and vertical directions and the picture elements are picked up every second picture element from the pattern section. The pattern data corresponding to the pattern sections read out from the memory are compared with reference pattern data, whereby determination is made of the degree of coincidence between both of the patterns. After determination has been made of the degrees of coincidence with respect to the whole pattern, detection is made of the position of the pattern section having the highest degree of coincidence among said degrees of coincidence in accordance with the address of the memory.

Abstract: The rear and front surfaces of a printed circuit board are illuminated by parallel light beams from first and second illuminating systems, respectively. The obtained transmitted light and reflected light are received by an image sensor through a lens system to provide video data which is stored in a video memory. Abrasion scars are formed by brushing the surfaces of terminals formed on the front surface of the printed circuit board prior to soldering. The presence or absence of a chip element is discriminated by a microprocessor in accordance with the difference between reflection factors of light emitted by the second illuminating system and reflected from the terminals and light reflected from the chip element.

Abstract: Image data of lead terminals and a chip element provided on a circuit board are stored on a video memory. Part of the video data stored in the video memory is read out and stored in a RAM by a microprocessor to be compared with reference pattern data stored in an external memory. The position of the chip element is checked in this way by having reference to the lead terminals.