Patents by Inventor Kiyonari Hiramatsu
Kiyonari Hiramatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7838618Abstract: A process for producing a phenylene ether oligomer comprising oxidative polymerization of a specific bivalent phenol compound and a specific monovalent phenol compound in an aromatic hydrocarbon solvent, wherein the aromatic hydrocarbon solvent of a phenylene ether oligomer solution obtained after the termination of the polymerization is replaced with a water-soluble organic solvent having a boiling point higher than that of the aromatic hydrocarbon solvent and the resultant phenylene ether oligomer solution is brought into contact with water, thereby precipitating the phenylene ether oligomer as particles.Type: GrantFiled: May 24, 2007Date of Patent: November 23, 2010Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Kiyonari Hiramatsu, Yoshio Mukai, Hidemi Hirashima, Yuji Takeda
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Patent number: 7786219Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.Type: GrantFiled: October 30, 2009Date of Patent: August 31, 2010Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Katsutoshi Yamazaki
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Publication number: 20100048826Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.Type: ApplicationFiled: October 30, 2009Publication date: February 25, 2010Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
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Patent number: 7632912Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.Type: GrantFiled: April 21, 2009Date of Patent: December 15, 2009Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
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Publication number: 20090205856Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.Type: ApplicationFiled: April 21, 2009Publication date: August 20, 2009Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
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Patent number: 7560518Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.Type: GrantFiled: May 29, 2008Date of Patent: July 14, 2009Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
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Publication number: 20090176962Abstract: A process for producing a phenylene ether oligomer comprising oxidative polymerization of a specific bivalent phenol compound and a specific monovalent phenol compound in an aromatic hydrocarbon solvent, wherein the aromatic hydrocarbon solvent of a phenylene ether oligomer solution obtained after the termination of the polymerization is replaced with a water-soluble organic solvent having a boiling point higher than that of the aromatic hydrocarbon solvent and the resultant phenylene ether oligomer solution is brought into contact with water, thereby precipitating the phenylene ether oligomer as particles.Type: ApplicationFiled: May 24, 2007Publication date: July 9, 2009Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kiyonari Hiramatsu, Yoshio Mukai, Hidemi Hirashima, Yuji Takeda
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Patent number: 7446154Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), HO—YaO—X—OY—ObH ??(1) HO—X—OH ??(2) Y—OH ??(3) wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.Type: GrantFiled: February 13, 2008Date of Patent: November 4, 2008Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Akikazu Amagai, Kenzi Ishii, Kiyonari Hiramatsu, Makoto Miyamoto, Daisuke Ohno, Katsutoshi Yamazaki, Yasumasa Norisue
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Publication number: 20080269427Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.Type: ApplicationFiled: May 29, 2008Publication date: October 30, 2008Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
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Patent number: 7393904Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.Type: GrantFiled: August 17, 2007Date of Patent: July 1, 2008Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
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Publication number: 20080154006Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), H?O—Y?a?O—X—O??Y—O?bH ??(1) HO—X—OH ??(2) Y—OH ??(3) wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.Type: ApplicationFiled: February 13, 2008Publication date: June 26, 2008Inventors: Akikazu Amagai, Kenzi Ishii, Kiyonari Hiramatsu, Makoto Miyamoto, Daisuke Ohno, Katsutoshi Yamazaki, Yasumasa Norisue
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Patent number: 7388057Abstract: A bifunctional phenylene ether oligomer containing monophenylene and biphenylene moieties can be rendered thermosetting by reacting the terminal phenolic hydroxyl groups with a) a cyanogen halide to introduce terminal cyanate groups, b) a halogenated glycidyl to form terminal epoxy groups, or c) an allyl halide to produce allylic terminal groups. The epoxy-terminated phenylene ether oligomer can be further reacted acrylic and/or methacrylic acid to yield an epoxy di(meth)acrylate which can be further modified with a carboxylic acid or anhydride to obtain and acid-modified epoxy di(meth)acrylate.Type: GrantFiled: June 22, 2007Date of Patent: June 17, 2008Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Akikazu Amagai, Kenzi Ishii, Kiyonari Hiramatsu, Makoto Miyamoto, Daisuke Ohno, Katsutoshi Yamazaki, Yasumasa Norisue
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Publication number: 20080033117Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.Type: ApplicationFiled: August 17, 2007Publication date: February 7, 2008Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
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Publication number: 20070265423Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.Type: ApplicationFiled: June 22, 2007Publication date: November 15, 2007Inventors: Akikazu Amagai, Kenzi Ishii, Kiyonari Hiramatsu, Makoto Miyamoto, Daisuke Ohno, Katsutoshi Yamazaki, Yasumasa Norisue
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Patent number: 7276563Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.Type: GrantFiled: November 4, 2004Date of Patent: October 2, 2007Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
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Patent number: 7247682Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.Type: GrantFiled: April 21, 2005Date of Patent: July 24, 2007Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Akikazu Amagai, Kenzi Ishii, Kiyonari Hiramatsu, Makoto Miyamoto, Daisuke Ohno, Katsutoshi Yamazaki, Yasumasa Norisue
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Publication number: 20060160982Abstract: A process for the production of a bifunctional phenylene ether oligomer compound having no amine adduct represented by the formula (1), which process comprises oxidatively polymerizing a bivalent phenol and a monovalent phenol in the presence of a copper-containing catalyst and a tertiary amine, a secondary amine having a secondary alkyl group, a tertiary alkyl group or an aryl group, or a mixture of both, [Chemical Formula 1] wherein R1, R2, R3, R7, R8, R9 and R10 are the same or different and represent a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, R4, R5, R6, R11 and R12 are the same or different and represent a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and each of m and n is an integer of from 0 to 25, provided that at least one of a and b is not 0.Type: ApplicationFiled: March 23, 2004Publication date: July 20, 2006Inventors: Kenji Ishii, Yasumasa Norisue, Katsuhiko Yanagida, Makoto Miyamoto, Masanori Shimuta, Kiyonari Hiramatsu
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Patent number: 6962744Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), (wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.Type: GrantFiled: May 24, 2004Date of Patent: November 8, 2005Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Akikazu Amagai, Kenzi Ishii, Kiyonari Hiramatsu, Makoto Miyamoto, Daisuke Ohno, Katsutoshi Yamazaki, Yasumasa Norisue
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Publication number: 20050186430Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), HO—YaO—X—OY—ObH??(1) HO—X—OH??(2) Y—OH??(3) wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.Type: ApplicationFiled: April 21, 2005Publication date: August 25, 2005Inventors: Akikazu Amagai, Kenzi Ishii, Kiyonari Hiramatsu, Makoto Miyamoto, Daisuke Ohno, Katsutoshi Yamazaki, Yasumasa Norisue
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Publication number: 20050065241Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.Type: ApplicationFiled: November 4, 2004Publication date: March 24, 2005Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno