Patents by Inventor Ki-Yong Ahn

Ki-Yong Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240098885
    Abstract: A communication apparatus is provided to include an apparatus enclosure that includes a substrate seating surface and at least one or more connection grooves formed on the substrate seating surface, a first printed circuit board disposed on the substrate seating surface, a second printed circuit board disposed on the substrate seating surface on one side of the first printed circuit board, and at least one or more connectors disposed within the connection groove and configured to electrically connect the first printed circuit board and the second printed circuit board.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicant: KMW INC.
    Inventors: Bae Mook JEONG, Kyo Sung JI, Seong Min AHN, Chi Back RYU, Jae Eun KIM, Seung Min LEE, Ki Hun PARK, Won Jun PARK, Duk Yong KIM
  • Publication number: 20240088553
    Abstract: The present invention relates to a signal shielding apparatus and an antenna apparatus including same, and in particular, comprises a shield cover which is stacked and disposed on a printed board assembly (hereinafter, abbreviated to “PBA”), in which a plurality of signal-related components are mounted on one side thereof to prevent leakage of a signal from the plurality of signal-related components, wherein a grooved shield cover seating groove is formed in one surface of the PBA, and an insertion end insertably seated in the shield cover seating groove is integrally formed in the other surface from among one surface and the other surface of the shield cover, the other surface facing the one surface of the PBA, thereby providing advantages in that an increase in the manufacturing cost may be prevented, EMI shielding may be facilitated, and heat dissipation performance may be significantly improved.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 14, 2024
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Bae Mook JEONG, Kyo Sung JI, Chi Back RYU, Won Jun PARK, Jun Woo YANG, Seong Min AHN, Ki Hun PARK, Jae Eun KIM
  • Patent number: 6134158
    Abstract: The semiconductor device having a plurality of redundancy input/output lines is disclosed. The device includes a plurality of input/output lines through which data are transmitted, a plurality of redundancy input/output lines, a plurality of data bus lines connected with the input/output lines and the redundancy input/output lines, respectively, a plurality of switching units connected with the redundancy input/output lines and the data bus lines, and a redundancy circuit connected with the switching units and connected with one among the input/output lines and one among the data bus lines for thereby repairing a plurality of defective input/output lines by providing a plurality of redundancy input/output lines.
    Type: Grant
    Filed: November 27, 1998
    Date of Patent: October 17, 2000
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventor: Ki-Yong Ahn