Abstract: An automatic dimension analyzer is disclosed which comprises a power driven table on which an object being measured is placed, the table being movable in orthogonal directions, and an optical system for forming an optical image of the object in a sample point field. The sample point field is electronically scanned in a rectangular raster format to produce sample point data bits each representing a sample point having a predetermined optical level. A cursor generator is synchronized with the raster to generate a cursor in the sample point field. A coincidence detector is provided to detect a coincidence between a sample point data bit and the cursor. Measurement instructions are stored in sequentially addressible locations of a memory through a data entry means.

Abstract: The present invention relates to an improvement in the lapping method of wafer-like work pieces in a lapping machine to lap the work pieces by sandwiching them between relatively rotatable upper and lower surface plates, in which the thickness of the work pieces under lapping is determined by an in-machine manner with a sensor mounted on the upper surface plate. Different from conventional lapping methods with an in-machine measurement of the thickness, the thickness of the work pieces is computed only once at regular intervals corresponding to one relative revolution of the surface plates so that the errors due to the operation per se of the lapping machine such as the undulated revolution of the surface plates, vibration of the machine and the like can be eliminated and very much improved control means for the thickness of the work pieces under lapping can be obtained.