Abstract: A radio frequency module includes a mount board, an acoustic wave filter, a temperature sensor, and a correction circuit. The mount board has a first principal surface and a second principal surface on opposite sides of the mount board. The acoustic wave filter is disposed on the first principal surface side of the mount board. The temperature sensor is disposed on the second principal surface side of the mount board. The correction circuit corrects a pass band of the acoustic wave filter in accordance with a temperature measured by the temperature sensor.

Abstract: In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.

Abstract: A radio frequency (RF) module including a module substrate; a filter with a passband including communication band for TDD; a switch connected to the filter; a power amplifier that is arranged on a first surface of the module substrate and connected to the filter via the switch; a low-noise amplifier that is arranged on a second surface of the module substrate and connected to the filter via the switch; a filter with a passband including communication band; a low-noise amplifier that is arranged on the second surface and connected to the filter; and a conductive member arranged between the low-noise amplifiers on the second surface.

Abstract: A high-frequency circuit includes: a diplexer that is composed of a filter which has a pass band including a first frequency band group and a filter which has a pass band including a second frequency band group; a notch filter that is connected with the filter and whose stop band is a frequency band which is not included in a first communication band; a notch filter that is connected with the filter and whose stop band is a frequency band which is not included in a second communication band; and switches that are connected with the notch filters. A band pass filter whose pass band is the first communication band and a band pass filter whose pass band is the second communication band are not connected between the filter and the switches.

Abstract: A radio frequency (RF) module including a module substrate; a filter with a passband including communication band for TDD; a switch connected to the filter; a power amplifier that is arranged on a first surface of the module substrate and connected to the filter via the switch; a low-noise amplifier that is arranged on a second surface of the module substrate and connected to the filter via the switch; a filter with a passband including communication band; a low-noise amplifier that is arranged on the second surface and connected to the filter; and a conductive member arranged between the low-noise amplifiers on the second surface.

Abstract: A radio frequency module includes a mount board, an acoustic wave filter, a temperature sensor, and a correction circuit. The mount board has a first principal surface and a second principal surface on opposite sides of the mount board. The acoustic wave filter is disposed on the first principal surface side of the mount board. The temperature sensor is disposed on the second principal surface side of the mount board. The correction circuit corrects a pass band of the acoustic wave filter in accordance with a temperature measured by the temperature sensor.

Abstract: A circuit module includes a first wiring substrate having a first main surface and a plurality of first components mounted on the first main surface. The plurality of first components includes a multilayer component formed as a single chip by being sealed using resin members. The multilayer component includes a second wiring substrate having a second main surface and a third main surface that face each other, a second component mounted on the second main surface, and a third component mounted on the third main surface.

Abstract: A high-frequency circuit includes a first signal path transmitting a high-frequency signal in a first frequency band group, a second signal path transmitting a high-frequency signal in a second frequency band group, a switch including a common terminal and selection terminals, a first low noise amplifier including an input terminal connected to the first signal path and an output terminal connected to a first selection terminal, a second low noise amplifier including an input terminal connected to the second signal path and an output terminal connected to a second selection terminal, and an output-side impedance matching circuit that matches impedance at the output side of the first low noise amplifier or impedance at the output side of the second low noise amplifier with a predetermined impedance with a conductive state between the a third selection terminal and the common terminal.

Abstract: A front-end module includes a switch, a first filter including an input end connected to a first selection terminal, a second filter including input end connected to a second selection terminal, and an impedance matching circuit connected to a selection terminal, a pass band impedance when viewing the first filter side from a common terminal in a state in which the common terminal and only the first selection terminal are connected is different from a pass band impedance when viewing the second filter side from the common terminal in a state that the common terminal and only the second selection terminal are connected. When the common terminal and the first selection terminal are connected, the common terminal and the selection terminal are connected, and when the common terminal and the second selection terminal are connected, the common terminal and the selection terminal are not connected.

Abstract: A front-end module includes a switch, a first filter including an input end connected to a first selection terminal, a second filter including input end connected to a second selection terminal, and an impedance matching circuit connected to a selection terminal, a pass band impedance when viewing the first filter side from a common terminal in a state in which the common terminal and only the first selection terminal are connected is different from a pass band impedance when viewing the second filter side from the common terminal in a state that the common terminal and only the second selection terminal are connected. When the common terminal and the first selection terminal are connected, the common terminal and the selection terminal are connected, and when the common terminal and the second selection terminal are connected, the common terminal and the selection terminal are not connected.

Abstract: A high-frequency circuit includes a first signal path transmitting a high-frequency signal in a first frequency band group, a second signal path transmitting a high-frequency signal in a second frequency band group, a switch including a common terminal and selection terminals, a first low noise amplifier including an input terminal connected to the first signal path and an output terminal connected to a first selection terminal, a second low noise amplifier including an input terminal connected to the second signal path and an output terminal connected to a second selection terminal, and an output-side impedance matching circuit that matches impedance at the output side of the first low noise amplifier or impedance at the output side of the second low noise amplifier with a predetermined impedance with a conductive state between the a third selection terminal and the common terminal.

Abstract: A directional coupler that has a degree of coupling that is close to constant and is to be used in a predetermined frequency band includes a main line between a first outer electrode and a second outer electrode. A sub-line is provided between a third outer electrode and a fourth outer electrode and is electromagnetically coupled with the main line. A low pass filter is provided between the third outer electrode and the sub-line and has a characteristic in which attenuation increases with increasing frequency in a predetermined frequency band.

Abstract: A directional coupler that has a degree of coupling that is close to constant and is to be used in a predetermined frequency band includes a main line between a first outer electrode and a second outer electrode. A sub-line is provided between a third outer electrode and a fourth outer electrode and is electromagnetically coupled with the main line. A low pass filter is provided between the third outer electrode and the sub-line and has a characteristic in which attenuation increases with increasing frequency in a predetermined frequency band.

Abstract: An opening/closing device for a lid adapted to openably cover an opening of, for example, a trunk of a motorcar does not substantially project into the trunk when the lid is closed. An elongated guide slot extends along a side edge of the opening. A first arm member has one end fixedly secured to the lid and the other end slidably fitted in the guide slot. A second arm member has one end pivotably mounted on the first arm member or on the lid and the other end pivotably mounted on the side edge of the opening. The first and second arm members are adapted to be folded into positions substantially parallel to each other when the lid is closed.