Patents by Inventor Kiyoshi Asakawa

Kiyoshi Asakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite plating film for sliding member
    Patent number: 5185216
    Abstract: Disclosed is a composite plating film for sliding members, essentially containing at least one of the alloy elements selected from tin, indium, antimony, and copper; inorganic particles; and lead; the composition of the composite plating film being:a) at least one of the alloy elements selected from tin, indium, antimony, and copper . . . 2 to 30 weight % in total;b) inorganic particles . . . 0.3 to 25 volume %; andc) lead . . . the balance.
    Type: Grant
    Filed: August 29, 1990
    Date of Patent: February 9, 1993
    Assignees: Daido Metal Company Ltd., C. Uyemura & Company, Ltd.
    Inventors: Tadashi Tanaka, Masaaki Sakamoto, Motomu Wada, Hideo Ishikawa, Sowjun Matsumura, Tadashi Chiba, Kiyoshi Asakawa, Syoichi Oohora
  • Bath and method for electrodepositing tin, lead and tin-lead alloy
    Patent number: 5185076
    Abstract: A bath for electrodepositing tin, lead or an alloy thereof, containing a tin and/or lead ion and a sulfate ion becomes stable at pH 1 or higher when a condensed phosphate ion is added thereto. The bath is effective for depositing tin-lead alloy films on sealing glass-metal integrated articles.
    Type: Grant
    Filed: April 12, 1991
    Date of Patent: February 9, 1993
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Isamu Yanada, Tooru Murakami, Kiyoshi Asakawa