Patents by Inventor Kiyoshi Awai

Kiyoshi Awai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Film deposition method for forming copper film
    Patent number: 6220204
    Abstract: A film deposition apparatus to which the present invention is applied comprises a vacuum chamber 11, a plasma beam generator 13, a main hearth 30 which is disposed within the vacuum chamber and which serves as an anode containing a vaporizable material Cu, and an auxiliary anode 31 surrounding the main hearth, the auxiliary anode being formed of an annular permanent magnet 35 and a coil 36. A Cu film is formed on a substrate 41 placed opposite to the main hearth.
    Type: Grant
    Filed: June 9, 1999
    Date of Patent: April 24, 2001
    Assignee: Sumitomo Heavy Industries, Ltd.
    Inventors: Hiroyuki Makino, Masaru Tanaka, Kiyoshi Awai, Toshiyuki Sakemi