Patents by Inventor Kiyoshi Hatanaka

Kiyoshi Hatanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7439829
    Abstract: The present invention provides an RF module capable of converting electromagnetic waves in the TE mode to balanced electromagnetic waves in the TEM mode without adjustment and outputting the balanced electromagnetic waves while easily realizing miniaturization. The RF module includes: a waveguide (3) in which a half-wavelength TE mode resonator (2) is formed; an E plane coupling window (4) formed in a wall portion (3a) orthogonal to an H plane out of wall portions (3a) to (3e) constructing the TE mode resonator (2) in the waveguide (3); an output line (5a) provided at the edge on the side of the wall portion (3d) parallel with the H plane on the E plane coupling window (4), and magnetically coupled to electromagnetic waves in the TE mode resonator (2); and another output line (5b) provided at the edge on the side of the wall portion (3e) parallel with the H plane in the E plane coupling window (4), and magnetically coupled to the electromagnetic waves.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: October 21, 2008
    Assignee: TDK Corporation
    Inventors: Tatsuya Fukunaga, Masaaki Ikeda, Kiyoshi Hatanaka
  • Patent number: 7403085
    Abstract: The present invention provides an RF module capable of outputting balanced electromagnetic waves without requiring adjustment and easily realizing miniaturization. The RF module includes: a waveguide (3) having an area which is surrounded by a pair of ground electrodes (6) and (7) provided so as to face each other and through holes (8) for making electric conduction between the pair of ground electrodes (6) and (7) and in which electromagnetic waves in the TE mode can propagate and a one-wavelength resonator (11) is formed; and a pair of output lines (4a) and (4b) connected to portions corresponding to half-wavelength resonance regions (A) and (B) of the one-wavelength resonator (11) in the ground electrode (6).
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: July 22, 2008
    Assignee: TDK Corporation
    Inventors: Tatsuya Fukunaga, Masaaki Ikeda, Kiyoshi Hatanaka
  • Publication number: 20080152928
    Abstract: A highly reliable ceramics substrate which can sufficiently secure a bonding strength of a surface conductor in an initial state and after a lapse of time (e.g., after a PCT) is provided. The multilayer ceramics substrate has a surface conductor on at least one surface of a multilayer body constituted by a plurality of laminated ceramics substrate layers. A reaction phase formed by a reaction between a ceramics component in the ceramics substrate layers and a glass component in the surface conductor is deposited at an interface between the surface conductor and ceramics substrate layers. For example, an alumina filler in the ceramics substrate layers and Zn in the surface conductor react with each other, thereby forming ZnAl2O4 as the reaction phase.
    Type: Application
    Filed: December 10, 2007
    Publication date: June 26, 2008
    Applicant: TDK CORPORATION
    Inventors: Yasuharu Miyauchi, Toshiyuki Suzuki, Masaharu Hirakawa, Tomoko Nakamura, Toshinobu Miyakoshi, Kiyoshi Hatanaka
  • Publication number: 20070177958
    Abstract: The present invention provides a join structure comprised of a box section column and split T-section joined by a high strength bolt and a method of securing a nut to an inside of the box section column. The present invention further provides a Torque-Shear type high strength bolt tightly tightened by a controlled tension and a joining method of a steel member using that bolt. The join structure is comprised of a box section column, a split T-section attached to its outer surface, and a high strength bolt inserted from the outside of the split T-section and fastened with the nut. The nut is secured to the box section column by joining a sleeve secured to a washer formed integrally with the nut and a sleeve of a nut holding part from the outside of the column. The Torque-Shear type high strength bolt has a pintail for controlling the torque at its top.
    Type: Application
    Filed: March 22, 2007
    Publication date: August 2, 2007
    Applicants: Nippon Steel Corporation, Nippon Steel Bolten Co., Ltd.
    Inventors: Nobuyoshi Uno, Masahiro Nagata, Hidetoshi Tamasaki, Seiichi Kanazawa, Kiyoshi Hatanaka, Toshio Miyagawa
  • Patent number: 7243424
    Abstract: An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of flexibility in design and make the multilayer ceramic substrate compact in size. A multilayer ceramic substrate in accordance with the invention is formed of a plurality of laminated ceramic substrates including such a composite ceramic substrate of different materials that is made by inserting the second ceramic substrate in a pounched-out portion made in the first ceramic substrate and by planarizing its top and bottom surfaces, wherein a conductive layer is formed in a portion across a boundary between the first ceramic substrate and the second ceramic substrate of the interface of the composite ceramic substrate of different materials.
    Type: Grant
    Filed: February 17, 2005
    Date of Patent: July 17, 2007
    Assignee: TDK Corporation
    Inventors: Kiyoshi Hatanaka, Haruo Nishino, Hideaki Ninomiya
  • Publication number: 20070110956
    Abstract: An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of flexibility in design and make the multilayer ceramic substrate compact in size. A multilayer ceramic substrate in accordance with the invention is formed of a plurality of laminated ceramic substrates including such a composite ceramic substrate of different materials that is made by inserting the second ceramic substrate in a pounched-out portion made in the first ceramic substrate and by planarizing its top and bottom surfaces, wherein a conductive layer is formed in a portion across a boundary between the first ceramic substrate and the second ceramic substrate of the interface of the composite ceramic substrate of different materials.
    Type: Application
    Filed: January 12, 2007
    Publication date: May 17, 2007
    Applicant: TDK Corporation
    Inventors: Kiyoshi HATANAKA, Haruo Nishino, Hideaki Ninomiya
  • Patent number: 7204667
    Abstract: A join structure comprises a box section column and spit T-section joined by a high strength bolt and a method secures a nut to an inside of the box section column. A Torque-Shear type high strength bolt is tightly tightened by a controlled tension and a joining method of a steel member uses that bolt. The join structure is comprised of a box section column, a split T-section attached to its outer surface, and a high strength bolt inserted from the outside of the split T-section and fastened with the nut. The nut is secured to the box section column by joining a sleeve secured to a washer formed integrally with the nut and a sleeve of a nut holding part from the outside of the column. The Torque-Shear type high strength bolt has a pintail for controlling the torque at its top.
    Type: Grant
    Filed: December 18, 2001
    Date of Patent: April 17, 2007
    Assignees: Nippon Steel Corporation, Nippon Steel Bolten Co., Ltd.
    Inventors: Nobuyoshi Uno, Masahiro Nagata, Hidetoshi Tamasaki, Seiichi Kanazawa, Kiyoshi Hatanaka, Toshio Miyagawa
  • Patent number: 7155816
    Abstract: A method for producing a multilayer ceramic substrate having a cavity formed therein includes punching a through opening corresponding to the cavity in green sheets constituting a laminate, and printing a conductor at a predetermined position of the green sheets, laminating the green sheets to constitute a green sheet laminate, and applying a pressure to the green sheet laminate by using a compression member having a projection at a position corresponding to the cavity to thereby compress the green sheet laminate. The projection has a height which is equal to the depth of the cavity multiplied by compression ratio of the green sheet laminate, and the green sheet laminate is compressed by applying the pressure such that compression ratio of the bottom of the cavity is identical with the compression ratio of other parts of the green sheet laminate.
    Type: Grant
    Filed: January 31, 2003
    Date of Patent: January 2, 2007
    Assignee: TDK Corporation
    Inventors: Hideaki Ninomiya, Haruo Nishino, Kiyoshi Hatanaka
  • Publication number: 20060284704
    Abstract: The present invention provides an RF module capable of outputting balanced electromagnetic waves without requiring adjustment and easily realizing miniaturization. The RF module includes: a waveguide (3) having an area which is surrounded by a pair of ground electrodes (6) and (7) provided so as to face each other and through holes (8) for making electric conduction between the pair of ground electrodes (6) and (7) and in which electromagnetic waves in the TE mode can propagate and a one-wavelength resonator (11) is formed; and a pair of output lines (4a) and (4b) connected to portions corresponding to half-wavelength resonance regions (A) and (B) of the one-wavelength resonator (11) in the ground electrode (6).
    Type: Application
    Filed: March 31, 2004
    Publication date: December 21, 2006
    Applicant: TDK Corporation
    Inventors: Tatsuya Fukunaga, Masaaki Ikeda, Kiyoshi Hatanaka
  • Publication number: 20060234023
    Abstract: A multilayer ceramic substrate having a cavity is formed by the steps of laminating a plurality of ceramic green sheets including ceramic green sheets having through holes corresponding to the cavity to form a multilayer body, pressing the multilayer body and firing the pressed body. At this time, a shrinkage suppression green sheet is laminated on the surface of the a ceramic green sheet constituting the outermost layer of the multilayer body, and a shrinkage suppression green sheet piece is disposed on the ceramic green sheet exposed to the bottom of the cavity in accordance with the shape of the cavity. A burnable sheet is further disposed on the shrinkage suppression green sheet piece. Before the pressing step, an embedded green sheet separate from the ceramic green sheets (portion separated by inserting a cut) is disposed on the shrinkage suppression green sheet piece or the burnable sheet so that it is filled in the cavity. After the firing step, the embedded green sheet fired is removed.
    Type: Application
    Filed: April 18, 2006
    Publication date: October 19, 2006
    Applicant: TDK CORPORATION
    Inventors: Kenji Endou, Kiyoshi Hatanaka, Masaharu Hirakawa, Haruo Nishino, Hideaki Fujioka
  • Publication number: 20060152307
    Abstract: The present invention provides an RF module capable of converting electromagnetic waves in the TE mode to balanced electromagnetic waves in the TEM mode without adjustment and outputting the balanced electromagnetic waves while easily realizing miniaturization. The RF module includes: a waveguide (3) in which a half-wavelength TE mode resonator (2) is formed; an E plane coupling window (4) formed in a wall portion (3a) orthogonal to an H plane out of wall portions (3a) to (3e) constructing the TE mode resonator (2) in the waveguide (3); an output line (5a) provided at the edge on the side of the wall portion (3d) parallel with the H plane on the E plane coupling window (4), and magnetically coupled to electromagnetic waves in the TE mode resonator (2); and another output line (5b) provided at the edge on the side of the wall portion (3e) parallel with the H plane in the E plane coupling window (4), and magnetically coupled to the electromagnetic waves.
    Type: Application
    Filed: March 31, 2004
    Publication date: July 13, 2006
    Applicant: TKD CORPORATION
    Inventors: Tatsuya Fukunaga, Masaaki Ikeda, Kiyoshi Hatanaka
  • Publication number: 20060127568
    Abstract: A plurality of first green sheets forming first ceramic layers after firing are stacked to form a first pre-fired substrate 4. Next, a plurality of second green sheets forming second ceramic layers after firing are stacked to form a second pre-fired substrate. Next, the first pre-fired substrate 4 is formed with recesses 10. Next, first pre-fired blocks 6 of sizes fitting into the recesses are formed from the second pre-fired substrate. The first pre-fired blocks 6 are fit into the recesses 10 so that the stacking direction A of the first green sheets and the stacking direction A? of the second green sheets become the same. The first pre-fired substrate 4 in which the first pre-fired blocks 6 are fit is fired.
    Type: Application
    Filed: January 20, 2004
    Publication date: June 15, 2006
    Applicant: TDK Corporation
    Inventors: Kiyoshi Hatanaka, Hideaki Ninomiya, Haruo Nishino, Takeshi Takahashi
  • Publication number: 20050189137
    Abstract: An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of flexibility in design and make the multilayer ceramic substrate compact in size. A multilayer ceramic substrate in accordance with the invention is formed of a plurality of laminated ceramic substrates including such a composite ceramic substrate of different materials that is made by inserting the second ceramic substrate in a pounched-out portion made in the first ceramic substrate and by planarizing its top and bottom surfaces, wherein a conductive layer is formed in a portion across a boundary between the first ceramic substrate and the second ceramic substrate of the interface of the composite ceramic substrate of different materials.
    Type: Application
    Filed: February 17, 2005
    Publication date: September 1, 2005
    Applicant: TDK Corporation
    Inventors: Kiyoshi Hatanaka, Haruo Nishino, Hideaki Ninomiya
  • Publication number: 20040089472
    Abstract: This invention provides a multilayer ceramic substrate which has a consistent quality, and which has with no swelling or collapse in the inner periphery of the cavity, wherein the bottom of the cavity is flat to enable stable packaging of the desired device at a high precision, and wherein L and C can be formed by the internal conductor at a high precision; and a method for producing a multilayer ceramic substrate and an apparatus therefor by which a multilayer ceramic substrate can be readily produced in a simple procedure by using an apparatus of simple structure.
    Type: Application
    Filed: January 31, 2003
    Publication date: May 13, 2004
    Applicant: TDK CORPORATION
    Inventors: Hideaki Ninomiya, Haruo Nishino, Kiyoshi Hatanaka
  • Publication number: 20030021652
    Abstract: The present invention provides a join structure comprised of a box section column and split T-section joined by a high strength bolt and a method of securing a nut to an inside of the box section column. The present invention further provides a Torque-Shear type high strength bolt tightly tightened by a controlled tension and a joining method of a steel member using that bolt. The join structure is comprised of a box section column, a split T-section attached to its outer surface, and a high strength bolt inserted from the outside of the split T-section and fastened with the nut. The nut is secured to the box section column by joining a sleeve secured to a washer formed integrally with the nut and a sleeve of a nut holding part from the outside of the column.
    Type: Application
    Filed: August 16, 2002
    Publication date: January 30, 2003
    Inventors: Nobuyoshi Uno, Masahiro Nagata, Hidetoshi Tamasaki, Seiichi Kanazawa, Kiyoshi Hatanaka, Toshio Miyagawa
  • Patent number: 4270364
    Abstract: A freezing refrigerator has a freezing box with side plates, top and bottom plates, and a back plate. Foodstuff products may be stored in the freezing box. The top, bottom and back plates are made of thermal conductive material. First and second envelopes are provided around the outer surfaces of the top and bottom plates. The top plate is cooled at a lower temperature by at least 5.degree. C. than the bottom plate. A heater is disposed on the outer surfaces of the top and bottom plates for purpose of melting the frost intensively produced on the inner surface of the top plate. The outer surfaces of the top and bottom plates have hydrophilic and smooth surfaces. The outer surface of the top plate is slanted downwardly toward the back plate with an inclination at approximately 10.degree. with respect to the horizontal surface. The defrosted water flows down along the outer surface. The outer surface of the top and back plates are provided with a receptacle for collecting water drops.
    Type: Grant
    Filed: November 19, 1979
    Date of Patent: June 2, 1981
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Toshiyuki Oonishi, Takeshi Motoyama, Kiyoshi Hatanaka