Patents by Inventor Kiyoshi Kadomatsu

Kiyoshi Kadomatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8573790
    Abstract: An optical element that includes a substrate having two surfaces, each of the surfaces having a micro-relief structure that includes numerous fine protrusions, and a film that includes one or more layers including a metal layer and that is formed on one of the micro-relief structures.
    Type: Grant
    Filed: October 6, 2010
    Date of Patent: November 5, 2013
    Assignee: Nikon Corporation
    Inventors: Yutaka Hamamura, Kiyoshi Kadomatsu, Yasutoshi Takada, Yoshiro Tani
  • Publication number: 20110069393
    Abstract: An optical element comprising: a substrate having two surfaces each having a micro-relief structure that includes numerous fine protrusions; and a film that includes one or more layers including a metal layer and is formed on one of the micro-relief structure.
    Type: Application
    Filed: October 6, 2010
    Publication date: March 24, 2011
    Applicant: NIKON CORPORATION
    Inventors: Yutaka HAMAMURA, Kiyoshi KADOMATSU, Yasutoshi TAKADA, Yoshiro TANI
  • Patent number: 7704402
    Abstract: An optical element manufacturing method includes: disposing a light-shielding layer (14) that includes at least an Si layer as an uppermost layer, on a substrate (12) used as a base member, forming an optical aperture (14a) at the light-shielding layer (14) and forming a fine recession/projection structure (MR) at a surface of the uppermost layer through dry etching.
    Type: Grant
    Filed: October 24, 2005
    Date of Patent: April 27, 2010
    Assignee: Nikon Corporation
    Inventors: Yutaka Hamamura, Kiyoshi Kadomatsu, Noboru Amemiya
  • Publication number: 20080057273
    Abstract: An optical element manufacturing method includes: disposing a light-shielding layer (14) that includes at least an Si layer as an uppermost layer, on a substrate (12) used as a base member, forming an optical aperture (14a) at the light-shielding layer (14) and forming a fine recession/projection structure (MR) at a surface of the uppermost layer through dry etching.
    Type: Application
    Filed: October 24, 2005
    Publication date: March 6, 2008
    Applicant: NIKON CORPORATION
    Inventors: Yutaka Hamamura, Kiyoshi Kadomatsu, Noboru Amemiya