Patents by Inventor Kiyoshi KATOH

Kiyoshi KATOH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240142676
    Abstract: There is provided a compound represented by General Formula (I), a composition containing the compound represented by General Formula (I), a cured product, an optically anisotropic body, an optical element, and a light guide element. P1 and P2 each independently represent a hydrogen atom, —CN, —NCS, or a polymerizable group. However, at least one of P1 or P2 represents a polymerizable group. Sp1 and Sp2 each independently represent a specific group. A1, A2, A3, and A4 each independently represent an aromatic hydrocarbon ring group or aromatic heterocyclic group which may have a specific substituent. Z1 and Z2 each independently represent a specific linking group or a single bond. B1 represents a group represented by a specific formula. n1 and n2 each independently represent an integer of 0 to 2.
    Type: Application
    Filed: December 21, 2023
    Publication date: May 2, 2024
    Applicant: FUJIFILM Corporation
    Inventors: Yuki FUKUSHIMA, Megumi OKUBO, Keisuke KODAMA, Shunya KATOH, Kiyoshi TAKEUCHI
  • Patent number: 8840821
    Abstract: The exemplary embodiment provides a method of manufacturing a molded article including a component insert-molded in a molding material mixed with solid powder. The method includes an injecting step of injecting the molding material and the solid powder into a molding die, an agitating step of agitating the molding material and the solid powder within the molding die to disperse the solid powder in the molding material, and an embedding step of pressing and embedding the component into the agitated mixture of the molding material and the solid powder while vibrating at least one of the component and the molding die.
    Type: Grant
    Filed: August 3, 2012
    Date of Patent: September 23, 2014
    Assignee: Denso Corporation
    Inventors: Bahman Hossini Soltani, Hiroaki Mizuno, Motohiro Ishibashi, Osamu Nishikawa, Sadamu Shiotsuki, Kiyoshi Katoh
  • Publication number: 20130032964
    Abstract: The exemplary embodiment provides a method of manufacturing a molded article including a component insert-molded in a molding material mixed with solid powder. The method includes an injecting step of injecting the molding material and the solid powder into a molding die, an agitating step of agitating the molding material and the solid powder within the molding die to disperse the solid powder in the molding material, and an embedding step of pressing and embedding the component into the agitated mixture of the molding material and the solid powder while vibrating at least one of the component and the molding die.
    Type: Application
    Filed: August 3, 2012
    Publication date: February 7, 2013
    Applicant: DENSO CORPORATION
    Inventors: Bahman Hossini SOLTANI, Hiroaki MIZUNO, Motohiro ISHIBASHI, Osamu NISHIKAWA, Sadamu SHIOTSUKI, Kiyoshi KATOH