Patents by Inventor Kiyoshi Matsuhashi

Kiyoshi Matsuhashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050218491
    Abstract: The present invention provides a circuit component module having high precision, reliability, and low manufacturing costs, and a method of manufacturing the same. A circuit component module includes an electronic component, wiring lines formed in a predetermined pattern, and a resin layer for covering some of the wiring lines and the electronic component. The wiring lines are made of, for example, Cu, and are composed of first wiring lines and second wiring lines opposite to the first wiring lines with the resin layer interposed therebetween. The first wiring lines and the second wiring lines are electrically connected to the electronic component at predetermined positions.
    Type: Application
    Filed: March 25, 2005
    Publication date: October 6, 2005
    Inventors: Yorihiko Sasaki, Kiyoshi Matsuhashi