Abstract: The present invention provides a circuit component module having high precision, reliability, and low manufacturing costs, and a method of manufacturing the same. A circuit component module includes an electronic component, wiring lines formed in a predetermined pattern, and a resin layer for covering some of the wiring lines and the electronic component. The wiring lines are made of, for example, Cu, and are composed of first wiring lines and second wiring lines opposite to the first wiring lines with the resin layer interposed therebetween. The first wiring lines and the second wiring lines are electrically connected to the electronic component at predetermined positions.